On May 13, 2026, the 8th Global Semiconductor Industry and Electronic Technology (Chongqing) Expo opened at the Chongqing International Expo Center.
This expo is jointly hosted by Chongqing Electronics Society, Sichuan Electronics Society, Chongqing Semiconductor Industry Association, and Chongqing Power Supply Society.
The Expo brought together Huawei, Aosong Electronics, Xinling Microelectronics, United Microelectronics, CR Microelectronics, Ruishi Chuangxin, On Chip Microelectronics Technology, Shanghai Microelectronics Equipment, Lenovo, Haier, Nansha Wafer, relevant units of China Electronics Technology Group, Shengke Chongqing Branch, Pingwei Industry, Yuntong Technology, Yitong, University of Electronic Science and Technology of China Industrial Park, Xinying Zhicheng, Xinyidong, Heketai Group, Yuejiang Robotics, Hikvision Ruiying, Mutilai, Tongyou Microelectronics, Okes Optoelectronics, Rilian, Keyence, Chuanqian, China Electronics Second Construction, Zichen Laser, Yiding Group, Guona, Yuhan Precision Machinery, Ruichuan Electronics. Yikede, Xiandeli, Senmei Xier, Chuangzhi Xinlian, Jingchuang, Qinghe Wafer, Futai Purification, Qisheng Precision, Beijing Electronic Quantity Testing Equipment, Tieniu Technology, Zhicheng, Chuangzhi Xinlian, Xinhuilian Group, Shiyuan Technology, Boiling Point Hundreds of well-known exhibitors, including Taijida Electronics, Siling Robotics, Meilu Testing, Elsa from Germany, Jinshang Zhizao, Wude Miaole, Abrams Technology, Yitang Technology, Baiguang Electronics, Zhanrong Automation, Aiweishi, Mengxun Electronics, Jiadehe, Sujing Group, Zhongzhi Testing, Lingtu Electrical Testing, and Zhixinhui Group, gathered to showcase their hardcore products and innovative solutions, jointly promoting the integration of industrial and supply chains.

✅ Semiconductor, integrated circuit design, manufacturing, packaging:
Integrated circuit design and chips, chip design tools, software and testing, wafer manufacturing, SIP advanced packaging, power device packaging and testing, MEMS packaging and testing, advanced packaging (Chiplet) technology, silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, packaging substrate semiconductor materials and equipment and components, etc;

✅ Equipment Manufacturing Zone:
Thinning machine, single crystal furnace, oxidation furnace, grinding, polishing, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, scribing, CVD/PVD/ALD, PECVD equipment MOCVD、 Glue coating, developing machine, solidification machine, cutting machine, cleaning equipment, mounting machine, burning, optical vacuum coating, imaging and testing measurement (microscope/spectrometer/interferometer/optical measurement and testing instrument/optical design software/optical platform and displacement table, etc.), optical instruments, lens and camera (lens/lens), laser equipment, bonding machine, testing machine, sorting machine, vacuum fluid, detection equipment, refrigeration equipment, oxidation equipment, oxidation equipment, clean room equipment;

✅ Semiconductor Materials Zone:
Third generation semiconductor materials, silicon wafers and silicon-based materials, optical masks, high-purity gases, electronic specialty gases, wet electron chemistry, photoresist and its supporting reagents, CMP polishing materials, target materials, optical fibers, packaging materials, nanomaterials, chip bonding materials, pipeline valves, crystals, quartz, sapphire, graphene, etc;

✅ Automotive Electronics:
Vehicle grade semiconductor control/AI chips, power semiconductors (IGBT and MOSFET), vehicle grade SiC modules, power management chips, automotive electronic micro assembly and power devices, advanced packaging technology for vehicle grade, intelligent networking, intelligent driving intelligent cockpit chips CPU and storage chips MCU, GPU image processing, vision processing chips, vision, sensing technology, radar technology, optical systems, intelligent decision-making technology, high-precision positioning and mapping systems, design and development, and testing solutions, etc;

✅ Electronic components:
Passive components, sensors, storage devices, connectors, relays, cables, wiring harnesses, plug-in devices, crystal oscillators, resistors, instruments, display devices, secondary and tertiary transistor filtering components, switches and component materials and equipment, ceramic magnetic materials, printed circuit substrates, etc;

✅ Test measurement:
Electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

✅ New Display and Intelligent Terminal:
Display and applications, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc;

✅ Smart Power Zone:
Microwave RF, semiconductor LED, power management chip, plasma power supply, module power supply, laser power supply, AC, DC power supply, communication power supply, special power supply, power manufacturing equipment and auxiliary materials, power related software, photovoltaic/wind power/energy storage power supply design, military industry, power converter magnetic technology, etc;

✅ Intelligent manufacturing:
SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, smart factories, smart warehousing, smart robots, welding and dispensing technology AI+5G、 Industrial Internet platform, intelligent vehicle networking, anti-static, clean purification, etc;

✅ Comprehensive exhibition area:
Government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, negotiation zones, etc.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Contact:Han Fei
• E-mail:298233172@qq.com
• Address:Shancha Road, Yubei District

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870