2026 Shenzhen International Electronic Product Packaging and Materials Exhibition

Shenzhen International Electronic Product Packaging and Materials Exhibition2026

Basic Information

Date: April 9-11, 2026

Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction

In today's rapidly developing technology, the development of electronic products has become one of the means to evaluate the level of technology. The continuous development of electronic products has led to the rapid growth of the electronic packaging industry. Compared to other product packaging, electronic product packaging is clearly more sophisticated. Most electronic products are composed of precision electronic components that cannot be dropped or bumped. Moisture, static electricity, and compression can all cause damage to the products during transportation. Therefore, in addition to designing exquisite and atmospheric packaging for electronic products, it is also necessary to ensure that the products are not affected by external factors.

As a consistent style in China characterized by clear themes, prominent features, emphasis on effectiveness, and continuous innovation, its popularity and influence in the industry are increasing day by day. Industry insiders have regarded it as the best platform for "understanding industry information, grasping market trends, showcasing corporate brands, expanding trade channels, and seeking cooperation opportunities". The good results of the exhibition have won praise and favor from numerous exhibitors and visitors.

Schedule arrangement

Registration and Exhibition:

Report Exhibition: April 7-8, 2026

Exhibition Display: April 9-11, 2026

Opening Date: April 9th, 2026

Demolition date: April 11, 2026

Scope of Exhibition

1. Electronic packaging carrier tapes and cover tapes: PC, PS, PET and other electronic packaging carrier tapes (packaging tapes), cover tapes (upper and lower sealing tapes), roll tapes, rubber wheels, paper wheels, disks, electronic packaging tubes and injection trays (rubber trays), SMT, A/I receiving film, plastic sheets, cylinders, vacuum formed trays, anti-static or conductive carrier disks, etc.

2. Electronic adhesive products and films; Including adhesive tape (single/double-sided), protective film, optical film (diffusion film, diffuser film, reflective film, etc.), high-performance film (PETPC, etc.), labels, foam and related die-cutting materials and processing; Encapsulation film, mucous membrane, hot melt adhesive, sealant, packing tape, wrapping film, etc.

3. Electronic assembly auxiliary materials: various insulation, conductive, and shielding materials used in the electronic manufacturing process, including electronic assembly auxiliary material products for buffering, shock resistance, anti slip, dust prevention, sealing, light avoidance, sound absorption and insulation, protective materials, filling materials, pulp molding, etc.

4. Anti static and clean packaging materials: anti-static, electromagnetic radiation products, foam plastic, pearl wool, conductive sheet, anti-static sheet; Plastic bags, vacuum formed bags, acid and alkali resistant, anti-static bags, conductive bags; Clean&dust-free products, wiping cloth (paper), dust-free paper, dust-free cloth, etc.

5. Electronic packaging related equipment and parts: carrier tape forming equipment, semi/fully automatic tape loading machine, surface mount tape machine, film machine, tensile tester; Mold making equipment, mold design; Electronic component packaging (assembly, placement) bonding machine, surface mount machine, SMT production equipment, plug-in assembly equipment, semi-automatic packaging machine; Coating and composite stretching technology; SMD packaging machines, semiconductor packaging related equipment, laser cutting machines; Plastic machinery, plastic packaging production lines, anti-static equipment, slitting machines, rewinding machines, tape forming machines, packaging machines, etc

6. Packaging materials: outer and inner packaging materials, plastic packaging materials, metal packaging materials, composite packaging materials, color printed plastic bags, EPE rolls, pearl bread bags, bubble bags, PE film bags, sheets, bubble bags, wrapping films, static discharge bags, other packaging materials, labels, etc.

7. Others: electronic packaging design systems, semiconductor assembly and testing services, packaging services, etc;

Contact Us

Contact: Mr. Zhang 136-3660-4883 (same as WeChat)

2026 Shenzhen International Electronic Product Packaging and Materials Exhibition

• Truename:Mr. Zhang
• Mobile:13636604883
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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