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2026 Shenzhen International Fourth Generation Semiconductor Industry Conference
Industry: Communications / Electronics
Time: 2026/06/10 - 06/12 (Wed To Fri Total 3 Days)    Error Correction
Address: Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhenBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Sponsor:2026 Shenzhen International Fourth Generation Semiconductor Industry Conference
Organizer:2026 Shenzhen International Fourth Generation Semiconductor Industry Conference
69Days To Go
  • Telephone:189-3049-1940
  • Contact:Zhang Desong
  • Mobile:189-3049-1940
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

INTRODUCTION

2026 Shenzhen International Fourth Generation Semiconductor Industry Conference - www.globalomp.com

2026 Shenzhen International Fourth Generation Semiconductor Industry Conference - www.globalomp.com

2026 Shenzhen International Fourth Generation Semiconductor Industry Conference

Simultaneously held: 16th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition

Date: June 10-12, 2026 Location: Shenzhen International Convention and Exhibition Center

Exhibition Information

With the rapid development of fields such as artificial intelligence, quantum communication, and new energy vehicles, the demand for computing power and energy consumption is exponentially increasing, and the demand for fourth generation semiconductor materials continues to be strong. It is expected that the compound annual growth rate of the global fourth generation semiconductor market will reach 38% from 2025 to 2030, and the market size is expected to exceed 50 billion US dollars by 2030. Among them, the ultra-high voltage power devices of electric vehicles and the power grid will contribute 60% of the market demand.

The fourth generation semiconductor, a new semiconductor material system that emerged in extreme environments of high temperature, high frequency, and strong radiation, is gradually moving towards industrialization. It inherits the advantages of the previous three generations of semiconductors and possesses three core features: "ultra wide bandgap, ultra-high thermal conductivity, and ultra strong stability". At present, the fourth generation semiconductor materials represented by gallium oxide (Ga ₂ O3), diamond (C), and aluminum nitride (AlN) are moving from the laboratory to the application field, providing key support for the development of strategic fields such as new energy, aerospace, and quantum computing.

The fourth generation semiconductor materials, with their excellent performance and broad application prospects, are becoming the focus of global technological competition. The market growth potential is enormous in the future, but the industrialization process still faces multiple challenges such as technology, cost, and industrial chain improvement. The "CIME2026 Shenzhen International Fourth Generation Semiconductor Industry Conference" will showcase the latest products and technologies in the fourth generation semiconductor industry, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the domestic and international liquid cooling industry market, explore the new needs of the future fourth generation semiconductor industry market with a development perspective, innovate the connotation of the exhibition, organize professional visitors from all aspects and levels, and provide the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants.

The 2026 Shenzhen International Fourth Generation Semiconductor Industry Conference will be held at the Shenzhen International Convention and Exhibition Center from June 10th to 12th, 2026. At that time, we warmly welcome domestic and foreign fourth generation semiconductor industry enterprises and related industry professionals to visit and exchange ideas!

Target audience: We mainly invite executives of enterprises in various scientific and technological fields, such as military industry, national defense equipment, data center, power, electronics, aviation, electric vehicle, rail transit, 5G/6G base station, smart grid, aerospace, automobile, aircraft, medical care, communication, battery, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.

organizational unit

Organizer: Shenzhen Liyue Exhibition Co., Ltd., Bohan Exhibition (Shenzhen) Co., Ltd

Top tier event

CIME 2026, a professional and authoritative international event, plans to invite 400 well-known enterprises including the National Supercomputing Shenzhen Center, Tencent, Baidu, Wangsu Technology, Huawei, ZTE, Institute of Physical and Chemical Technology of the Chinese Academy of Sciences, Guangzhou Energy Research Institute of the Chinese Academy of Sciences, Inspur Group, Guangdong Telecom Planning and Design Institute, Lanxiao Technology, Nanda Optoelectronics, Guangzhi Technology, Sanan Optoelectronics, Silanwei, Beifang Huachuang, SMIC, and Huacan Optoelectronics to participate, with an expected exhibition area of 20000 square meters.

During the CIME 2026 exhibition, multiple comprehensive technical exchange activities and academic seminars will be held simultaneously, aiming to fully cooperate with exhibitors' diversified promotional strategies and discuss industry hot topics. The cost per session is 20000 yuan for domestic enterprises and 4000 US dollars for foreign enterprises (time is 1 hour, and less than 1 hour will be charged per session).

Scope of exhibits:

1. Ultra wide bandgap materials: Gallium oxide (Ga ₂ O3, bandgap 4.9 eV), Diamond (C, bandgap 5.5 eV), Aluminum nitride (AlN, bandgap 6.2 eV). ‌

2. Ultra narrow bandgap materials: Gallium antimonide (GaSb), Indium antimonide (InSb), etc. ‌

3. Production equipment: single crystal substrate growth equipment, etching and polishing equipment, ion implantation machine, thin film deposition equipment, photolithography and etching equipment, packaging and testing equipment, etc

Booth fee:

Exhibition projects, specifications and requirements, domestic enterprises, joint ventures, foreign-funded enterprises

Standard booth, 3m x 3m, 17800 yuan/piece/exhibition, 22800 yuan/piece/exhibition, 5000 US dollars/piece/exhibition

Double booth, 3m x 3m, 19800 yuan/piece/exhibition, 25800 yuan/piece/exhibition, 5500 US dollars/piece/exhibition

Indoor open space, minimum order of 36m ², 1800 yuan/m ²/extension, 2300 yuan/m ²/extension, 550 US dollars/m ²/extension

Booth Description:

1. Standard booth configuration: Chinese and English fascia board, two fluorescent lamps, partition board (height 250cm, usable height 246cm), one negotiation table, two chairs, one 400W/220V power socket and carpet;

2. Exhibitors who have booked the exhibition space are responsible for the necessary expenses for booth layout, as detailed in the exhibitor manual.

Sponsorship Plan:

Background board costs 60000 yuan per seat; Handbag 60000 yuan/20000 pieces; Hanging flags in the exhibition hall costs 30000 yuan per piece; Inflatable arch 30000 yuan/seat; Exhibition hall signage costs 10000 yuan per piece; Exhibition floor stickers cost 5000 yuan per piece

Exhibition Journal:

Cover cost 25000 yuan; Back cover 20000 yuan; Sealed at 15000 yuan for one and two; Feng San costs 8000 yuan; Internal color page costs 5000 yuan; Company Introduction 2000 yuan

New technology launch event, new product promotion meeting, and special seminar

Note: The layout specifications (210mm ╳ 142.5mm), imported copperplate paper, four-color precision printing, and layout content are designed by exhibitors themselves.

1. Exhibitors shall fill in the "Exhibition Contract Form" in detail and affix their official seal, and mail or fax it to the organizing committee;

2. The organizing committee has received the confirmation application form. Exhibitors must transfer 50% or the full amount of the exhibition fee to the organizing committee's account within 5 working days, and fax the remittance voucher to the organizing committee for verification. Otherwise, the reserved booth will not be retained.

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Address: Room 2225, 22nd Floor, Zhonghuan Plaza Office Building, No. 169 Hua'an Road, Huaqiao Town, Kunshan City

Phone: 021-56698188


Contact: Zhang Desong 189-3049-1940 (same as WeChat)


Scope

2026 Shenzhen International Fourth Generation Semiconductor Industry Conference - www.globalomp.com

2026 Shenzhen International Fourth Generation Semiconductor Industry Conference - www.globalomp.com


Costs & Precautions

Please contact the exhibition organizer before participating in the exhibition to confirm.

Contact

  • Telephone:189-3049-1940
  • Contact:Zhang Desong
  • Mobile:189-3049-1940
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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