Invitation Letter for 2026 Shenzhen International Electronic Materials and Advanced Packaging Exhibition

Date: June 10-12, 2026 Location: Shenzhen International Convention and Exhibition Center

At a critical juncture in the global semiconductor industry's transition to the 'post Moore era', advanced packaging has become the core engine for breaking through chip performance bottlenecks and supporting the explosion of AI computing power. We sincerely invite you to participate in the "2026 Shenzhen International Electronic Materials and Advanced Packaging Exhibition" to be held at the Shenzhen International Convention and Exhibition Center from June 10th to 12th, 2026. This exhibition is based on the advantages of the Guangdong Hong Kong Macao Greater Bay Area industrial cluster, with the theme of "Innovative Packaging, Material Empowerment, and Chip Chain Win Win", to create a high-end exchange platform covering the entire industry chain of electronic materials, advanced packaging technology, equipment, and applications, helping the industry seize the dual opportunities of domestic substitution and global cooperation.

1、 Core highlights of the exhibition

Precise docking of the billion dollar track: Focusing on the advanced packaging market with a global scale of 57.1 billion US dollars, closely following the core technology routes of 2.5D/3D packaging, Chiplet chip integration, hybrid bonding, etc., accurately matching the terminal needs of AI chips, automotive electronics, 5G communication, high-performance computing, etc., and creating an efficient channel for technology landing and commercial cooperation.

Panoramic display of the entire industry chain: Bringing together enterprises from electronic materials and packaging equipment to testing instruments and terminal applications, covering key links such as semiconductor materials, advanced packaging processes, and core components, fully presenting the technological iteration and industrial upgrading of the industry.

Deep aggregation of authoritative resources: With the support of authoritative institutions such as the China Electronics Society and the Semiconductor Industry Association, we invite global leading companies such as TSMC, Changdian Technology, and Tongfu Microelectronics, as well as nearly a hundred industry experts, to participate in building a high-end communication ecosystem that integrates policy, technology, and market.

Empowering the advantages of the Bay Area industry: Leveraging the innovative genes of Shenzhen's "China Silicon Valley" and the semiconductor industry cluster advantages of the Guangdong Hong Kong Macao Greater Bay Area, linking the Pearl River Delta electronic manufacturing industry belt, achieving seamless integration of technology research and development, production capacity matching, and market application.

2、 Scope of exhibits (covering the entire industry chain)

（1） Electronic Materials Zone

Semiconductor core materials: monocrystalline silicon/silicon wafers, compound semiconductor materials (GaN, SiC), sputtering targets, photoresists, polishing solutions/pads, masks, specialty gases, wet electronic chemicals, etc;

Packaging specific materials: packaging substrates (ABF carrier boards, high-density interconnect substrates), bonding wires, lead frames, plastic packaging materials, ceramic packaging materials, thermal conductive materials, electromagnetic shielding materials, chip fillers, etc;

Functional auxiliary materials: thermal conductivity and heat dissipation materials, insulation materials, absorbing materials, interface materials, electronic adhesives, high-temperature tapes, etc.

（2） Advanced Packaging Technology Zone

Mainstream packaging processes: 2.5D/3D packaging (TSV/TGV technology), fanout wafer level packaging (FOPLP), system level packaging (SiP), Chiplet chip heterogeneous integration, hybrid bonding, etc;

Packaging design and simulation: EDA tools, multi physics modeling, packaging reliability simulation and verification techniques, etc.

（3） Production and Testing Equipment Zone

Packaging equipment: Solid crystal bonding machine, wire bonding machine, plastic packaging machine, wafer cutting machine, thinning machine, flip chip bonding equipment, wafer level packaging equipment, etc;

Testing instruments: IC testing instruments, probe stations, sorting machines, thickness detectors, reliability testing equipment, failure analysis equipment, etc;

Supporting equipment: precision bearings, RF power supply, MFC flowmeter, cleanroom equipment, liquid cooled temperature control equipment and other core components.

（4） Terminal Application Zone

Packaging and application products such as AI computing chips, automotive electronics, 5G communication equipment, intelligent terminals, IoT devices, medical electronics, photovoltaic modules, etc.

3、 Contemporary high-end events

Global Advanced Packaging Technology Summit Forum: Inviting technology executives from companies such as TSMC, Samsung, and Changdian Technology to deeply analyze the development trends of 2.5D/3D packaging, Chiplets, and other technologies, and explore the changes in packaging demand under the explosion of AI computing power;

Seminar on Domestic Replacement of Electronic Materials: Focusing on bottleneck materials such as photoresist and packaging substrates, collaborating with upstream and downstream enterprises and research institutions to discuss technological breakthrough paths and industrialization implementation plans;

Supply and demand docking closed door meeting: Targeted matching of material suppliers, equipment manufacturers, sealing and testing enterprises, and terminal manufacturers, building a one-on-one precise negotiation platform to accelerate cooperation implementation;

New Product Launch Event: Providing a platform for enterprises to showcase cutting-edge technologies and innovative products, helping them seize market opportunities and enhance brand influence.

4、 Exhibition hall and location advantages

As a leading modern exhibition hall in the world, Shenzhen International Convention and Exhibition Center is located at the core hub of the Guangdong Hong Kong Macao Greater Bay Area, with a well connected transportation network and adjacent to Shenzhen Bao'an International Airport. The subway and highway networks are seamlessly connected, making it convenient for domestic and foreign exhibitors and visitors to arrive efficiently. The exhibition hall is equipped with high standard exhibition facilities, complete supporting services, and intelligent management systems, providing comprehensive hardware support for the exhibition and helping to create a high-quality exhibition experience.

5、 Core benefits of exhibiting

Brand upgrade: With the global exposure of exhibitions, enhance the brand awareness of enterprises in the field of electronic materials and advanced packaging, and establish a leading image in technology;

Business opportunity exploration: Facing high-quality global buyers, research institutions, and end customers, expanding domestic and international sales channels, and exploring the incremental space of the billion dollar market;

Technological iteration: Gain real-time insights into cutting-edge technologies such as 2.5D/3D packaging and hybrid bonding, learn from innovative experiences of industry benchmark enterprises, and provide direction for product development and technological upgrades;

Ecological Construction: Integrate into the semiconductor industry ecosystem of the Guangdong Hong Kong Macao Greater Bay Area, meet core partners, experts and scholars in the upstream and downstream of the industry, accumulate high-end networking resources, and jointly build an industry collaborative development network.

6、 Exhibition and Visit Information

Exhibition time: [June 10-12, 226]

Exhibition location: Shenzhen International Convention and Exhibition Center

Booth reservation: Please contact the exhibition service team for detailed booth quotation, floor plan, and reservation process.

Consultation hotline: 13023285272 (same as WeChat)

2、 Scope of exhibits (covering the entire industry chain)

（1） Electronic Materials Zone

Semiconductor core materials: monocrystalline silicon/silicon wafers, compound semiconductor materials (GaN, SiC), sputtering targets, photoresists, polishing solutions/pads, masks, specialty gases, wet electronic chemicals, etc;

Packaging specific materials: packaging substrates (ABF carrier boards, high-density interconnect substrates), bonding wires, lead frames, plastic packaging materials, ceramic packaging materials, thermal conductive materials, electromagnetic shielding materials, chip fillers, etc;

Functional auxiliary materials: thermal conductivity and heat dissipation materials, insulation materials, absorbing materials, interface materials, electronic adhesives, high-temperature tapes, etc.

（2） Advanced Packaging Technology Zone

Mainstream packaging processes: 2.5D/3D packaging (TSV/TGV technology), fanout wafer level packaging (FOPLP), system level packaging (SiP), Chiplet chip heterogeneous integration, hybrid bonding, etc;

Packaging design and simulation: EDA tools, multi physics modeling, packaging reliability simulation and verification techniques, etc.

（3） Production and Testing Equipment Zone

Packaging equipment: Solid crystal bonding machine, wire bonding machine, plastic packaging machine, wafer cutting machine, thinning machine, flip chip bonding equipment, wafer level packaging equipment, etc;

Testing instruments: IC testing instruments, probe stations, sorting machines, thickness detectors, reliability testing equipment, failure analysis equipment, etc;

Supporting equipment: precision bearings, RF power supply, MFC flowmeter, cleanroom equipment, liquid cooled temperature control equipment and other core components.

（4） Terminal Application Zone

Packaging and application products such as AI computing chips, automotive electronics, 5G communication equipment, intelligent terminals, IoT devices, medical electronics, photovoltaic modules, etc.

3、 Contemporary high-end events

Global Advanced Packaging Technology Summit Forum: Inviting technology executives from companies such as TSMC, Samsung, and Changdian Technology to deeply analyze the development trends of 2.5D/3D packaging, Chiplets, and other technologies, and explore the changes in packaging demand under the explosion of AI computing power;

Seminar on Domestic Replacement of Electronic Materials: Focusing on bottleneck materials such as photoresist and packaging substrates, collaborating with upstream and downstream enterprises and research institutions to discuss technological breakthrough paths and industrialization implementation plans;

Supply and demand docking closed door meeting: Targeted matching of material suppliers, equipment manufacturers, sealing and testing enterprises, and terminal manufacturers, building a one-on-one precise negotiation platform to accelerate cooperation implementation;

New Product Launch Event: Providing a platform for enterprises to showcase cutting-edge technologies and innovative products, helping them seize market opportunities and enhance brand influence.

• Company:Shanghai Dafu Exhibition Service Co., Ltd
• Telephone:13023285272
• Contact:organizing committee
• Mobile:13023285272
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870