2027 Shenzhen International Silicon Carbide Industry Chain Expo

Shenzhen International Silicon Carbide Full Industrial Chain Exposition2027

——Xinqi Wide Bandgap · Carbon Silicon Empowered New Energy——

Basic Information

Date: April 9-11, 2027

Location: Shenzhen Convention and Exhibition Center

Exhibition Preface

The third-generation wide bandgap semiconductors, represented by silicon carbide (SiC) and gallium nitride, are the core new materials supporting new energy vehicles, energy storage photovoltaics, high-voltage fast charging, industrial power supplies, and computing power supply. They are also the key track for China's new quality productivity and semiconductor independent supply chain construction. With the popularization of 800V vehicle platforms, the explosion of industrial and commercial energy storage, and the large-scale landing of high-power charging piles, the domestic silicon carbide industry has ushered in a high-speed cycle of industrialization and localization, fully releasing the demand for the entire chain from crystal growth preparation, wafer processing, chip manufacturing to system applications.

This Shenzhen International Silicon Carbide Industry Chain Expo aims to create a professional trading platform in the vertical field of silicon carbide in China, covering upstream raw materials, single crystal substrates, epitaxial wafers, midstream chip devices, advanced packaging, production equipment consumables, downstream power modules and terminal system solutions. The exhibition gathers leading enterprises, specialized and new manufacturers, research institutes, vehicle manufacturers, energy storage integrators, power supply companies, and channel investors. It adopts a five in one model of exhibition display+industry summit+new product release+precise supply and demand docking+technology roadshow, connecting upstream and downstream supply chains, helping enterprises promote their brands, obtain orders, lay out channels, and transform industry university research achievements, jointly seizing the billion dollar industrial dividend of silicon carbide.

Exhibition Overview

Exhibition theme: Deepening the localization of silicon carbide and empowering the full scenario application of new energy

Exhibition positioning: Third generation semiconductor silicon carbide vertical professional exhibition, B-end precision procurement docking platform

Core advantages

✅ Complete coverage of the entire chain: from powder raw materials, hot field graphite parts, 6-8 inch substrate epitaxy, to SiC devices, AMB ceramic substrates, packaging equipment, and one-stop display of new energy terminal solutions

✅ Precise and high-quality buyers: new energy vehicle companies, energy storage system manufacturers, photovoltaic inverter companies, charging pile manufacturers, industrial power supplies, data center power supplies, semiconductor foundries, packaging and testing factories, agents, engineering integrators

✅ High end industry supporting activities: Silicon Carbide Technology Summit Forum, Automotive SiC Device Seminar, Supply Chain Supply and Demand Matching Meeting, Domestic Equipment and Material Achievement Release Conference

✅ Efficient Business Conversion: Facing the responsible persons of engineering procurement, R&D selection, and supply chain procurement, achieving integrated implementation of display, negotiation, and signing

Audience buyer group

Manufacturing end customers

New energy vehicle companies, energy storage system integrators, photovoltaic inverter factories, charging station equipment suppliers, industrial power sources UPS、 Servo drive manufacturers, computing power server power supply companies

Semiconductor industry chain customers

Wafer fabs, packaging and testing companies, IDM companies for power devices, equipment and material procurement, and R&D engineering teams

Commercial channels

Agents, distributors, international traders, solution integration engineers

Government and enterprise research institutions

University laboratories, research institutes, high-tech industrial parks, industry associations, investment institutions

Exhibition value

1. Brand value: Concentrate on showcasing domestically produced new products and technological strength, quickly establishing industry brand influence

2. Customer value acquisition: Facing downstream terminal procurement and R&D selection leaders across the country, mining direct orders

3. Channel value: Connect with national agents and overseas partners, expand sales network

4. Technical exchange: Face to face communication with peers, experts, and vehicle customers to grasp the latest technological routes

5. Supply chain cooperation: Search for upstream material suppliers and downstream complete machine customers, and establish industrial ecological cooperation

Schedule arrangement

Registration and Exhibition:

April 7-8, 2027 AM8:30-PM19:30

Exhibition time:

April 9, 2027 AM9:30-PM16:45

April 10, 2027 AM9:30-PM16:45

April 11, 2027 AM9:30-PM16:45

Scope of Exhibition

1、 Raw materials, single crystal substrates, epitaxial manufacturing

High purity silicon carbide powder, black/green silicon carbide micro powder; Seed crystal, conductive/semi insulating 6/8-inch SiC substrate; Homogeneous epitaxial wafers, N/P-type epitaxial wafers; PVT crystal growth furnace, graphite thermal field, crucible, coating consumables; Cutting, grinding, polishing, and cleaning equipment; Process consumables such as special electronic gases, diamond wires, polishing fluids, etc.

2、 Chips, power devices, and modules

SiC SBD Schottky diode, SiC MOSFET (planar/trench type) JFET； Single tube discrete devices, all silicon carbide power modules, hybrid power modules; RF SiC devices; Chip design, wafer foundry, ion implantation, high-temperature annealing, etching and coating process solutions.

3、 Advanced packaging, heat dissipation materials, and packaging testing equipment

AMB/DBC/DPC ceramic heat dissipation substrate, AlSiC water-cooled substrate; Silver sintered materials, solder pads, bonding wires, and potting adhesives; Solid crystal machine, vacuum eutectic furnace, plasma cleaning, bonding equipment; X-RAY scanning, static/dynamic electrical performance testing bench, reliability aging, power cycle detection equipment.

4、 Engineering Structure Silicon Carbide Ceramics

Reaction sintering, pressureless sintering, recrystallization, CVD SiC precision ceramic parts; Semiconductor suction cup, wear-resistant nozzle, sealing ring, high-temperature resistant kiln furniture, 3D printed silicon carbide components.

Contact Us

Contact: Mr. Zhang 150-0190-9485 (same as WeChat)

2027 Shenzhen International Silicon Carbide Industry Chain Expo

• Contact:Mr. Zhang
• Mobile:13636604883
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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