2027 Shenzhen High Speed Transmission Copper Cable and Connection Component Innovation Technology Exhibition

2027 Shenzhen High-Speed Transmission Copper Cable and Connectivity Component Innovation Technology Exhibition

I/O connector exhibition, high-speed interconnection conference, high-speed copper cable exhibition

Date: April 9-11, 2027 Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction:
Under the current pattern of computing power industry, the industry has formed a development consensus of "simultaneous development of light and copper, and complementary scenarios". Compared to optical interconnect solutions, high-speed copper cables have become the optimal solution for short-range interconnection of AI server cabinets, GPU clusters, and switches due to their core advantages of zero power consumption, low latency, low cost, and easy deployment. A single high-end AI server requires thousands of high-speed copper cable components, and market demand continues to surge. Data shows that the global market size of high-speed DAC and AEC copper cables continues to rise, with a compound annual growth rate of over 22%. 112G high-speed products are being scaled up, 224G and 1.6T high-end technologies are accelerating commercialization, and high-speed transmission copper cables and connecting components have become the core "data artery" of computing infrastructure.

With the rapid iteration of AI big models, intelligent computing centers, and high-performance computing industries, data transmission speed, stability, and energy consumption costs have become the core pain points for upgrading computing infrastructure, and the short distance high-speed interconnection track is experiencing explosive growth. Based on the advantages of the world-class electronic information and computing power industry cluster in the Greater Bay Area, the 2027 Shenzhen High speed Transmission Copper Cable and Connection Component Innovation Technology Exhibition will kick off with a heavy focus on the vertical field of high-speed copper cables and supporting connection components, creating a specialized industry platform that integrates technology display, product trading, academic discussions, and industry docking, and promoting the localization, high-end, and innovative development of the domestic high-speed interconnection industry.

Relying on the core advantages of industries in Shenzhen and the Greater Bay Area, the exhibition gathers domestic and foreign leading cable, connector, and computing hardware enterprises, accurately linking AI server manufacturers, intelligent computing center operators, optical module enterprises, communication equipment manufacturers, research institutes, and upstream and downstream procurement and research and development teams. During the exhibition, multiple high-end technology forums will be held to conduct in-depth discussions on core topics such as the iteration of 224G/1.6T high-speed copper cable technology, selection of short-range optoelectronic interconnection scenarios, optimization of high-speed connector signal integrity, and industrial localization substitution. The aim is to break through industry technology bottlenecks and build an integrated communication bridge between industry, academia, research, and application.

Scope of exhibits:
1. High speed transmission copper cable:

OSFP/OSFP-XD, QSFP-DD, QSFP112, SFP56 series; DAC passive direct copper cable; ACC/AEC active high-speed copper cable; Breakout Splitting DAC; Twin Ax dual axis differential shielded cable; PCIe/CXL high-speed copper cable; High frequency RF coaxial copper cable; High speed differential copper cables, backplane copper cables, and high-speed I/O cable components inside the chassis;

2. High speed connection components:

High speed backplane connectors, board to board/mezzanine high-speed connectors, MCIO, OSFP, QSFP-DD, SFP series high-speed I/O connectors, optoelectronic hybrid connectors, wire to board high-speed differential connectors, PCIe/CXL card edge connectors; High speed terminals and shielding components; FPC/FPC flexible high-speed interconnect components; VPX military high-speed interconnect components; RF connectors, connectors, high-density interconnect components, etc;

3. Finished high-speed cable components:

DAC/AOC cable components, MPO fiber array components, high-speed differential cable bundle components, RF test cable components, vehicle/military special high-speed cable components, etc;

4. Supporting materials, processing and testing equipment:

Low Dk/Df high-speed insulation materials, shielding materials, cable sheath materials, conductor materials, copper materials, etc; High speed cable cutting, twisting/extrusion/stripping/crimping/welding/assembly/dispensing/injection molding automation equipment, coding and marking technology, cable processing equipment, etc; Signal integrity testing instruments, impedance/return loss/insertion loss testing equipment, EMC electromagnetic compatibility testing system, high-speed simulation software, thermal management and cooling components, etc;

5. Target industry:

High speed cable&DAC/AEC component manufacturing enterprise; Connector manufacturing factory; Manufacturer of wire harness automation equipment; Cable material suppliers; Server/computing cluster hardware vendors; R&D and process engineers; Head of production line procurement and factory technical renovation; Testing laboratory, etc;

AI servers, IT equipment vendors, intelligent computing data centers, 5G/6G communication, industrial RF and microwave, automotive electronics, industrial healthcare, cloud computing, IoT, communication base stations, industrial automation, aerospace, satellite communication, military, network cabling, security, rail transit, new energy, vehicle networking, robots, etc;

█ Parallel Forum Direction:

1. High speed Cable Connection Technology Conference

2. AI Server&Data Center Power Conference

3. Seminar on High Speed PCB and Electronic Circuits

4. High speed optical communication testing technology conference

5. Automotive Electronics and Electromagnetic Compatibility Technology Conference

6. Forum on Signal Integrity and High Speed Testing and Measurement Technology

7. AI Data Center High Speed Interconnection Architecture Conference

8. AI Cabinet Short Distance Optoelectronic Interconnection Technology Seminar

9. Forum topics and convener solicitation

The forum topic setting adopts the principle of scientists' free application and comprehensive determination by the forum academic committee. Each topic is convened by 1-3 experts and is responsible for organizing academic reports on each topic. The applying unit can also independently formulate a distinctive forum theme based on its own advantages;

Welcome experts from various fields to provide thematic suggestions. The special application/suggestion period is from December 2027 to February 28, 2027. Submit the applicant/proposer's name, topic name, and other information to before February 28, 2027;

Special forums must strictly follow the overall schedule of the conference. The forum's holding time, venue layout, guest reception, and other related matters must be determined in advance through consultation with the organizing committee and cannot be changed without authorization;

If the organizing unit fails to complete the forum preparation work as required by the agreement or engages in illegal operations, the organizing committee of the conference has the right to cancel its organizational qualification, and the relevant responsibilities arising therefrom shall be borne by the organizing unit.

Exhibition matters
1. Exhibitors shall fill in the "Exhibition Contract Form" in detail and affix their official seal, and mail or fax it to the organizing committee;
2. The organizing committee has received the confirmation application form. Exhibitors must transfer 50% or the full amount of the exhibition fee to the organizing committee's account within 5 working days, and fax the remittance voucher to the organizing committee for verification. Otherwise, the reserved booth will not be retained.
3. The booth arrangement is based on the principle of "first come, first paid, first arranged", and the organizing committee has the right to adjust a small number of booths;
4. The transportation of exhibits, exhibition reception, accommodation and other matters will be separately sent by the organizing committee in the form of an "Exhibitor Handbook" one month before the event.

Exhibition Consultation

Hotline: 021-52237201
Contact: Mr. Zhang 13162771109

Scope of exhibits:
1. High speed transmission copper cable:

OSFP/OSFP-XD, QSFP-DD, QSFP112, SFP56 series; DAC passive direct copper cable; ACC/AEC active high-speed copper cable; Breakout Splitting DAC; Twin Ax dual axis differential shielded cable; PCIe/CXL high-speed copper cable; High frequency RF coaxial copper cable; High speed differential copper cables, backplane copper cables, and high-speed I/O cable components inside the chassis;

2. High speed connection components:

High speed backplane connectors, board to board/mezzanine high-speed connectors, MCIO, OSFP, QSFP-DD, SFP series high-speed I/O connectors, optoelectronic hybrid connectors, wire to board high-speed differential connectors, PCIe/CXL card edge connectors; High speed terminals and shielding components; FPC/FPC flexible high-speed interconnect components; VPX military high-speed interconnect components; RF connectors, connectors, high-density interconnect components, etc;

3. Finished high-speed cable components:

DAC/AOC cable components, MPO fiber array components, high-speed differential cable bundle components, RF test cable components, vehicle/military special high-speed cable components, etc;

4. Supporting materials, processing and testing equipment:

Low Dk/Df high-speed insulation materials, shielding materials, cable sheath materials, conductor materials, copper materials, etc; High speed cable cutting, twisting/extrusion/stripping/crimping/welding/assembly/dispensing/injection molding automation equipment, coding and marking technology, cable processing equipment, etc; Signal integrity testing instruments, impedance/return loss/insertion loss testing equipment, EMC electromagnetic compatibility testing system, high-speed simulation software, thermal management and cooling components, etc;

5. Target industry:

High speed cable&DAC/AEC component manufacturing enterprise; Connector manufacturing factory; Manufacturer of wire harness automation equipment; Cable material suppliers; Server/computing cluster hardware vendors; R&D and process engineers; Head of production line procurement and factory technical renovation; Testing laboratory, etc;

AI servers, IT equipment vendors, intelligent computing data centers, 5G/6G communication, industrial RF and microwave, automotive electronics, industrial healthcare, cloud computing, IoT, communication base stations, industrial automation, aerospace, satellite communication, military, network cabling, security, rail transit, new energy, vehicle networking, robots, etc;

• Contact:Mr. Zhang
• Mobile:13162771109
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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