Greater Bay Area Clean Exhibition | 2026 Shenzhen International Industrial Clean Conference and Exhibition

INDUSTRIAL CLEANLINESS CONFERENCE AND EXHIBITION

Simultaneously held: 2026 China (Shenzhen) International Semiconductor Exhibition

2026 CHINA (SHENZHEN) INTERNATIONAL SEMICONDUCTOR EXHIBITION

Date: June 10-12, 2026

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Exhibition Introduction

The semiconductor and integrated circuit industry is the "strategic highland" of technological competition and the "core engine" of industrial upgrading, and industrial clean technology, as its core supporting guarantee, is the key cornerstone of high-quality development of the industry. With the acceleration of global digital transformation, the synergistic value of the two is becoming increasingly prominent. Shenzhen has achieved a leapfrog development of the semiconductor industry from scratch to full chain breakthrough, building a complete industrial chain covering design, manufacturing, packaging and testing, equipment, materials and other links, forming a development model driven by "policy capital talent technology", and becoming the core highland for innovative development of the domestic semiconductor industry. Industrial clean technology has been deeply integrated into the entire semiconductor process, providing indispensable support for the precision, stability, and product yield of chip manufacturing.

Shenzhen attaches great importance to the coordinated development of industries, and has established a "Six Ones" industrial ecosystem including "One Fund, One Exhibition, and One Forum". A series of inclusive policies have been introduced, covering the entire cycle of core technology research and development, public service platform construction, and innovation achievement transformation. Establish an industry with an initial scale of 5 billion yuan, targeting key areas and weak links in the industrial chain with precision; At the same time, establish professional collaboration platforms such as "Wanxin Exhibition" to promote the deep integration of semiconductor and industrial clean technology, and accelerate industrial upgrading.

Major categories of exhibits

IC design: IC design (analog and power chips, AI computing chips, storage chips, automotive electronic chips, smart home appliance chips, artificial intelligence chips, ASIC chips, sensor chips, optoelectronic chips, biochips, neuromorphic chips, quantum chips);

IC manufacturing: wafer manufacturing, discrete devices, optoelectronic devices, sensor products;

IC packaging and testing: traditional packaging such as DIP, SOP, QFP, SIP, BGA, etc; Inverted, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), Chiplet and other advanced packaging; IC front-end and back-end testing services;

Cleanroom equipment: medical purification, biopharmaceutical purification, electronic purification, clean bench, clean room/cabinet FFU、 Air filters, purification lamps, biosafety cabinets, transfer boxes/windows, air shower rooms, laminar flow hoods, purification vacuum cleaners, electronic air self-cleaning, sterilization equipment, cleaning and disinfection equipment, etc,

HVAC system: central air conditioning system, supporting products and accessories, purification air conditioning, fans, self-control products, control center and systems, etc,

Cleanroom architecture: ceiling/ceiling, keel, wall panels, flooring, paint and flooring, doors, windows and glass, color steel plates, purified aluminum materials, etc;

Cleanroom supplies: anti-static and dustproof purification clothing (hats, clothes, pants, shoes, boots, protective goggles/covers, gloves), purification room paper, pens, dust-free paper, dust-free cloths, purification cotton swabs and other consumables: filter media, anti-static wrist straps, anti-static table mats, anti-static dust-free chairs, etc;

Laboratory equipment: fume hood, central table, side table, experimental table, functional cabinet, medicine cabinet, utensil cabinet, ceiling, stainless steel wardrobe, shoe cabinet, hand sink, shoe changing stool, sink, atomic absorption hood, trolley, shelf, explosion-proof cabinet, nurse station, medical furniture, etc;

Testing instruments and meters: measuring instruments, particle counters, samplers, air flow hoods, differential pressure gauges, electrostatic testing analyzers, monitoring systems, etc

Material supply: pure water equipment, ultra pure water treatment equipment, industrial wastewater treatment equipment, ultra pure gas, special gases, chemicals, etc

Design and Certification: Design institutes, design/engineering/decoration/testing companies, GMP pharmaceutical engineering, consulting and certification company associations, etc

Semiconductor equipment and components: various precision equipment, semiconductor packaging equipment, and testing equipment required during wafer processing; Sealing rings, precision bearings, metal components, valve valves, silicon/SiC parts Robots、 Semiconductor components such as quartz parts, filters, RF power supplies, ceramic parts, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

Semiconductor materials: silicon-based materials such as monocrystalline silicon and silicon wafers; Process auxiliary materials such as polishing pads, masks, sputtering targets, photoresists, thin film deposition materials, precursor materials, specialty gases, polishing solutions, wet electronic chemicals, etc; Ceramic packaging materials, bonding wires, lead frames, packaging substrates, plastic packaging materials, high-performance plastics and other packaging materials;

Compound semiconductor materials and products: manufacturers of substrate and epitaxial wafer materials for compound semiconductors (such as indium phosphide, silicon carbide, gallium nitride, gallium oxide, etc.), as well as their devices and module products;

Downstream chip applications: IoT, artificial intelligence, intelligent connected vehicles, healthcare, embodied intelligence, consumer electronics, network communication, instrumentation and other products;

Supporting facilities and services: various chip fire platforms, semiconductor associations, industry alliances, semiconductor research institutes, pilot production lines and universities, investment and financing institutions, environmental protection enterprises, electronic construction enterprises, general commercial service/consulting institutions, sales, standardization development, and logistics cold chain support service enterprises.

consulting serviceTeacher Zhang 13795333699

Major categories of exhibits

IC design: IC design (analog and power chips, AI computing chips, storage chips, automotive electronic chips, smart home appliance chips, artificial intelligence chips, ASIC chips, sensor chips, optoelectronic chips, biochips, neuromorphic chips, quantum chips);

IC manufacturing: wafer manufacturing, discrete devices, optoelectronic devices, sensor products;

IC packaging and testing: traditional packaging such as DIP, SOP, QFP, SIP, BGA, etc; Inverted, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), Chiplet and other advanced packaging; IC front-end and back-end testing services;

Cleanroom equipment: medical purification, biopharmaceutical purification, electronic purification, clean bench, clean room/cabinet FFU、 Air filters, purification lamps, biosafety cabinets, transfer boxes/windows, air shower rooms, laminar flow hoods, purification vacuum cleaners, electronic air self-cleaning, sterilization equipment, cleaning and disinfection equipment, etc,

HVAC system: central air conditioning system, supporting products and accessories, purification air conditioning, fans, self-control products, control center and systems, etc,

Cleanroom architecture: ceiling/ceiling, keel, wall panels, flooring, paint and flooring, doors, windows and glass, color steel plates, purified aluminum materials, etc;

Cleanroom supplies: anti-static and dustproof purification clothing (hats, clothes, pants, shoes, boots, protective goggles/covers, gloves), purification room paper, pens, dust-free paper, dust-free cloths, purification cotton swabs and other consumables: filter media, anti-static wrist straps, anti-static table mats, anti-static dust-free chairs, etc;

Laboratory equipment: fume hood, central table, side table, experimental table, functional cabinet, medicine cabinet, utensil cabinet, ceiling, stainless steel wardrobe, shoe cabinet, hand sink, shoe changing stool, sink, atomic absorption hood, trolley, shelf, explosion-proof cabinet, nurse station, medical furniture, etc;

Testing instruments and meters: measuring instruments, particle counters, samplers, air flow hoods, differential pressure gauges, electrostatic testing analyzers, monitoring systems, etc

Material supply: pure water equipment, ultra pure water treatment equipment, industrial wastewater treatment equipment, ultra pure gas, special gases, chemicals, etc

Design and Certification: Design institutes, design/engineering/decoration/testing companies, GMP pharmaceutical engineering, consulting and certification company associations, etc

Semiconductor equipment and components: various precision equipment, semiconductor packaging equipment, and testing equipment required during wafer processing; Sealing rings, precision bearings, metal components, valve valves, silicon/SiC parts Robots、 Semiconductor components such as quartz parts, filters, RF power supplies, ceramic parts, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

Semiconductor materials: silicon-based materials such as monocrystalline silicon and silicon wafers; Process auxiliary materials such as polishing pads, masks, sputtering targets, photoresists, thin film deposition materials, precursor materials, specialty gases, polishing solutions, wet electronic chemicals, etc; Ceramic packaging materials, bonding wires, lead frames, packaging substrates, plastic packaging materials, high-performance plastics and other packaging materials;

Compound semiconductor materials and products: manufacturers of substrate and epitaxial wafer materials for compound semiconductors (such as indium phosphide, silicon carbide, gallium nitride, gallium oxide, etc.), as well as their devices and module products;

Downstream chip applications: IoT, artificial intelligence, intelligent connected vehicles, healthcare, embodied intelligence, consumer electronics, network communication, instrumentation and other products;

Supporting facilities and services: various chip fire platforms, semiconductor associations, industry alliances, semiconductor research institutes, pilot production lines and universities, investment and financing institutions, environmental protection enterprises, electronic construction enterprises, general commercial service/consulting institutions, sales, standardization development, and logistics cold chain support service enterprises.

• Company:Shanghai Dadao Guozhan Exhibition Co., Ltd
• Contact:Teacher Zhang
• Mobile:13795333699
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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