Exhibition Overview
The 2026 Shenzhen International Electronic Components Exhibition will be held grandly at the Shenzhen International Expo Center from April 9th to 11th, with an expected exhibition area of 50000 square meters, attracting 800 exhibitors and 90000 professional visitors. As a benchmark exhibition in the field of electronic components in China, it will comprehensively showcase innovative achievements across the entire industry chain, from integrated circuits and semiconductor discrete devices to sensors and electronic materials.

Three core highlights

1. Frontier technologies make a concentrated appearance
   Focusing on emerging fields such as 5G communication, Internet of Things, and new energy vehicles, the exhibition has set up special exhibition areas for high-performance chips, RF components, MEMS sensors, and more. Products such as power semiconductors and automotive electronic components will demonstrate the trend of technological integration between "new infrastructure" and "intelligent driving".

2. Supply chain ecological reconstruction
   In the face of the new global landscape, the exhibition has specially set up a "Supply Chain Security and Digitalization" themed forum, gathering top enterprises to share localized production and intelligent logistics solutions, and helping enterprises build resilient supply chain systems.

3. Deep interaction between industry, academia and research
   The Chinese Instrumentation Society will organize over 20 technical seminars covering hot topics such as third-generation semiconductors and electronic ceramic new materials. The digital transformation case of previous exhibiting companies such as Hongrun Instrument will provide a model for transformation and upgrading for small and medium-sized enterprises.

Perspective on Exhibition Value

• Procurement dockingCovering 7 major categories, including basic components such as PCB, connectors, electromagnetic shielding materials, etc

• Trend Insight15 Industry Summits Interpret the Roadmap of Electronic Component Technology during the 15th Five Year Plan Period

• Cross border opportunitiesThe demand side of application scenarios such as smart cities and Industry 4.0 will have face-to-face communication with suppliers

Exhibition scope:

1. Integrated Circuit:

Microprocessors, logic ICs, memory, analog ICs, etc;

2. Semiconductor discrete devices:

Diodes, transistors, thyristors, etc;

3. Passive components:

Resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

4. Wiring harness/connector:

Various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

5. Sensor components:

New MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, etc;

6. Equipment and instruments:

Electronic devices and intelligent manufacturing, instruments and electronic tools, etc;

7. Electronic materials:

Semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

• Company:China Electronics Equipment Co., Ltd
• Telephone:18538304525
• Truename:Zhang Han
• Mobile:18538304525
• Address:Shenzhen Convention and Exhibition Center

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