2026 China (Shenzhen) International Semiconductor Exhibition | Semiconductor Device Exhibition | Semiconductor Materials and Equipment Exhibition

Date: June 10-12, 2026 Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

The 2026 China (Shenzhen) International Semiconductor Exhibition and Semiconductor Materials and Equipment Exhibition will grandly kick off at the Shenzhen International Convention and Exhibition Center next year.
The theme of this exhibition is "Xinju Shenzhen · Intelligent Innovation for the Future", focusing on the entire industry chain of semiconductor materials, equipment, manufacturing, packaging and testing. According to search results, the Shenzhen International Semiconductor Exhibition has been successfully held for multiple sessions, and the 2026 exhibition will undergo a comprehensive upgrade based on previous editions. The exhibition will set up eight themed exhibition areas: semiconductor materials exhibition area, semiconductor equipment exhibition area, integrated circuit design exhibition area, manufacturing and packaging testing exhibition area, third-generation semiconductor area, semiconductor application solution exhibition area, industry university research cooperation area, and international exhibition group area. Among them, semiconductor materials and equipment, as the foundation of the industry, will become the key display content of the exhibition.

In the field of semiconductor materials, the exhibition is expected to gather the world's top suppliers of silicon materials, compound semiconductor materials, photoresist, electronic gases, wet electronic chemicals, and more. According to industry analysis, as the localization process of China's semiconductor industry chain accelerates, the domestic semiconductor material market is expected to exceed 150 billion yuan by 2026. The exhibition will specially set up a "Domestic Material Innovation Achievement Exhibition" to showcase the latest breakthroughs of domestic enterprises in key material fields such as 12 inch silicon wafers, high-purity electronic specialty gases, and photoresist. Material companies from Shanghai, Beijing, Jiangsu and other places will bring their latest research and development achievements, and some product technical parameters have reached the international leading level.
The semiconductor equipment exhibition area is also worth looking forward to. According to search data, the Chinese semiconductor equipment market has maintained an average annual growth rate of over 20% in recent years, and the market size is expected to exceed 30 billion US dollars by 2026. The exhibition will gather well-known equipment manufacturers from home and abroad, showcasing a full range of semiconductor manufacturing equipment including lithography machines, etching equipment, thin film deposition equipment, detection equipment, and more. It is worth mentioning that leading domestic equipment companies plan to release multiple key equipment with independent intellectual property rights for processes of 28 nanometers and below during the exhibition, marking significant progress in the localization of semiconductor equipment in China. International equipment giants from the Netherlands, Japan, the United States, and other countries will also showcase their latest products, presenting the forefront of global semiconductor equipment technology to the audience.

Exhibition scope:
1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;
3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;
4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;
5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;
6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;
7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;
8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc;

The third generation semiconductor zone will be a major highlight of this exhibition. With the rapid development of industries such as new energy vehicles, 5G communication, and photovoltaic energy storage, the demand for wide bandgap semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) has surged. The exhibition is expected to attract more than 50 third-generation semiconductor industry chain enterprises to participate, covering the entire process of substrate materials, epitaxial growth, device design, module packaging, etc. Multiple companies plan to release new generation SiC power devices and GaN RF devices during the exhibition, with performance indicators expected to reach international advanced levels. The "Third Generation Semiconductor Industry Development Forum" held at the same time will invite well-known domestic and foreign experts to conduct in-depth discussions on topics such as technology routes and market applications.
For semiconductor industry practitioners, the 2026 China (Shenzhen) International Semiconductor Exhibition will be a rare industry event. Whether it's learning about the latest technological trends, seeking business cooperation opportunities, expanding industry networks, or grasping market trends, exhibitions will provide an excellent platform. As the exhibition date approaches, more exciting content and heavyweight events will be announced one after another, which is worthy of continuous attention and anticipation from the industry.

Exhibition scope:
1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;
3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;
4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;
5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;
6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;
7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;
8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc

• Company:Duande Exhibition (Shanghai) Co., Ltd
• Telephone:13524988985
• Mobile:13524988985
• Address:Shenzhen International Exhibition Center

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