From May 22nd to 24th, 2026, the Hefei Binhu International Convention and Exhibition Center will host an annual event leading the trend of China's electronics industry - the 2026 China (Hefei) International Electronic Technology Exhibition. With the dual core themes of "Intelligent Connection Empowering Xinchuang Future" and "Digital Intelligence Anhui Chip and Global Chain Connection", this industry grand event covering an exhibition area of 30000 square meters, gathering more than a thousand top global enterprises, and attracting over 30000 professional visitors, is not only a concentrated exhibition of technological innovation, but also a comprehensive demonstration of the strength of Hefei's trillion level "Chip Screen Automotive Integration" industrial cluster, building a full chain exchange platform for "technology research and development scene application achievement transformation" for the Yangtze River Delta and even the national electronic information industry.

The "2026 China (Hefei) International Electronic Technology Exhibition" will be held from May 22-24, 2026 at the Binhu International Convention and Exhibition Center in Hefei. The exhibition will focus on the theme of "Smart Hefei · Electric Drive Future", gathering leading enterprises in the fields of electronic information equipment, semiconductors and displays, electronic manufacturing, and intelligent terminals from around the world. It will showcase the latest technological achievements, cutting-edge products, and innovative solutions in the industry, providing an efficient docking platform for both supply and demand sides, and creating an important window for global electronic technology trade exchange and cooperation.

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

audience

Electronic manufacturing: Senior management personnel such as chairman, general manager, and deputy general manager of manufacturing enterprises related to consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, designers, etc. from supply chain management, procurement, technology, research and development, production manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, IC design/chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors/agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: enterprises and institutions involved in electronic technology applications in the military, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries.

Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiao（lady）

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

• Contact:Liu Jiao
• Mobile:13257086620
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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