2026 Shenzhen International Electronic Packaging and Testing Exhibition

Shenzhen International Electronic Packaging Test Exhibition

Basic information

Date: April 9-11, 2026

Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction

Today, China has become one of the world's largest manufacturers of electronic information products. Many world-renowned electronic companies are transferring a large amount of primary and secondary packaging to China for production. Nowadays, packaging testing and sintering skills have evolved into semiconductor LED、 A pearl in the field of electronics, it is an indispensable process after the production of integrated circuit chips, and a bridge from devices to systems. To provide a platform for information exchange, market development, business decision-making, product display, and technology development for our industry and upstream and downstream industries, and to build bridges for enterprises, institutions, research institutes, and universities.

Modern electronic information technology is developing rapidly, and electronic products are moving towards miniaturization, portability, and multifunctionality Electronic packaging and technology enable electronic devices to ultimately become functional products We have developed various new packaging materials, technologies, and processes Electronic packaging is driving the development of the information society together with electronic design and manufacturing. In recent years, the development of packaging has been showing a rapid growth trend Electronic packaging is used to carry electronic components and their connecting circuits, and has good electrical insulation properties Packaging provides mechanical support and environmental protection for chips, playing an important role in the thermal performance and reliability of devices and circuits. In order to promote the healthy and orderly development of the electronic packaging industry, and to build a high-end commercial platform integrating product display, trade procurement, technical exchange and cooperation, the "2026 Shenzhen International Electronic Packaging Testing Exhibition" will be held at the Shenzhen Convention and Exhibition Center from April 9-11, 2026. After years of development, it has become a significant event in the electronic packaging industry at home and abroad. We sincerely invite you to participate in this exhibition.

Schedule arrangement

Registration and Exhibition:

Report Exhibition: April 7-8, 2026

Exhibition Display: April 9-11, 2026

Opening Date: April 9th, 2026

Demolition date: April 11, 2026

Scope of Exhibits

1、 Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering related products and technologies, etc;

2、 Advanced packaging and system integration: ball grid array packaging, chip level packaging, flip chip, wafer level packaging, 3D integration, and various other advanced packaging and system integration technologies;

3、 Packaging materials and processes: interconnect materials such as keys and wires, solder balls, solder paste, conductive adhesives, etc; Underchip fillers, adhesives, thin film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials, and other new materials that can achieve high packaging performance and reduce costs; And various packaging and assembly processes, etc;

4、 Packaging design and simulation: various new packaging/assembly designs; Modeling, simulation, and verification methods for electrical, thermal, optical, and mechanical characteristics of electronic packaging; Multi scale and multi physics modeling, etc;

5、 Packaging in emerging fields: packaging technologies for sensors, actuators, microelectromechanical systems, nanoelectromechanical systems, and micro electromechanical systems; Optoelectronic packaging, CMOS image sensor packaging; The application of packaging and integration technology in emerging fields such as liquid crystal displays, passive components, RF, power and high-voltage devices, and nanodevices;

6、 High density substrate and assembly technology: embedded passive and active component substrate technology; High density interconnect substrates, printed circuit boards, high-density high-performance substrates; And various new substrate technologies that can improve substrate density and performance;

Contact Us

Contact: Mr. Zhang 136-3660-4883 (same as WeChat)

2026 Shenzhen International Electronic Packaging and Testing Exhibition

• Truename:Mr. Zhang
• Mobile:13636604883
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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