May 22-24, 2026, Hefei Binhu International Convention and Exhibition Center

In the current era of technology surging forward, the semiconductor industry, as a strategic high ground of global economic and technological competition, is driving the giant wheel of digital transformation forward with great force. From the rapid expansion of 5G communication networks to the flourishing rise of artificial intelligence; From the strong rise of the new energy vehicle industry to the accelerated arrival of the Internet of Things era, semiconductor technology is like a magical catalyst, injecting continuous vitality into innovative development in various fields, deeply reshaping people's way of life and work, and becoming a key driving force for global economic growth and social progress.

Anhui, with its unique advantages, has taken the lead in the development of the semiconductor industry and is gradually becoming an important growth pole for China's semiconductor industry. The Anhui Provincial Government attaches great importance to the development of the semiconductor industry and has introduced a series of unprecedented support policies, setting up special industry funds to provide solid and powerful policy guarantees and financial support for semiconductor enterprises in key areas such as technology research and development, project implementation, and talent introduction, creating a favorable policy environment for industrial development. Anhui is located in the hinterland of the Yangtze River Delta, relying on the national strategy of integrated development in the Yangtze River Delta. This exhibition will fully play its platform role, deeply promote the deep integration of high-tech enterprises such as semiconductors and integrated circuits in the Yangtze River Delta region, assist in the construction of the technology industry center in the core area of the Yangtze River Delta Economic Belt, promote the introduction of advanced technology and equipment in the semiconductor field at home and abroad, and promote the high-quality development of the semiconductor industry in the Yangtze River Delta region. Not only can it conveniently and efficiently connect with the rich technology, capital, and vast market resources in Shanghai, Jiangsu, Zhejiang, and other places, seize the opportunity in regional collaborative innovation and development, accelerate the aggregation and integration of industrial resources, but it also takes the exhibition as an opportunity to deepen regional industrial collaboration.

The 2026 China (Anhui) International Semiconductor and Integrated Circuit Industry Exhibition will grandly open from May 22-24, 2026 at the Binhu International Convention and Exhibition Center in Hefei. At the exhibition site, there is a dazzling array of cutting-edge technologies and innovative products. From the ingenious conception of chip design to the meticulous craftsmanship of manufacturing processes; From the pursuit of excellence in packaging testing to the innovation of equipment materials, we present the development achievements and latest trends of the semiconductor industry in all aspects. Not only that, a variety of forums, seminars, and technical exchange meetings are being held simultaneously. Guests from all walks of life, including industry, academia, and research, express their opinions and jointly explore the challenges and opportunities faced by the industry's development, accurately assess the pulse of industry development, and consolidate consensus for moving forward.

Exhibition Scope

1. Ic Design/Chip Zone

EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, artificial intelligence chips, power management chips, IoT chips, 5G communication chips and solutions, automotive electronic chips, security control chips, mixed signal communication RF chips, storage chips, LED lighting and display driver chips, etc;

2. Wafer Manufacturing and Packaging Zone:

Wafer manufacturing, SiP advanced packaging OSATs、 EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and testing, and packaging testing EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

3. Integrated Circuit Manufacturing Zone

Manufacturing of wafer fabs, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuits;

4. Third Generation Semiconductor Zone

Third generation semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED, laser LD, detector UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.

5. Semiconductor Materials Zone

Silicon wafers, silicon chips, photoresists, wafer tapes, photomasks, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials, slicing, grinding, polishing, thin films, silicon wafers and silicon-based materials, photomask templates, high-purity gases, electronic specialty gases, wet electronic chemicals, photoresists and their supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, fluids, valves, etc; 6. Equipment Manufacturing Zone

Thinning machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD, PECVD equipment, coating and developing machine, detection equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, water treatment, etc;

7. Packaging Testing Zone

Packaging and testing equipment, packaging and testing process line enterprises, testing probe stations, testing machines, sorting machines, packaging equipment, packaging substrates, lead frame bonding wires, etc;

8. Electronic Components Zone

Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates for printed circuits, electronic functional process specific materials, electronic adhesive (tape) components, electronic chemical materials and parts, etc;

9. AI+5G Zone

Industrial Internet platform, intelligent robot, smart factory, smart car networking, smart phone, intelligent transportation, aerospace electronics, smart home appliances, UAV, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc;

10. Smart Power Zone

Microwave RF, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc;

11. Comprehensive exhibition area

Government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc.

professional visitor

1. Senior leaders and technical leaders of integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment and other upstream and downstream enterprises in the semiconductor industry, as well as technology and equipment research and development and production enterprises, distributors, agents, service providers, traders, etc;

2. 5G applications, big data, Internet of Things, intelligent connected vehicles, intelligent driving, automotive electronics, vehicle and automotive parts factories, lithium batteries, next-generation computing, consumer electronics, new energy, artificial intelligence computing infrastructure, intelligent equipment and robots, etc;

3. Senior leaders and technical leaders of terminal application enterprises such as aerospace, defense and military industry, radar, medical, photovoltaic, optical communication, and optical modules;

Park: Demonstration Zone, Industrial Park, Science and Technology Park, Entrepreneurship Park, etc.

Industry chain enterprises: financial companies, investment companies, technology development companies, e-commerce platforms, cultural and tourism companies and other industry related enterprises involved in the field of integrated circuits.

4. Representatives from government departments, industry associations/societies, and research institutes;

5 mainstream/professional media professionals and semiconductor investment and financial institutions.

Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiao（lady）

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

May 22-24, 2026, Hefei Binhu International Convention and Exhibition Center

In the current era of technology surging forward, the semiconductor industry, as a strategic high ground of global economic and technological competition, is driving the giant wheel of digital transformation forward with great force. From the rapid expansion of 5G communication networks to the flourishing rise of artificial intelligence; From the strong rise of the new energy vehicle industry to the accelerated arrival of the Internet of Things era, semiconductor technology is like a magical catalyst, injecting continuous vitality into innovative development in various fields, deeply reshaping people's way of life and work, and becoming a key driving force for global economic growth and social progress.

Anhui, with its unique advantages, has taken the lead in the development of the semiconductor industry and is gradually becoming an important growth pole for China's semiconductor industry. The Anhui Provincial Government attaches great importance to the development of the semiconductor industry and has introduced a series of unprecedented support policies, setting up special industry funds to provide solid and powerful policy guarantees and financial support for semiconductor enterprises in key areas such as technology research and development, project implementation, and talent introduction, creating a favorable policy environment for industrial development. Anhui is located in the hinterland of the Yangtze River Delta, relying on the national strategy of integrated development in the Yangtze River Delta. This exhibition will fully play its platform role, deeply promote the deep integration of high-tech enterprises such as semiconductors and integrated circuits in the Yangtze River Delta region, assist in the construction of the technology industry center in the core area of the Yangtze River Delta Economic Belt, promote the introduction of advanced technology and equipment in the semiconductor field at home and abroad, and promote the high-quality development of the semiconductor industry in the Yangtze River Delta region. Not only can it conveniently and efficiently connect with the rich technology, capital, and vast market resources in Shanghai, Jiangsu, Zhejiang, and other places, seize the opportunity in regional collaborative innovation and development, accelerate the aggregation and integration of industrial resources, but it also takes the exhibition as an opportunity to deepen regional industrial collaboration.

The 2026 China (Anhui) International Semiconductor and Integrated Circuit Industry Exhibition will grandly open from May 22-24, 2026 at the Binhu International Convention and Exhibition Center in Hefei. At the exhibition site, there is a dazzling array of cutting-edge technologies and innovative products. From the ingenious conception of chip design to the meticulous craftsmanship of manufacturing processes; From the pursuit of excellence in packaging testing to the innovation of equipment materials, we present the development achievements and latest trends of the semiconductor industry in all aspects. Not only that, a variety of forums, seminars, and technical exchange meetings are being held simultaneously. Guests from all walks of life, including industry, academia, and research, express their opinions and jointly explore the challenges and opportunities faced by the industry's development, accurately assess the pulse of industry development, and consolidate consensus for moving forward.

Exhibition Scope

1. Ic Design/Chip Zone

EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, artificial intelligence chips, power management chips, IoT chips, 5G communication chips and solutions, automotive electronic chips, security control chips, mixed signal communication RF chips, storage chips, LED lighting and display driver chips, etc;

2. Wafer Manufacturing and Packaging Zone:

Wafer manufacturing, SiP advanced packaging OSATs、 EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and testing, and packaging testing EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

3. Integrated Circuit Manufacturing Zone

Manufacturing of wafer fabs, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuits;

4. Third Generation Semiconductor Zone

Third generation semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED, laser LD, detector UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.

5. Semiconductor Materials Zone

Silicon wafers, silicon chips, photoresists, wafer tapes, photomasks, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials, slicing, grinding, polishing, thin films, silicon wafers and silicon-based materials, photomask templates, high-purity gases, electronic specialty gases, wet electronic chemicals, photoresists and their supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, fluids, valves, etc; 6. Equipment Manufacturing Zone

Thinning machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD, PECVD equipment, coating and developing machine, detection equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, water treatment, etc;

7. Packaging Testing Zone

Packaging and testing equipment, packaging and testing process line enterprises, testing probe stations, testing machines, sorting machines, packaging equipment, packaging substrates, lead frame bonding wires, etc;

8. Electronic Components Zone

Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates for printed circuits, electronic functional process specific materials, electronic adhesive (tape) components, electronic chemical materials and parts, etc;

9. AI+5G Zone

Industrial Internet platform, intelligent robot, smart factory, smart car networking, smart phone, intelligent transportation, aerospace electronics, smart home appliances, UAV, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc;

10. Smart Power Zone

Microwave RF, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc;

11. Comprehensive exhibition area

Government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc.

professional visitor

1. Senior leaders and technical leaders of integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment and other upstream and downstream enterprises in the semiconductor industry, as well as technology and equipment research and development and production enterprises, distributors, agents, service providers, traders, etc;

2. 5G applications, big data, Internet of Things, intelligent connected vehicles, intelligent driving, automotive electronics, vehicle and automotive parts factories, lithium batteries, next-generation computing, consumer electronics, new energy, artificial intelligence computing infrastructure, intelligent equipment and robots, etc;

3. Senior leaders and technical leaders of terminal application enterprises such as aerospace, defense and military industry, radar, medical, photovoltaic, optical communication, and optical modules;

Park: Demonstration Zone, Industrial Park, Science and Technology Park, Entrepreneurship Park, etc.

Industry chain enterprises: financial companies, investment companies, technology development companies, e-commerce platforms, cultural and tourism companies and other industry related enterprises involved in the field of integrated circuits.

4. Representatives from government departments, industry associations/societies, and research institutes;

5 mainstream/professional media professionals and semiconductor investment and financial institutions.

Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiao（lady）

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870