2027 International Semiconductor and Integrated Circuit Industry Exhibition

Time: 2027June 2nd of the year4The day-26Location: Beijing Shougang International Convention and Exhibition Center

1、 Exhibition Background

The semiconductor and integrated circuit industry is the core cornerstone of the digital information industry, a strategic core industry that empowers artificial intelligence, high-end manufacturing, and the iteration and upgrading of new generation information technology. It is related to national industrial security and independent and controllable technology. Driven by new quality productivity, China's semiconductor industry is currently in a critical window period of independent breakthroughs, system restructuring, and large-scale substitution. The country continues to introduce policies to support research and development, focusing on key areas such as core equipment, critical materials, core chips, industrial software, etc., to promote the integration of the circuit industry chain to make up for shortcomings, strengths and weaknesses, and optimize the ecosystem.

AI computing, new energy vehicles, aerospace, industrial Internet and other emerging fields are booming, and continue to drive market demand for high-end chips, power semiconductors, third-generation semiconductors and other products. The scale of domestic industries is steadily growing, and domestic substitution continues to accelerate. However, bottlenecks in high-end equipment and materials, technological barriers, poor connection between industry, academia, research and application, and difficulties in supply and demand matching still need to be solved urgently. It is urgent for national platforms to connect the industrial chain, supply chain, innovation chain, and capital chain, and accelerate the industrialization of innovative achievements.

In this context, the 2027 International Semiconductor and Integrated Circuit Industry Exhibition will be held from June 24th to 26th, 2027 at the Beijing Shougang Convention and Exhibition Center, along with the Artificial Intelligence and Embodied Robot Innovation Conference. The exhibition relies on the advantages of Beijing's scientific and technological innovation resources to create a domestic and global platform for semiconductor industry exchange and cooperation, covering the entire semiconductor industry chain. It integrates multiple functions such as display and release, academic exchange, supply and demand matching, achievement transformation, and capital docking, bringing together leading enterprises, specialized and innovative enterprises, research institutes, application ends, and investment institutions to promote industrial collaborative innovation.

Exhibition Scope

1. Semiconductor core production equipment: wafer manufacturing equipment (lithography machine, etching machine, thin film deposition equipment PVD/CVD/ALD, ion implantation machine, wafer cleaning equipment, oxidation diffusion equipment, coating and development equipment, annealing equipment, CMP polishing equipment, wafer thinning equipment); Packaging process equipment (wafer cutting machine, solidification machine, bonding machine, ball planting machine, plastic packaging machine, rib cutting and forming equipment, laser marking machine, packaging and bonding, vacuum packaging equipment); Testing and measurement equipment (wafer testing machine, finished product testing machine, probe station, testing sorting machine, AOI optical inspection, electron beam inspection, film thickness testing, flatness testing, defect detection, reliability testing equipment); Auxiliary supporting equipment (semiconductor automation transmission, vacuum equipment, ultra clean equipment, precision machining, temperature control and dehumidification equipment, intelligent manufacturing production line equipment).

2. Semiconductor key raw materials and auxiliary materials: substrate substrates (8/12/18 inch silicon wafers, silicon carbide SiC, gallium nitride GaN, sapphire, gallium arsenide, indium phosphide, germanium wafers and various compound semiconductors, special insulation substrates); Process materials (photoresist and supporting reagents, special electronic gases, high-purity target materials, polishing solution/polishing pad, wet electronic chemicals, developing solution, stripping solution, etching solution, high-purity reagents, dielectric materials, insulation slurry); Packaging supporting materials (epoxy resin, conductive adhesive, solder balls, lead frame, carrier tape, protective film, packaging filler); Functional auxiliary materials (chip heat dissipation and thermal conductivity materials, electromagnetic shielding materials, anti-oxidation materials, precision films, semiconductor specific consumables).

3. EDA software, semiconductor IP, and chip design services: EDA full process tools (chip architecture design, circuit simulation, logic synthesis, layout design, physical verification, timing analysis, testing and verification software, domestic full process EDA solutions); Semiconductor IP cores (processor IP, GPU/AI IP, interface IP, RF IP, power management IP, storage IP, automotive grade IP, various software and hardware core IP authorization and customization services); Chip design customization services (chip architecture development, front-end design, back-end layout and wiring, chip redesign and optimization, customized development, chip mounting solutions, industry university research design cooperation).

4. Wafer manufacturing, advanced processes, and foundry services: wafer foundry production (5nm/7nm/14nm advanced processes, 28nm/40nm/90nm mature processes, power device, analog, high-voltage, RF specific specialty process foundry); Wafer products and processing services (polishing wafers, epitaxial wafers, ultra-thin wafers, structured customized wafers, wafer coating, modification, annealing, repair, cutting and outsourcing, and other process processing services).

5. Advanced Packaging Testing and Certification: Advanced Packaging Technologies and Products (DIP, SOP, SOT, QFP Traditional Packaging); BGA, CSP, FC, WLCSP, TSV, SiP, 2.5D/3D stacking, Chiplet chip advanced packaging; Vehicle standard high reliability packaging, micro high-density packaging, power module packaging); Testing and inspection services (wafer testing, finished electrical testing, high and low temperature environment testing, aging testing, withstand voltage testing, reliability life testing, EMC electromagnetic compatibility testing); Certification analysis services (AEC-Q100 automotive certification, industrial/military/aerospace reliability certification, chip failure analysis, yield optimization, third-party quality inspection certification services).

6. Core semiconductor devices and chip products: general logic and main control chips (CPU, MCU, MPU, FPGA/CPLD, logic devices, DRAM/Flash/ROM storage chips); Computing power and high-end specialized chips (AI training/inference chips GPU、NPU、 Edge computing chip, server specific chip, AI computing module); Simulation and power chip (LDO, DC-DC, PMIC power management chip, operational amplifier, comparator, voltage regulator chip, charging management chip); RF and communication chips (RF transceiver, Bluetooth, WiFi, 5G/6G communication, signal amplification, filtering, antenna driver chips); Power semiconductor devices (MOSFET, IGBT, thyristor, fast recovery diode, high and low voltage power devices, SiC/GaN third-generation semiconductor devices, high-frequency/vehicle/energy storage power modules); Featured specialty semiconductors (MEMS sensors, optoelectronic devices, laser/infrared chips, high reliability specialty integrated circuits for military, aerospace, industrial control, etc.).

7. Terminal application scenario solution: artificial intelligence and computing power terminals (AI servers, computing power modules, edge intelligent devices, AI terminal chip application solutions); Automotive Electronics and Intelligent Driving (Vehicle Control System, Vehicle Perception Chip, Autonomous Driving Domain Controller, Vehicle Power Supply, Vehicle Power Devices, Vehicle Electronic Solutions); Industrial and high-end manufacturing (industrial control chips, servo drive modules, industrial sensors, intelligent manufacturing accessories, robot control chips and power modules); High end specialized fields (aerospace, rail transportation, military equipment, energy storage, photovoltaic and wind power supporting semiconductor devices and solutions); Consumer and Livelihood Electronics (Smart Home, Wearable Devices, Consumer Electronics, IoT Terminal Supporting Chips and Devices).

8. Comprehensive industrial supporting services: chip research and development outsourcing, technology achievement transformation, industry university research docking, intellectual property services, industrial investment and financing, supply chain trade, warehousing and logistics, talent training, industry consulting, media platform, intelligent manufacturing digital solutions, and full industry chain supporting system services.

• Company:Zhongsheng International Exhibition Co., Ltd
• Contact:Li Lei
• Mobile:17153366999
• E-mail:bdtjcdl@163.com
• Address:Building 27, Jinhai City, Gu'an County, Langfang City, Hebei Province

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