From April 9th to 11th, 2026, the Shenzhen International Expo Center will host a top-level event in the global electronic components field - the Shenzhen International Electronic Components Exhibition. As a barometer of China's electronic information industry, this exhibition is expected to attract 800 exhibitors, cover an exhibition area of 50000 square meters, and welcome over 90000 professional visitors. It focuses on cutting-edge technologies such as semiconductors, advanced materials, and intelligent manufacturing, showcasing innovative achievements in the electronic components industry chain in all aspects.

Concurrent Events

During the exhibition, multiple summit forums will be held, with topics including:

Prospect of the 15th Five Year Plan for the Electronic Industry: Exploring the Path of China's Semiconductor Independent Innovation from 2026 to 2030.

Carbon based materials and advanced packaging technology: Analyzing the potential application of diamond semiconductors in high-temperature and high-pressure scenarios.

International Cooperation Roundtable: Promoting the establishment of a diversified global supply chain ecosystem.

Exhibition value

Supply and demand docking: Facing the procurement needs of terminal manufacturers such as Huawei and BYD.

Technical direction: The localization progress of bottleneck materials such as luminescent adhesives and sputtering targets.

Policy interpretation: Obtain special support information from the government for the integrated circuit industry.

As a hub and innovation center for electronic components in China, Shenzhen will provide an excellent platform for practitioners to gain insights into industry trends and seize market opportunities at this exhibition.

Exhibition Highlights

1. Full industry chain coverage:

From semiconductor equipment (such as lithography machines, etching machines), wafer manufacturing and packaging technology, to supporting services such as IC design and testing probe stations, the exhibition covers the entire upstream and downstream semiconductor industry chain. Of particular note are the breakthroughs in the application of third-generation semiconductor materials such as silicon carbide and diamond semiconductors, as well as high-performance component solutions in fields such as 5G communication and new energy vehicles.

2. Emerging technology driven demand:

With the commercialization of 5G, the popularization of the Internet of Things, and the explosion of new energy vehicles, the demand for RF components, sensors, and power semiconductors in the market has surged. The exhibition has set up a "Future Industry Zone" to showcase core components for scenarios such as smart homes, Industry 4.0, and autonomous driving, such as high-speed connectors, microcontrollers, and in car chip modules.

3. Supply chain restructuring and localization trend:

In the face of global supply chain fluctuations, the exhibition focuses on "localized production" and "digital upgrading". Multiple companies will release localization alternative solutions, share practical experience in optimizing supply chains through AI and big data, and help the industry cope with geopolitical and production capacity challenges.

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