2025 Shanghai International Semiconductor Technology Exhibition

Date: July 29-31, 2025 Location: Shanghai National Convention and Exhibition Center

Exhibition Introduction

In order to promote the development of the semiconductor industry, enhance industrial innovation capabilities and international competitiveness, drive the transformation of traditional industries and product upgrades, and further promote the sustained, rapid, and healthy development of the national economy, in recent years, the central and local governments have introduced a series of policies to encourage and support the development of the semiconductor industry. With numerous advantages such as huge market demand, rich demographic dividend, stable economic growth, and favorable industrial policy environment, China's semiconductor industry has achieved rapid development. According to statistics from the China Semiconductor Industry Association, the sales revenue of China's semiconductor industry has increased from 788.5 billion yuan in 2017 to 1242.3 billion yuan in 2021, with an average annual compound growth rate of 12%. It is expected that the market size of China's semiconductor industry will reach 1500.9 billion yuan by 2026.

During the 14th Five Year Plan period, China will focus on some key core technologies and cutting-edge basic research in the fields of integrated circuits, software, high-end chips, and new generation semiconductor technology, and provide support through national key research and development plans. We will fully leverage the innovative status of enterprises, promote the deep integration of industry, academia, and research, strengthen the construction of innovation environment and platforms in integrated circuits and other fields, and increase talent training to continuously enhance innovation capabilities. In the future, China will take SiC and GaN materials, which have relatively mature technology and product development, as the entry point to rapidly expand the scale of the third-generation semiconductor industry. Focusing on key links in the third-generation semiconductor industry chain, such as materials, epitaxy, chips, devices, packaging, equipment, and applications, we will strengthen industry university research cooperation, cultivate and attract high-level enterprises through joint ventures and collaborations, promote industrial agglomeration and chain synergy, promote the application of third-generation semiconductors in fields such as power electronics, microwave electronics, and semiconductor lighting, and create a highland for the development of the third-generation semiconductor industry.

The 2025 Shanghai International Semiconductor Technology Exhibition will be held at the Shanghai National Convention and Exhibition Center from July 29 to 31, 2025. It is an international and specialized exhibition platform focused on the semiconductor industry, gathering influential exhibitors in multi chip, wafer manufacturing and packaging, semiconductor specialized equipment and components, advanced materials, third-generation semiconductors/IGBT, automotive semiconductor chip design and manufacturing, integrated circuits, packaging and testing, materials and equipment, etc., to fully showcase the semiconductor industry chain, create a deep technical exchange platform, and through industry trend interpretation, policy guidance and technology sharing, fully tap into new industry development needs, and jointly explore new market opportunities.

Why participate in the exhibition

Leading semiconductor industry resource introduction, enhancing the internationalization of exhibitions

● Gather professional purchasers and create a professional platform for industry exchange and interaction

● Industrial policy support, authoritative exhibition platform

Scope of exhibits

Semiconductor equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition systems, solidification machines, plasma cleaning equipment, cutting machines, mounting machines, bonding machines, wire bonding machines, plastic packaging machines, reflow soldering, wave soldering, testing machines, bending equipment, sorting machines, robot automation, machine vision, other materials and electronic specialized equipment, coupling machines, carrier forming machines, testing equipment, constant temperature and humidity test chambers, sensors, packaging molds, testing fixtures, precision slide tables, stepper motors, valves, probe stations, clean room equipment, water treatment, etc;

IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

Integrated circuit manufacturing: wafer fabs, wafer foundries, analog integrated circuits, digital integrated circuits, hybrid integrated circuit manufacturing, integrated circuit terminal products, etc;

Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, switch and component materials and equipment, etc;

• Telephone:135 2437 8665
• Truename:Mr. Hu
• Mobile:135 2437 8665
• Address:No. 333 Songze Avenue, Qingpu District, Shanghai (North Gate of the Exhibition Hall)

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