The 2026 IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo), with the theme of "Cross border Integration, Full Chain Collaboration, and Building a Characteristic Chip Ecology Together", is committed to creating a high-end exhibition platform for integrated circuit full industry chain collaborative innovation and exchange cooperation with scale effects, application orientation, and product core.
The exhibition presents a full chain ecological layout of IC products and applications, wafer manufacturing, packaging and testing, core equipment, key materials, and core components. Here, you can not only deeply connect with semiconductor core enterprises such as IDM, Fabless, Fab, OSAT, but also face a wide audience in fields such as artificial intelligence, consumer electronics, automotive, communication and computing, display, optoelectronics, and new energy, providing one-stop and efficient empowerment for downstream key areas. Further promote the integrated development of the integrated circuit industry and related industries, help enhance the core competitiveness of the integrated circuit industry, and support the high-quality development of China's integrated circuit industry.

The exhibition will be held simultaneously and in the same location as the 27th China International Optoelectronics Expo (CIOE), building a "super exhibition platform" covering the two core fields of semiconductor and optoelectronics, and showcasing the world's top products and cutting-edge technological achievements in the industry. The CIOE China Light Expo showcases optical/electrical chips, optical modules, optical lenses, and modules AR&VR、 Key core technologies such as sensors and SEMI-E form an interdependent upstream and downstream relationship.
Conference Activities
During the exhibition, over 20 conferences and events will be held, focusing on topics related to chips and chip design, wafer manufacturing and advanced packaging, compound semiconductors and power devices, intelligent manufacturing, etc., to explore innovation and development in the integrated circuit industry, and showcase the technology and achievements of the integrated circuit industry. Through face-to-face communication and technical discussions, the industry can have a clearer understanding of the future market size and technological direction, providing key references for enterprise strategic layout.

List of Partial Visiting Enterprises
Wafer manufacturing/foundry and packaging testing
Samsung Semiconductor, SK Hynix, SMIC, Huahong Semiconductor, CR Microelectronics, Changjiang Storage, Silan Microelectronics, Huali Microelectronics, Yuexin, Zengxin, Wuhan Xinxin, Gexin, Pengxin Microelectronics, Pengxin Xu, Runpeng Semiconductor, Changdian Technology, Tongfu Microelectronics, Huatian Technology, Zhilu Fengce, Shenzhen Technology, Tianxin Interconnect, Tiancheng Advanced;
Chip and chip design
Microsoft, Qualcomm, Nvidia, Broadcom, HiSilicon Semiconductor, Suzhou Guoxin, Ziguang Spreadtrum, Fudan Microelectronics, Zhaoyi Innovation, Beijing Junzheng, Huiding Technology, MediaTek, Shanghai Beiling, STMicroelectronics, NXP, Infineon, Cambrian, Horizon Robotics, New Thinking Technology, Huada Jiutian, Jiangbolong, Lingdong Microelectronics, Jichuang North, Geke Microelectronics, ZTE Microelectronics, and China Resources Microelectronics;
semiconductor equipment
Northern Huachuang, Zhongwei Company, Jingsheng Electromechanical, Shengmei Semiconductor, Yitang Technology, Changchuan Technology, Tuojing Technology, Huahai Qingke, Zhichun Technology, Jingce Electronics, Jingyi Equipment, Xinyuan Microelectronics, Zhongke Feice, Tianzhun Technology, Huafeng Measurement and Control, Silicon Electric Semiconductor, Kaishitong, Xinkailai;
industry
Lixun Precision, Dazu Laser, Dazu CNC, Yaskawa Electric, Zhongtu Instrument, Megmeet, Yuejiang Technology, Jiejiawei, Estun, Gugao Technology, Purdue Technology, Jiateng Instrument, Texas Instruments, Omron Automation, Dewo, Yudian Automation, Lansi Technology, and Huawei Machinery.

Wafer Manufacturing: Foundry, Wafer Manufacturing Equipment, Wafer Manufacturing Measurement Equipment, Substrate/Manufacturing Materials and Consumables, Core Components Exhibition Area
Compound semiconductors and power devices: power devices and modules, materials and substrates, wafer manufacturing equipment, packaging and testing equipment, core components, automotive chips, and power semiconductor display area
IC design and packaging testing: IC chips, design/electronic design, automation services (EDA&IP), packaging testing services (OSAT), packaging equipment/testing equipment, packaging materials and consumables, core components, AI computing power and application display area, advanced packaging display area
Detailed display scope
Chips: AI chips, communication chips, storage chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc.
Design/Manufacturing Services: IP/EDA electronic design automation, fabless semiconductor, wafer manufacturing foundry, packaging testing OSAT, testing services, etc.
Wide bandgap semiconductors and power devices: silicon carbide, gallium nitride, diamond, gallium oxide, cubic boron nitride, aluminum nitride, graphite and carbon materials, power devices, etc.
Semiconductor equipment: manufacturing equipment, packaging equipment, testing and inspection equipment, assembly equipment, environmental treatment equipment, factory automation/robots, etc.
Semiconductor materials: matrix materials, manufacturing materials, packaging materials, etc.
Semiconductor core components: sealing rings, precision bearings, metal parts, quartz/silicon/SiC/ceramic parts, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor operation control, servo motors, pumps/semiconductor valves/pressure, electrostatic suction cups, flow meters, machine vision, sensors, linear motors, etc.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:400-9029-920
• Contact:Manager Ye
• E-mail:Info.Semi-e@informa.com
• Address:605 East Building, Haide Sandao Coast Building, Nanshan District, Shenzhen

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