Semiconductor integrated circuit (IC) packaging refers to the process of processing wafer into independent chip according to product model and functional requirements. IC packaging materials mainly include lead frame, packaging substrate, ceramic packaging materials, bonding wires, packaging materials, chip bonding materials, etc., which play an important role in chip support, protection, heat dissipation, insulation, etc.

Asiatic consulting estimates that the global IC packaging material market will reach 20 billion US dollars in 2018. At present, the main suppliers of semiconductor packaging materials in the world include Japan Xinyue chemical, Sumitomo chemical, Kyocera chemical, Hitachi chemical, German BASF, Henkel, American Dow Corning, DuPont and other companies, which occupy the main market share and have a greater market influence. With the completion and operation of Fab plants in China, the market for IC packaging materials has a huge growth space in the future. Due to the rapid growth of China's IC market, the world's leading sealing and testing enterprises, such as Sunmoon, andepend, Changdian technology, Tongfu microelectronics, Huatian technology, etc., are growing rapidly in China, which is also conducive to the application of domestic packaging materials in the future.

Asiatic consulting forecasts that the market scale of China's semiconductor packaging materials will exceed 40 billion yuan in 2019. If China imports a large number of chips in the future, it will promote the strong growth of packaging materials market, and local enterprises will have unprecedented opportunities. In addition to traditional electronic products, with the rise of automotive electronics, AI, VR / AR and Internet of things terminals, the requirements for advanced packaging technology and materials continue to improve, and relevant enterprises will face challenges.

2019 China IC packaging material technology and market forum will be held in Wuxi from June 18 to 19, 2019. The conference will discuss China's IC and IC packaging industry policy trends, global and Chinese IC packaging market status and outlook, semiconductor packaging technology and materials progress and outlook, China's IC packaging materials and technology, equipment localization, China's IC packaging materials supply and demand situation and future market outlook.

Notice of relevant matters is as follows:

1、 Seminar topics:
1. China's IC and IC sealing industry policy trend
2. Supply and demand of IC and IC packaging materials in the world and China
3. Progress and trend of overseas advanced packaging technology and materials
4. Localization of IC packaging materials, technology and equipment in China
5. High end process processor packaging challenges and Solutions
6. Post Moore's law and advanced packaging
7. Packaging materials and technology distribution of downstream products
8. R & D Progress of 2.5D and 3D fan out packaging technology
9. Other advanced packaging materials and technologies
10. Integration trend of packaging and wafer manufacturing in the future
11. Industrial visit & business visit

2、 Time: June 18-19, 2019
3、 Location: Wuxi
4、 Registration time: 16:00-21:00, June 17, 2019
5、 For registration fee and receipt, please contact:
Manager Chen: 021-68726606-109 / 13701609248 (wechat same number) or Joanna chen@
.25110;.28857;.20987;.; -21517;

Conference fee: 3200 yuan / person, team registration (same company ≥ 3 people) 2900 yuan / person; foreign guests need another 2000 yuan English service fee note: the fee on the day of the meeting includes: lunch, tea break, dinner, Chinese Conference information, venue tickets, etc., excluding accommodation, accommodation fee shall be directly settled with the hotel before check-out; English service fee includes: English conference information on the day of the meeting, simultaneous interpretation fee, etc

Advertising expenses
There are different packing plans. Please contact manager Chen for details
The measure of area: 500m2

• Truename:Manager Chen
• Mobile:13701609248
• E-mail:Joanna_chen@chemweekly.com
• QQ:410192892
• Address:Room 1702, No. 1122, Xinjinqiao Road, Pudong New Area, Shanghai

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