SEMI-e Shenzhen International Semiconductor Exhibition and 2026 Integrated Circuit Industry Innovation Exhibition

Date: September 9-11, 2026

Exhibition Hall: Shenzhen International Convention and Exhibition Center (Bao'an)

The SEMI-e Shenzhen International Semiconductor Exhibition and 2025 Integrated Circuit Industry Innovation Exhibition, jointly organized with the CIOE China Optoelectronics Expo, will be held at the Shenzhen International Convention and Exhibition Center from September 9-11, 2026. After the integration of the two exhibitions, the scale will exceed 300000 square meters, attracting more than 5000 high-quality exhibitors to gather and build a "super display platform" covering the two core fields of semiconductor integrated circuits and optoelectronics, showcasing the world's top products and cutting-edge technological achievements in the industry.

SEMI-e Shenzhen Semiconductor Exhibition and Integrated Circuit Exhibition has invited companies such as Baiwei, Alibaba/Pingtouge, Ziguang Tongchuang, Zhaoyi Innovation, HiSilicon, Huada Jiutian, Suzhou Guoxin, Silan Micro, Beijing Junzheng, Wuhan Xindong, Xinyuan Micro, Quanlun, Niuxin, Hejian Gongruan, Zhuosheng Micro, Shanghai Beiling, Ziguang Zhanrui, Ziguang Tongchuang, Suzhou Guoxin, Zhongxing Micro, Huada Jiutian, SMIC, Huahong Group, Wuhan Xinxin, Changjiang Storage, Changxin, Yuexin, Zengxin, Hefei Jinghe, Huarun Micro, Changdian, Tongfu Microelectronics, Jinghe to integrate resources from the entire industry chain, including design, manufacturing, packaging, and testing. Fang, Tianxin Interconnect, CRRC, BYD, Innolux, Beifang Huachuang, Zhongwei, Shengmei, Jiangfeng Electronics, Xianfeng, Huazhuo Jingke, Tuojing, Huahai Qingke, Xinyang More than 900 core members, including Anjiwei, and over 1300 core components of the industrial chain participated in the exhibition At the same time, multiple technical exchange forums and high-end exchange dinners will be held

Scope of exhibits:

1. IC Design/Chips and Applications

IC and related electronic product design, EDA, AI computing power chips, storage chips, automotive chips, smart home appliance chips, artificial intelligence chips, IoT, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health and medical products, etc;

2. IC manufacturing

Semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

3. Advanced packaging

Design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

4. Semiconductor materials

Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, special gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

5. Semiconductor equipment

Wafer manufacturing equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

6. Semiconductor core components

Machine vision, sensors, seals, precision bearings, metal components, Valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

Contact Information

Organizing Committee of SEMI-e Shenzhen International Semiconductor Exhibition and 2026 Integrated Circuit Industry Innovation Exhibition

Exhibition Hotline: Yang Chunyuan 18054221546

Only the scope of exhibits can be filled in here, and contact information cannot be provided!

• Telephone:18054221546
• Contact:Yang Chunyuan
• Mobile:18054221546
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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