- Industry: Industrial / Mechanical / Processing
- Time: 2026/06/10 - 06/12 (Wed To Fri Total 3 Days) Error Correction
- Address: Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhenBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
- Sponsor:The Organizing Committee of the 16th Shenzhen Thermal and Heat Dissipation Exhibition and Bohan Exhibition (Shenzhen) Co., Ltd
- Organizer:The Organizing Committee of the 16th Shenzhen Thermal and Heat Dissipation Exhibition and Bohan Exhibition (Shenzhen) Co., Ltd
- Telephone:13391055735
- Contact:Ms. Chen Juan
- Mobile:13391055735
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
INTRODUCTION
The 6th China (Shenzhen) International Liquid Cooling Technology Exhibition in 2026
Simultaneously held: 16th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition
Date: June 10-12, 2026 Location: Shenzhen International Convention and Exhibition Center
A one-stop procurement platform for heat dissipation, heat conduction, heating control, liquid cooling, and thermal management
Exhibition Information
In recent years, with the explosive growth of big data, the data throughput and computational load required by data centers have significantly increased, making the data center industry increasingly demanding servers. However, due to the limited area of data center construction and environmental regulations, the server carrying capacity of existing data centers in China is relatively limited, and they need to continuously increase the power density of single cabinets to accommodate the rapidly growing demand for computing power. With the rapid development of data centers, energy consumption has become an undeniable issue in the development of the data center industry. Especially after the release of the dual carbon targets of "peak carbon emissions by 2030 and carbon neutrality by 2060", the guidance of national policies and future regulation have become strong driving forces for energy conservation and consumption reduction in data centers. How to better reduce data center PUE has become a focus and challenge in the industry. Based on its efficient technological advantages, liquid cooling has become a pioneer in further reducing PUE in data centers.
With the development of 5G technology, edge computing, AI and other applications, the power density of single cabinet will become higher and higher, and the proportion of liquid cooling in industrial applications will become larger and larger. Although the trend is good, we also clearly see that the entire industry ecosystem of liquid cooling is not yet perfect, and there is great room for improvement in both cost and technology for liquid cooling products and solutions. The 6th CIME 2026 Shenzhen International Data Center Liquid Cooling and Heat Dissipation Exhibition will showcase the latest products and technologies in the liquid cooling industry, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the domestic and international liquid cooling industry market, explore new demands of the future liquid cooling industry market with a development perspective, innovate the exhibition content, organize professional visitors from all aspects and levels, and provide the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. The 6th Shenzhen International Data Center Liquid Cooling Exhibition in 2026 will be held at the Shenzhen International Convention and Exhibition Center from June 10th to 12th, 2026. At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!
Target audience: We mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation, aerospace vehicles, aircraft, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.
Pioneer of Green Revolution Liquid Cooling
Organizational Unit
Organizer: Organizing Committee of the 16th Shenzhen Thermal Insulation and Heat Dissipation Exhibition, Bohan Exhibition (Shenzhen) Co., Ltd
Thanks to the National Supercomputing Shenzhen Center
Organizer: Shenzhen Liyue Exhibition Co., Ltd., Bohan Exhibition (Shenzhen) Co., Ltd
Top level event
CIME 2026, a professional and authoritative international event, plans to invite 400 well-known enterprises including the National Supercomputing Shenzhen Center, Tencent, Baidu, Wangsu Technology, Huawei, Institute of Physical and Chemical Technology of the Chinese Academy of Sciences, Guangzhou Energy Research Institute of the Chinese Academy of Sciences, Inspur Group, Guangdong Telecom Planning and Design Institute, Guangdong HeYi, 3M, Gaolan Energy Saving, Ruisi Bochuang, Shenling, Ouke Air Conditioning, Alphart, Gree, Yishite, and Tongtai Yi to participate, with an expected exhibition area of 20000 square meters.
During the CIME 2026 exhibition, multiple comprehensive technical exchange activities and academic seminars will be held simultaneously, aiming to fully cooperate with exhibitors' diversified promotional strategies and discuss industry hot topics. The cost per session is 20000 yuan for domestic enterprises and 4000 US dollars for foreign enterprises (time is 1 hour, and less than 1 hour will be charged per session).
Scope of exhibits:
Liquid cooled raw materials: including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc; Liquid cooling devices: cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, driving ring power components, temperature control components, thermostats/temperature controllers, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;
Pipelines and connectors: rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc. Auxiliary heat dissipation equipment: cooling fans, heat dissipation materials, enhanced radiators, ambient air exchange equipment; Core technologies and equipment for liquid cooling: including cold plate liquid cooling (including fully liquid cooled plate servers), immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Decoupling design of cold module for intelligent temperature control system and fluid distribution technology; Key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plate, pump, valve, quick connector, heat exchanger; Leakage detection equipment, intelligent sensors, phase change materials (PCM);
Material innovation: high thermal conductivity metal materials (aluminum alloy, copper alloy), insulation materials, sealing materials; Graphene thermal conductive film, ceramic substrate, carbon nanotube composite material; Data center solutions: modular data center, container data center, edge computing liquid cooling solution; Liquid cooling system thermal simulation software, A1 drive zone dynamic intelligent operation and maintenance platform;
Testing, certification, and industry services: including thermal conductivity testers, air volume and pressure measuring instruments, and environmental simulation laboratory equipment; Material compatibility testing for energy efficiency certification of liquid cooling systems (such as PUE value optimization);
█ Booth fees:
Exhibition projects, specifications and requirements, domestic enterprises, joint ventures, foreign-funded enterprises
Standard booth, 3m x 3m, 13800 yuan/piece/exhibition, 17800 yuan/piece/exhibition, 3000 US dollars/piece/exhibition
Double booth, 3m x 3m, 15800 yuan/piece/exhibition, 19800 yuan/piece/exhibition, 3500 US dollars/piece/exhibition
Indoor open space, minimum order of 36m ², 1400 yuan/m ²/extension, 1800 yuan/m ²/extension, 350 US dollars/m ²/extension
█ Booth Description:
1. Standard booth configuration: Chinese and English fascia board, two fluorescent lamps, partition board (height 250cm, usable height 246cm), one negotiation table, two chairs, one 400W/220V power socket and carpet;
2. Exhibitors who have booked the exhibition space are responsible for the necessary expenses for booth layout, as detailed in the exhibitor manual.
Sponsorship Plan:
Background board costs 60000 yuan per seat; Handbag 40000 yuan/20000 pieces; Hanging flags in the exhibition hall for 20000 yuan per piece; Inflatable arch 10000 yuan/seat; Exhibition hall signage costs 5000 yuan per piece; Exhibition floor stickers cost 3000 yuan per piece
Exhibition Journal:
Cover cost 25000 yuan; Back cover 20000 yuan; Sealed at 15000 yuan for one and two; Feng San costs 8000 yuan; Internal color page costs 5000 yuan; Company Introduction 2000 yuan
New technology launch event, new product promotion meeting, and special seminar
Note: The layout specifications (210mm ╳ 142.5mm), imported copperplate paper, four-color precision printing, and layout content are designed by exhibitors themselves.
1. Exhibitors shall fill in the "Exhibition Contract Form" in detail and affix their official seal, and mail or fax it to the organizing committee;
2. The organizing committee has received the confirmation application form. Exhibitors must transfer 50% or the full amount of the exhibition fee to the organizing committee's account within 5 working days, and fax the remittance voucher to the organizing committee for verification. Otherwise, the reserved booth will not be retained.
Please communicate and contact us in a timely manner to obtain the latest exhibition information
Bohan Exhibition (Shanghai&Shenzhen) Co., Ltd
Address: Room 2225, 22nd Floor, Zhonghuan Plaza Office Building, No. 169 Hua'an Road, Huaqiao Town, Kunshan City
Phone: 13391055735
Contact person: Ms. Chen Juan 13391055735 (same WeChat account)
Scope


Costs & Precautions
Contact
- Telephone:13391055735
- Contact:Ms. Chen Juan
- Mobile:13391055735
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870



