Exhibition Overview

Exhibition Name: 2025 China (Shanghai) International Semiconductor Exhibition

Exhibition time: November 5-7, 2025

Forum time: November 5-7, 2025

Exhibition location: Shanghai New International Expo Center

Exhibition scale: 50000 square meters, 800 exhibitors, 90000 professional visitors

Exhibition Profile

The semiconductor sales in the Chinese market account for one-third of the world's total, the largest share, equivalent to the sum of the United States, the European Union, and Japan. However, this is mainly because China is the center of global manufacturing, especially the largest producer of computers and mobile phones, consuming the most chips. With the rapid development of artificial intelligence and the promotion of strategic emerging industries such as 5G, Internet of Things, energy conservation and environmental protection, and new energy vehicles, the demand for semiconductors continues to increase. It is expected that the demand scale of China's semiconductor market will further expand by 2025, and the market demand scale is expected to reach 198.5 billion yuan. In order to better promote communication and interaction in the semiconductor industry and enhance its internationalization level, the "2025 China (Shanghai) International Semiconductor Exhibition (CDISEE-2025)" will be held from November 5-7, 2025 at the Shanghai New International Expo Center. CDISEE-2025 is divided into three major sections: exhibitions, summit forums, and academic conferences. It is an annual event for the semiconductor industry and a comprehensive professional exhibition platform for communication and cooperation between the semiconductor industry and related industries.

Simultaneous activities: During the exhibition, multiple forums and events will be held, including the China Semiconductor Development Summit Forum, China Electronic Circuit Application Development Forum, New Product and New Technology Launch Conference, and Buyer Meeting. Through the organization of high-end seminars focusing on the forefront of the industry, various on-site interactive activities, and practical and efficient professional buyer matchmaking meetings, the rich exhibition content will convey the latest and most comprehensive industry information to industry insiders and all sectors.

The investment promotion for the exhibition is currently underway. If you are interested in participating, please contact us as soon as possible. Book in advance to enjoy the main channel or standard double opening position!

Display content:

Chip and chip design

IC and related electronic product design EDA、 Communication chips, storage chips, CPU chips, sensor chips, analog chips, digital chips, digital signal processing chips, power management and power chips, digital multimedia chips, RF chips, driver chips, etc;

AI computing power

AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

Semiconductor Equipment

Manufacturing equipment such as annealing furnaces, etching machines, ion implantation equipment, thin film deposition equipment, lithography machines, coating and developing machines, wet processing equipment, wafer inspection, etc; Equipment such as cutting machines, wire bonding machines, baking ovens, wire bonding machines, surface mount machines, solidification machines, grinding machines, etc; Failure analysis instruments, functional testing systems, detection equipment, microscopes, test chambers, and other inspection and testing equipment; Assembly equipment, processing equipment, facilities, pollution control equipment, cleaning equipment, laser equipment, etc;

semiconductor material

Silicon wafers and silicon-based materials, compound semiconductors, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, specialty gases, ultrapure water, encapsulation materials, high-performance plastics, wafers/substrates, etc;

Advanced Packaging

Design, materials, testing, and equipment for flip chip packaging, wafer level packaging, 2.5D packaging, 3D packaging, bump packaging, fanout wafer level packaging, etc;

Semiconductor core components

Machine vision, sensors, seals, precision bearings, metal components, Valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

Wide bandgap semiconductors and power devices

Third generation semiconductor materials including silicon carbide (SiC), gallium nitride (GaN), graphite and carbon materials, and cubic boron nitride (C-BN); Fourth generation semiconductor gallium oxide (Ga2O3), diamond, aluminum nitride (AlN); Wafer, substrate, packaging, testing, optoelectronic devices (light-emitting diode LED, laser LD, detector, UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), equipment and supporting facilities;

• Company:Henan Xinzhan Exhibition Co., Ltd
• Telephone:18538304525
• Truename:Zhang Han
• Mobile:18538304525
• Address:Shanghai New International Expo Center

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870