Currently, global digital transformation is accelerating, and semiconductors, as the "industrial heart" of the digital age, are the core cornerstone supporting strategic areas such as 5G, artificial intelligence, new energy vehicles, and advanced computing. They are also the key to cultivating new quality productivity and promoting industrial innovation for the country. As a strategic and fundamental industry of the country, semiconductors have received multiple policy key supports such as "Made in China 2025" and "14th Five Year Plan". The global market is steadily expanding and the industrial pattern is accelerating restructuring, ushering in significant development opportunities.

The 2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition will be held from May 18-20, 2027 at the Binhu International Convention and Exhibition Center in Hefei. The exhibition continues the core theme of "Winning the Chip Era, Co creating the Future of Chips", based on the industrial advantages of Hefei as the "IC Capital of China", relying on the development strategy dividends of the Yangtze River Delta integration, focusing on the innovation and collaboration of the entire semiconductor industry chain, and striving to create an international high-end platform that integrates technology display, business docking, academic exchange, and ecological co construction, helping domestic and foreign enterprises deepen cooperation, share opportunities, and jointly draw a new blueprint for the development of the global semiconductor industry.

The 2027 exhibition will further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply and demand matching, cross-border cooperation and talent exchange, helping domestic and foreign enterprises seize industry opportunities, deepen collaborative innovation, work together to build a new ecosystem of semiconductor industry, and promote the high-quality development of the global semiconductor industry.

Review of the Previous Session
The previous exhibition brought together Hefei Xianwei Semiconductor, Yiyue Technology, Yita Semiconductor, Hefei Fuxian Automation, Boiling Point Sealing, Hefei Juque, Horkheimer, Hikvision, Huace Testing, Hefei Zhizhen Precision, Pioneer Group, Hefei Yuchi, Jianxing Technology, Apast, Sanying Precision Control, Futai Purification, Gasipak, Anhui Renhe, Hefei Lingwei, Linstron, Zhangjiagang Integrated Circuit Industry Promotion Center, Jiangsu Third Generation Semiconductor Research Institute, MacAudie, Xihe Superconductor, Shanghai Yifan, Lixin Electronics, Bengbu Danpu, Wanweikelin, Weikete, Bit Intelligent Computing, Jinshexin, Weimai Core Materials, Nanjing Juqiao, Micaro Well, Jiangsu Anruisen, Yingrui High tech, Yingruizhi, Anhui Xiangyu, Bojin Chemical, Wanrui Cold Electric, Yinguan Semiconductor, Shanghai Yifan, Shanghai Aerospace Yuda 300 well-known domestic and foreign enterprises, including Shanghai Micro Spectrum Testing, Youlide, Anhui Benfeng, Nongtai, Xinhongjun, Keweixince, Anhui Qihui Semiconductor, Hefei Zhichang Optoelectronics, Hefei Zhire Equipment, Anhui Yingchuang Precision, Anhui Huayuan Micro, Haishida, Huidechuang, etc., showcased cutting-edge technologies, core equipment, and innovative solutions, effectively promoting the deep integration of the industrial chain and supply chain.

IC Design/Chip Zone: EDA, IP Design, Embedded Software, Digital Circuit Design, Analog and Mixed Signal Circuit Design, Integrated Circuit Layout Design, Artificial Intelligence Chips, Power Management Chips, IoT Chips, 5G Communication Chips, Automotive Electronic Chips, Security Control Chips, Digital Analog Hybrid Communication RF Chips, Storage Chips, Display Driver Chips, etc;

Integrated Circuit Manufacturing Zone: Wafer Manufacturing Plant, Wafer Outsourcing Plant, Analog Integrated Circuit, Digital Integrated Circuit, and Hybrid Integrated Circuit Manufacturing;

Material Zone: Silicon wafers, silicon chips, monocrystalline silicon, silicon wafers, photoresist, chemical reagents, electronic gases, polishing materials, photoresist materials, metal target materials, compound semiconductor materials, etc;

Third Generation Semiconductor Zone: Materials and Application Technologies such as Silicon Carbide (SiC), Gallium Nitride (GaN), Zinc Oxide (ZnO), Diamond, etc;

Equipment Zone: Semiconductor wafer equipment, semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, etc;

◆ Packaging testing and measurement: packaging and testing entire factories, packaging and testing process factories, testing probe stations, testing machines, sorting machines, packaging equipment, packaging substrates, lead frame bonding wires, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

◆ Electronic Components Zone: Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrate substrates, electronic functional process special materials, electronic adhesive (tape) components, electronic chemical materials and parts, microwave components, microwave materials for communication machines, microwave RF testing instruments, specialized software, etc;

New displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays, application terminal displays, flexible displays and materials and equipment, etc;

Big Data and Artificial Intelligence: Big Data and Artificial Intelligence, Big Data and Intelligent Manufacturing, Big Data and Smart Cities, Big Data and Health and Medical Big Data and Financial Innovation Big Data and E-commerce, etc;

◆ Electronic intelligent manufacturing: SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

Smart Factory: Factory automation and robots, AGV and smart warehousing, 3D printing, drive technology, overall solutions, precision automation/robot components and supporting products, software and development, etc.

PCB and circuit carrier manufacturing: various types of circuit boards, automated processing equipment for circuit boards, copper strips, copper foils, etc.

◆ Connector and wire harness processing: various types of connectors, plugs, socket switches, wire harness cables, and processing equipment.

◆ Electronic and chemical materials: PCB substrates and auxiliary materials, electronic fine chemical materials, optoelectronic materials, electronic specific metal materials, etc.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Contact:Manager Yang
• E-mail:316183212@qq.com
• Address:No. 735, Jiuduhe Town, Huairou District, Beijing

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870