On September 9-11, 2026, the 23rd Elexcon Shenzhen International Electronics Exhibition and Embedded Exhibition, hosted by Bowen Creative Exhibition, will be held simultaneously with CIOE China Light Expo and IICIE International Integrated Circuit Innovation Expo at the Shenzhen International Convention and Exhibition Center (Bao'an). Three exhibition linkage, with a total scale of 340000 square meters, jointly creating the preferred platform for the release and promotion of new technologies and products.

With the power of unity, embark on the journey of innovation
This year's three exhibition linkage will deeply integrate industrial resources to achieve complementary advantages, fully release aggregation effects, break down industrial barriers, promote the ecological breakdown of the electronic embedded industry and the optoelectronic industry, accelerate technological integration and product innovation, and create more cooperation opportunities for upstream and downstream enterprises in the industrial chain.

Hardcore data support, showcasing global influence

Gathering over 5000 exhibiting companies: covering core enterprises in the entire industry chain of electronics, embedded systems, and optical chips, the exhibit matrix is rich and diverse, showcasing the full picture of industry development from basic components to terminal solutions, from cutting-edge technology prototypes to practical application products.

Attracting over 240000+professional visitors: including 7000+overseas visitors, covering 97 countries and regions, the audience covers seven core application areas including consumer electronics, automotive, communication, data centers, healthcare, industry, and the Internet of Things, including key groups such as corporate executives, R&D engineers, procurement leaders, and technical decision-makers, providing exhibitors with precise business opportunities.

100+Forum Activities at the Same Time: Inviting over 1000 top industry speech experts, covering cutting-edge hot topics in AI, electronics and embedded systems, and optoelectronic communication, to create an industry intellectual feast and help enterprises grasp technological trends and market opportunities.

As an important professional event focusing on electronic and embedded technology in Shenzhen and southern China, elexcon 2026 will be themed "All for AI, All for Green". This exhibition will focus on showcasing core areas such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components and modules and solutions. The audience will cover engineers, developers, procurement managers, and technical decision-makers from consumer electronics, automotive, communication, data centers, medical electronics, industrial control, and the Internet of Things. Elexcon is committed to creating a one-stop technology exchange, learning, and selection platform for engineers and technical decision-makers, helping enterprises grasp industry trends and connect with high-quality cooperation resources.

As the core professional exhibition area in the linkage of the three exhibitions, the "Electronics and Embedded Exhibition Hall 17" of the 23rd Shenzhen International Electronics and Embedded Exhibition will focus on showcasing chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components, and module and system solutions, creating a one-stop learning and selection platform for engineers and technical decision-makers.

In the embedded section, the scope of exhibits will cover:
Embedded processor (MCU/MPU/SoC/FPGA/DSP) | Embedded AI and edge computing | Storage | Embedded module | Development board | Embedded operating system | Debugging and simulation tools | Wired and wireless communication module | Sensor and actuator | Power management IC | AIoT overall solution

In the electronic components section, the scope of exhibits will cover:
Semiconductor IC | Power Supply | Power Semiconductor | Testing and Measurement | High speed Connection Technology and Connectors | Wiring Harness and Cable Components | Relays and Switches | Passive Devices (Capacitors/Inductors/Crystals) | MEMS and Sensors | Automotive Electronics | Thermal Management | SiP and Advanced Packaging

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:400-902-9920
• Contact:Manager Feng
• Fax:0755-8831 2533
• E-mail:523138820@qq.com
• Address:Shenzhen Nanshan District High tech Park

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870