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• Focusing on the perception fusion technology of automotive grade chips, in vehicle radar and LiDAR, and the intelligent upgrade of battery management systems (BMS), combined with the advantages of Hefei's new energy vehicle industry, this paper explores the collaborative innovation mode between electronic information and the automotive industry.

• Deep integration of industrial Internet and intelligent manufacturingShowcasing the application cases of industrial electronic components, industrial software, and digital twin technology in intelligent manufacturing workshops, exploring how to improve production efficiency, reduce energy consumption, and promote the transformation of traditional manufacturing industry to "smart manufacturing" through electronic technology.

• Low altitude economy and new ecology of electronic securityFocusing on low altitude aircraft monitoring radar, drone countermeasure technology, urban low altitude communication support system, and other related topics, combined with the experience of the low altitude economy pilot project in Hefei Binhu New Area, this paper explores how electronic technology can safeguard the safe and orderly development of the low altitude economy.

Currently, global digital transformation is driving electronic technology to become the core driving force, and the development of fields such as 5G, artificial intelligence, and intelligent vehicles highly relies on advanced electronic devices and solutions. While the global market continues to grow, it is also accompanied by new opportunities and challenges. As a national strategic industry, the electronic information industry has received multiple policy supports, and has been listed as a key focus in both the "Made in China 2025 Plan" and the "14th Five Year Plan". Electronic technology is like the "nerve center" of the digital age, driving innovation and change in various fields. In recent years, the global electronic information market has continued to grow in size, with emerging technologies constantly emerging, bringing new opportunities and challenges to industrial development.

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

Exhibition Advantages

The unique advantage of Hefei Electronic Technology Exhibition lies in the "industry real-life" in-depth experience. Relying on the trillion level industrial cluster of "Chip Screen Device Integration" in Hefei, the exhibition can seamlessly connect the full chain resources from chip design, panel manufacturing to intelligent terminal assembly in the local area, allowing exhibitors to immerse themselves in the forefront trends of electronic technology and connect with the upstream and downstream industries of semiconductor, display, electronic components and other fields on site, achieving efficient transformation from information exchange to cooperation landing.

Choosing Hefei Electronic Technology Exhibition is to seize the entrance to the high ground of the electronics industry. This not only connects domestic and foreign electronic technology core enterprises, but also directly faces the innovative achievements and market demand in key fields such as automotive grade chips, flexible AMOLED, intelligent sensors, etc. Next, Hefei will focus on developing high-end chips, new displays, and intelligent terminals, with deepening technology cooperation with domestic and foreign enterprises as the engine, to achieve coordinated promotion of research and development, manufacturing, and application, accelerate the construction of a national electronic information industry cluster, and fully consolidate its position as the "IC Capital of China" and "New Energy Capital", providing a broader platform for industrial cooperation and development for participating enterprises.

audience

Electronic manufacturing: Senior management personnel such as chairman, general manager, and deputy general manager of manufacturing enterprises related to consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, designers, etc. from supply chain management, procurement, technology, research and development, production manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, IC design/chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors/agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: enterprises and institutions involved in electronic technology applications in the military, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries.

Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiao（lady）

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

• Contact:Liu Jiao
• Mobile:13257086620
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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