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2025 Asia Electronic Production Equipment and Microelectronics Industry Exhibition
Industry: Communications / Electronics
Time: 2025/10/28 - 10/30 (Tues To Thur Total 3 Days)    Error Correction
Address: Shenzhen · Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhenBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Sponsor:China Council for the Promotion of International Trade Electronic Information Industry Branch, Reed Exhibitions Group
Organizer:Reed Exhibitions
13Days To Go

INTRODUCTION

2025 Asia Electronic Production Equipment and Microelectronics Industry Exhibition - www.globalomp.com

2025 Asia Electronic Production Equipment and Microelectronics Industry Exhibition - www.globalomp.com

In the wave of deep global economic adjustment and supply chain restructuring, the electronics manufacturing industry is undergoing unprecedented changes. The fluctuation of US tariff policies and geopolitical games have prompted multinational corporations to reshape their supply chain resilience and accelerate the optimization of cost structures in domestic manufacturing. This structural change not only brings challenges, but also nurtures opportunities for industrial upgrading - the global electronic manufacturing system is accelerating its evolution towards a smarter and more resilient direction.

NEPCON ASIA, with a keen perception of external variables, will be grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an) from October 28th to 30th. This exhibition brings together buyers from all categories of electronic manufacturing enterprises in Asia, helping customers efficiently capture new business opportunities, expand new fields, accurately connect with new customers, promote deep commercial cooperation in the upstream and downstream of the industrial chain, and comprehensively enhance the global competitiveness of Asian electronic manufacturing enterprises.

NEPCON ASIA 2025 Asia Electronics Show launches a special expansion plan for "new buyers", creating a high-value commercial platform for interactive communication, precise docking, and win-win cooperation between supply and demand sides. Through targeted invitations, it is expected that 10000 new buyers from high growth application fields such as automotive electronics, semiconductor packaging and testing, and new energy manufacturing will be invited to help enterprises explore the procurement needs of new buyers' equipment and seize unlimited new business opportunities in high growth industries.

In addition, this exhibition is expected to bring together 1000 new electronic product factories that plan to complete production line upgrades or expand new business sectors within the next 2 years! At that time, 70000 professional visitors will also attend the scene to witness the innovative energy of the upstream and downstream of the industrial chain surging in Pengcheng. Top global technology suppliers will showcase cutting-edge solutions here and promote the intelligent upgrading of the industry.

At the same time, this exhibition will upgrade and create a "IGBT&SiC module packaging and testing process demonstration line", which presents the core packaging and testing processes through real-life production lines, and visually displays the process sections of 20+key equipment connected in series. This immersive technology exhibition is expected to attract more than 200 packaging and testing manufacturers as well as IDM enterprise technology teams to participate deeply. Both the supply and demand sides will discuss process difficulties and technology upgrades on site.

NEPCON ASIA, along with six flagship exhibitions, is jointly presented, deeply integrating electronic manufacturing with automotive, display, new materials and other fields. It is expected to gather more than 3500 exhibiting companies, with an exhibition matrix of over 160000 square meters and 165000 cross-border visitors. TAP is expected to invite 10000 core buyers. Cross border ecological closed-loop enables more electronic manufacturing enterprises to directly engage in dialogue with component suppliers, display screen manufacturers, and new material research and development institutions, seize local market dividends, and collide with new business opportunities both domestically and internationally.

With the explosive growth of emerging industries and the intelligent transformation of traditional industries, the competition among electronic manufacturing enterprises is no longer just a competition of products and technologies, but also a competition of ecological integration capabilities. As a professional exhibition that has been deeply involved in the electronics manufacturing industry for 30 years, NEPCON ASIA Asia Electronics Exhibition takes "Smart Chain Electronics New Ecology, Cross border Global New Business Opportunities" as its theme, reconstructing value from four dimensions: commercial, forward-looking, international, and diversified, and building a full value chain platform of "display docking transaction cooperation".

Breaking through the time and space limitations of traditional exhibitions, NEPCON ASIA 2025 innovatively launches the "365 Day Marketing New Plan": pre exhibition online procurement and distribution meetings are held to lock in high-quality buyer demand, and "high growth application industry roadshows" are held to deeply cultivate regional markets; During the three-day exhibition, seven sub themes including AI, embodied robots, and low altitude flying will be launched, integrating booth communication, exclusive tours, and VIP negotiations; Forming a three-dimensional expansion network that combines points and surfaces, helping enterprises break through bottlenecks and unlock the password for business growth.

Scope

SMT technology and equipment SMT equipment and accessories, printing equipment and accessories, packaging equipment and accessories, component feeding systems, production line tools and equipment, automatic plug-in machines, other SMT technology and equipment, etc
Welding equipment, soldering robots, soldering iron tips/soldering stations and repair equipment, tin slag reduction/smoke purification, other welding equipment&accessories, cleaning equipment, etc
Testing and Measurement Equipment AOI Equipment, SPI Equipment, X-Ray Equipment, Online Testing Equipment, PCB Visual Inspection Equipment, Optical Microscope, Temperature, Humidity Testing/Environmental Testing Equipment, Functional Testing Equipment&Accessories, 2D/3D Testing Systems, Bare Board Testing Equipment, Electronic Component Visual Inspection Equipment, Other Testing and Measurement Equipment, Accessories
Glue dispensing and spraying equipment, glue dispensing machines, spraying and coating equipment, glue injection equipment, other glue dispensing and spraying equipment, etc
Electronic materials&anti-static soldering materials, adhesives, cleaning materials, tin slag reducing agents, antioxidants, industrial gases, other materials, auxiliary materials, electronic metal materials, anti-static equipment&materials, etc
Other surface mount technology assembly tools, barcode equipment and materials, laser processing equipment, storage equipment, vibrating discs/feeders, IC burning/UV curing/encoders, electronic outsourcing services, etc
Industrial robots such as Delta robots, Scara robots, articulated robots, Cartesian robots, cleanroom robots, etc
Motion control equipment, servo motors and frequency converters, control systems PLC、SCADA、 Industrial computer communication, network and fieldbus systems, embedded systems, industrial automation data acquisition and identification systems, etc
Machine vision and sensing technology includes black and white/color intelligent cameras, color capture cards, industrial lenses, industrial cameras, intelligent cameras, light source systems, image processing systems, machine vision integrated systems, image processing software, ranging sensors, positioning sensors, 3D sensors, optical sensors, induction switches, fiber optic sensors, special sensors, linear detection sensors, photoelectric sensors, encoders, angle sensors, pressure sensors, temperature sensors, flow sensors/flow meters, etc
Assembly and handling systems for transmission/pneumatic equipment&accessories, couplings, ball screws, linear slides, bearings, linear motors, linear brakes, precision positioning workbenches, buffers, belts, drag chains, clamps, directional control valves, cylinders, swing cylinders/air claws, vacuum components, compressed air purification components, industrial filters, modular F.R.L./pressure control components, lubrication components, pipelines and pipe joints, drive control components, mufflers/exhaust cleaners/spray guns/pressure gauges, sensors/static eliminators, fluid control components, temperature controllers, electric actuators/electric cylinders, clean/low dust/copper ion/fluoride ion free, etc
Automation supporting equipment/accessories, screws/washers, aluminum alloy profiles/pipes, modules/devices, connectors, signal lights and speakers, universal balls/casters, universal joints, industrial chassis, installation systems, relays, circuit breakers, transformers, HMI human-machine interfaces, fans, power supplies, etc
System integration includes automated warehousing and logistics, automated assembly, automated testing, robotic arm grasping, automatic loading and unloading, screw insertion, automated packaging, clamping/fixture technology, dismantling machine, flipping machine, etc
Introduction of NPI new products for industrial automation information technology and control software, PLM product lifecycle management, MES manufacturing execution system, ERP enterprise resource planning, SCM supply chain management, DFM manufacturability analysis, etc
Hardboard single panel, double-sided board, multi-layer board, packaging substrate, other types of circuit boards, etc
Soft board single/double-layer soft board, multi-layer soft board, etc
Soft hard composite board, soft hard plywood, etc
Chemical etching solution, lamination process, electroplating chemicals, ink, dry film, surface treatment, others, etc
Raw materials include rigid copper-clad laminates, flexible copper-clad laminates, copper foils, lamination processes, drilling, and others
Special equipment preparation, material issuing process, inner/outer layer process, pressing process, drilling/punching, electroplating equipment, surface treatment equipment, solder mask/screen printing equipment, forming equipment, testing equipment, cutting, automatic patching and strengthening machine, others, etc
Packaging equipment
PCB automation equipment
Environmental treatment equipment

Costs & Precautions

Please contact the exhibition organizer before participating in the exhibition to confirm.

2025 Asia Electronic Production Equipment and Microelectronics Industry Exhibition - www.globalomp.com

2025 Asia Electronic Production Equipment and Microelectronics Industry Exhibition - www.globalomp.com


Contact

  • Telephone:021-2231 7010
  • E-mail:julia.gu@rxglobal.com
  • Address:303, Building 3, Kerry Plaza, 1-1 Zhongxin 4th Road, Futian District, Shenzhen

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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