When discussing the development of the electronic packaging and testing industry, we have to delve into the core of this technology, understand how it has become an indispensable part of the modern electronic industry, and look forward to possible future development directions. Electronic packaging testing, as a key link in the backend of the semiconductor industry chain, is not only related to product quality and performance, but also an important driving force for technological innovation and industrial upgrading. With the rapid development of information technology and the continuous expansion of the global electronic market, the electronic packaging and testing industry has ushered in unprecedented development opportunities. As a bridge connecting chip design and system applications, packaging testing technology not only needs to meet increasingly complex functional requirements, but also needs to consider multiple factors such as cost-effectiveness, production efficiency, and environmental friendliness.

Technological progress is the core driving force behind the development of the integrated circuit packaging and testing industry. With the rise of emerging technologies such as 5G, IoT, and artificial intelligence, higher requirements have been put forward for integrated circuit packaging and testing. Chinese enterprises are actively laying out in this field, increasing research and development investment, and promoting continuous innovation in packaging technology. From traditional DIP and SOP packaging to advanced SiP, Fan out and other packaging technologies, Chinese enterprises have continuously made breakthroughs in technological innovation, providing more diversified and high-performance product choices for the global market. In the global integrated circuit packaging and testing market, the competitiveness of Chinese enterprises is increasing day by day. At the same time, with the continuous expansion of the domestic market and the overseas market, China's packaging and testing industry is gradually forming a good pattern led by top enterprises and coordinated development of small and medium-sized enterprises.

Facing the future, opportunities and challenges coexist in China's integrated circuit packaging and testing industry. We sincerely invite people of all walks of life to seek common development plans and work together to create a brilliant future. As a professional exhibition in the field of electronic packaging testing directly organized by numerous domestic and foreign industry associations and government regulatory departments, its consistent style of "clear theme, prominent characteristics, emphasis on effectiveness, and continuous innovation" has led to an increasing popularity and influence in the industry. Industry insiders have regarded it as the best platform for "understanding industry information, grasping market trends, showcasing corporate brands, expanding trade channels, and seeking cooperation opportunities". The good results of the exhibition have won praise and favor from numerous exhibitors and visitors. This exhibition has become the most authoritative, professional, and large-scale event in the electronic packaging and testing industry in Asia.

At the same time, multiple technical forums such as the "China International Electronic Packaging Testing Technology and Application High end Development Forum" will be held, inviting domestic and foreign experts and representatives to interact and exchange ideas, explore industry development trends, and share their respective experiences and achievements. At that time, we warmly welcome domestic and foreign electronic packaging testing enterprises and related industry professionals to visit and exchange ideas.

1. Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering related products and technologies, etc;

2. Advanced packaging and system integration: ball grid array packaging, chip level packaging, flip chip, wafer level packaging, 3D integration, and various other advanced packaging and system integration technologies;

3. Packaging materials and processes: interconnect materials such as keys and wires, solder balls, solder paste, conductive adhesives, etc; Underchip fillers, adhesives, thin film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials, and other new materials that can achieve high packaging performance and reduce costs; And various packaging and assembly processes, etc;

4. Packaging design and simulation: various new packaging/assembly designs; Modeling, simulation, and verification methods for electrical, thermal, optical, and mechanical characteristics of electronic packaging; Multi scale and multi physics modeling, etc;

5. Packaging in emerging fields: packaging technologies for sensors, actuators, microelectromechanical systems, nanoelectromechanical systems, and micro electromechanical systems; Optoelectronic packaging, CMOS image sensor packaging; The application of packaging and integration technology in emerging fields such as liquid crystal displays, passive components, RF, power and high-voltage devices, and nanodevices;

6. High density substrate and assembly technology: embedded passive and active component substrate technology; High density interconnect substrates, printed circuit boards, high-density high-performance substrates; And various new substrate technologies that can improve substrate density and performance;

• Company:Shanghai Yewen Exhibition Service Co., Ltd
• Telephone:021-54388602
• Contact:Yao Hua
• Mobile:18817208969
• E-mail:2410927403@qq.com
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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