When the gate of Hefei Binhu International Convention and Exhibition Center slowly opened on May 22nd, this technology feast that gathered over 300 top electronic companies and professional visitors from around the world had already surpassed the scope of ordinary exhibitions - it was more like a mirror reflecting the trajectory of China's electronics industry from "following" to "running in parallel" and then to "leading"; It is also a key that unlocks a new imagination of the "chip screen device integration" strategy in the era of computing power

More remarkable is the rise of local innovation forces. At the "Shuzhi Wanxin" achievement conference, the world's first HBF storage grade SSD developed by a local enterprise in Hefei made a stunning debut, with a transmission speed of 10GB/s that amazed the audience present. In the past, we followed foreign technology, but now we want the world to follow Chinese standards, "said the company leader with pride. From AI chips to optical communication modules, from smart terminals to energy equipment, Hefei is using exhibitions as a window to showcase the hard power of "Made in China" to the world.

The significance of this exhibition goes beyond just showcasing technology and products. It is a clash of ideas, and the debate between NVIDIA and AMD engineers on the future direction of full cabinet AI servers at the AI Chip Summit provides multiple perspectives for industry development; It is a preview of the future, in the Future Life Technology Experience Area, where the real-time translation of smart glasses 2.0 and the thoughtful service of smart home AI butlers allow the audience to experience the appearance of "smart life" in advance.

audience

Electronic manufacturing: Senior management personnel such as chairman, general manager, and deputy general manager of manufacturing enterprises related to consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, designers, etc. from supply chain management, procurement, technology, research and development, production manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, IC design/chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors/agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: enterprises and institutions involved in electronic technology applications in the military, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries.

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

Exhibition Advantages

The unique advantage of Hefei Electronic Technology Exhibition lies in the "industry real-life" in-depth experience. Relying on the trillion level industrial cluster of "Chip Screen Device Integration" in Hefei, the exhibition can seamlessly connect the full chain resources from chip design, panel manufacturing to intelligent terminal assembly in the local area, allowing exhibitors to immerse themselves in the forefront trends of electronic technology and connect with the upstream and downstream industries of semiconductor, display, electronic components and other fields on site, achieving efficient transformation from information exchange to cooperation landing.

Choosing Hefei Electronic Technology Exhibition is to seize the entrance to the high ground of the electronics industry. This not only connects domestic and foreign electronic technology core enterprises, but also directly faces the innovative achievements and market demand in key fields such as automotive grade chips, flexible AMOLED, intelligent sensors, etc. Next, Hefei will focus on developing high-end chips, new displays, and intelligent terminals, with deepening technology cooperation with domestic and foreign enterprises as the engine, to achieve coordinated promotion of research and development, manufacturing, and application, accelerate the construction of a national electronic information industry cluster, and fully consolidate its position as the "IC Capital of China" and "New Energy Capital", providing a broader platform for industrial cooperation and development for participating enterprises.

Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiao（lady）

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

• Contact:Liu Jiao
• Mobile:13257086620
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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