2026 Shenzhen International Third Generation Semiconductor Technology and Packaging Testing Exhibition

Shenzhen Third Generation Semiconductor Technology and Testing Exhibition

Basic Information

Date: April 9-11, 2026

Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction

The 2026 Shenzhen Third Generation Semiconductor Technology and Packaging Testing Exhibition will be held from April 9-11 at the Shenzhen Convention and Exhibition Center, dedicated to advanced semiconductor devices, packaging testing, process flow, innovative applications, and cooperation between industrial chains, building a bridge for communication and cooperation between upstream and material equipment. With the increasing popularity and widespread application of third-generation semiconductor devices, it has brought innovation to the industry. Based on its development in high-speed, small size, low loss, high power, high heat dissipation, and high integration directions, it is increasingly widely used in the consumer electronics and power electronics industries. Advanced packaging materials and reliability technologies are constantly improving, and automotive silicon level devices are constantly being installed. Currently, a full industry chain from materials, devices, packaging, testing, to application has been initially formed. However, the overall technological level is still lagging behind the world's top level, and there is an urgent need to break through the core key technologies of materials, wafers, packaging and testing, processes, applications, and engineering application issues such as reliability and consistency. The content covers the latest developments in third-generation semiconductor devices and packaging technology, focusing on advanced packaging materials and reliability of SiC/GaN power devices, SiC/GaN power device technology, new packaging structure materials for devices, sintered silver interconnect technology, reliability testing of packaging materials, packaging thermal management, thermal and mechanical reliability simulation equipment, to understand the various challenges of high-power power electronic devices and packaging. Inviting leading forces in industry, academia, research and application, well-known experts in the industry, and representatives of enterprises to share special reports, explore the latest progress, and promote the development of third-generation semiconductor devices and packaging technology.

Schedule

Report Exhibition: April 7-8, 2026

Exhibition Display: April 9-11, 2026

Opening Date: April 9th, 2026

Demolition date: April 11, 2026

Exhibition Scope

·Third generation semiconductor packaging and testing technology

·Advanced Packaging Materials for SiC Power Devices

·SiC power device process and technology

·Semiconductor materials, processes, innovation, and applications

·New packaging structure materials and sintered silver interconnect technology

·Reliability testing of packaging materials, thermal management of packaging, and reliability simulation equipment

Contact Us

Contact: Mr. Zhang 136-3660-4883 (same as WeChat)

2026 Shenzhen International Third Generation Semiconductor Technology and Packaging Testing Exhibition

• Truename:Mr. Zhang
• Mobile:13636604883
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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