2026 Shenzhen Data Center Liquid Cooling Technology Exhibition | AI Computing Industry Exhibition

The 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in 2026

Shenzhen International AI Computing Industry Exhibition

Date: June 10-12, 2026 Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Suzhou International Expo Center, September 16-18, 2026

Shanghai New International Expo Center, December 9-11, 2026

Concurrent Events

The 16th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition

Exhibition Information

In recent years, with the explosive growth of big data, the data throughput and computational load required by data centers have significantly increased, making the data center industry increasingly demanding servers. However, due to the limited area of data center construction and environmental regulations, the server carrying capacity of existing data centers in China is relatively limited, and they need to continuously increase the power density of single cabinets to balance fast speed

The growing demand for computing power. With the rapid development of data centers, energy consumption has become an undeniable issue in the development of the data center industry. Especially after the release of the dual carbon targets of "peak carbon emissions by 2030 and carbon neutrality by 2060", the guidance of national policies and future regulation have become strong driving forces for energy conservation and consumption reduction in data centers. How to better reduce PUE in data centers has become a common practice

The focus and challenges of the industry. Based on its efficient technological advantages, liquid cooling has become a pioneer in further reducing PUE in data centers.

With the development of 5G technology, edge computing, AI and other applications, the power density of single cabinet will become higher and higher, and the proportion of liquid cooling in industrial applications will become larger and larger. Although the trend is good, we also clearly see that the entire industry ecosystem of liquid cooling is not yet perfect, and there is great room for improvement in both cost and technology for liquid cooling products and solutions. [2022 Shenzhen International AI Computing Industry Exhibition

The 2026 Shenzhen International Data Center Liquid Cooling Technology Exhibition will showcase the latest products and technologies in the liquid cooling industry, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the domestic and international liquid cooling industry market, and explore new developments in the future liquid cooling industry market with a development perspective

The demand for innovative exhibition content, comprehensive and multi-level organization of professional visitors, provides the best platform for technical exchange, product display, and trade negotiations for participating enterprises and merchants. The 2026 Shenzhen International AI Computing Industry Exhibition and the 2026 Shenzhen International Data Center Liquid Cooling Technology Exhibition will be held from June 10-12, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). at that time

We warmly welcome AI computing power, data center industry enterprises and related industry professionals from home and abroad to visit and exchange ideas!

Target audience: We mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation, aerospace vehicles, aircraft, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.

Exhibition Scope

Al computing power/algorithm: infrastructure server/storage, network equipment, optical communication/optical transmission, AI chip/DPU/CPU/GPU, storage chip, edge computing chip, edge computing, supercomputing center/intelligent computing center/edge data center, cloud service, Internet of Things, computing security, software application;

Data center infrastructure: data center infrastructure solutions, edge data center solutions, micro module data centers, air conditioning, cooling, and fresh air systems, power supply and distribution systems, comprehensive cabling systems, computer room building and decoration materials, large screen display systems, fire protection systems, security systems;

Liquid cooled raw materials: including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;

Liquid cooling devices: cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, driving ring power components, temperature control components, thermostats/

Temperature controllers, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;

Pipelines and connectors: rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc;

Auxiliary cooling devices: cooling fans, cooling materials, enhanced heat sinks, ambient air exchange devices;

Core technologies and equipment for liquid cooling: including cold plate liquid cooling (including fully liquid cooled plate servers), immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Cold module decoupling design, intelligent temperature control system, fluid distribution technology; Key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plate, pump, valve, quick connector, heat exchanger: leakage detection equipment, intelligent sensors, phase change materials (PCM);

2026 is a professional and authoritative international event covering liquid cooling and heat dissipation for the entire data center. We look forward to meeting you in Shenzhen in June, Suzhou/Singapore in September, and Shanghai in December!

Booth inquiry: Wu Tong 18721130652 (same WeChat account)

• Telephone:18721130652
• Contact:Wu Tong
• Mobile:18721130652
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870