- Industry: Industrial / Mechanical / Processing
- Time: 2025/09/10 - 09/12 (Wed To Fri Total 3 Days) Error Correction
- Address: Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhen CityBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
- Sponsor:The Organizing Committee of the 6th and 7th Shenzhen International Semiconductor Technology and Application Exhibition in 2025
- Organizer:The Organizing Committee of the 6th and 7th Shenzhen International Semiconductor Technology and Application Exhibition in 2025
INTRODUCTION
The 7th Shenzhen International Semiconductor Technology and Application Exhibition in 2025
Date: September 10-12, 2025 Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)
Exhibition area: 60000 square meters Exhibition enterprises: 900 professional visitors Expected to reach 70000 people
Exhibition Introduction:
The 7th Shenzhen International Semiconductor Exhibition (SEMI-e) will be held from September 10-12, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall)! This exhibition will focus on various sub sectors of the semiconductor industry, comprehensively showcasing new technologies, products, highlights, and trends in the semiconductor industry. It will gather over 900 exhibitors to showcase third-generation semiconductors such as artificial intelligence, computing power storage, chip design, wafer manufacturing, advanced packaging, semiconductor specialized equipment and components, advanced materials and carbon materials, and silicon carbide/gallium nitride IGBT、 Focusing on power devices, power electronics, and automotive semiconductors, we comprehensively showcase the latest manufacturing and solutions for integrated circuits and semiconductors.
SEMI-e has been deeply involved in the field of semiconductor exhibitions for many years and has developed into one of the most influential professional exhibition platforms in the semiconductor industry. The 7th SEMI-e 2025 Shenzhen International Semiconductor Exhibition is jointly organized by multiple industry associations and will continue to cover an exhibition area of 60000m ². With over 900 exhibitors, it will open up exciting 50+themed activities and is expected to attract more than 70000 industry visitors.
Previous review:
The previous SEMI-e event was held from June 26-28, 2024 at the Shenzhen International Convention and Exhibition Center, in collaboration with Shanghai Huali, Huatian Technology, Tongfu Microelectronics, Shengmei Semiconductor, Tianke Heda, China Electronics Technology 45th Research Institute, Zhonghuan Leading, BYD Semiconductor, Huajin Semiconductor, Nansha Wafer, Northern Huachuang, Shanghai Microelectronics Equipment, Changchuan Technology, Pioneer, Keyence, Saimet, Fangzheng Wei, Taike Tianrun, Beiling Co., Ltd., Shichuang Creative, Aisite, Rilian Technology, Xinqi Microelectronics, Hualin Jiaye, Shunluo Electronics, Zhongke Saifei, Zhicheng Semiconductor, Suzhou Qiqi, Maiwei Technology, Tongguang Co., Ltd., Tianyu Liande Semiconductor, Yujing Machinery, Xichan Microchip, Xinxiang, Zhiying Intelligence, Medview, Global, Youjie, Kaidi Micro, Xinpu, Leiming, Kawasaki Robotics, Xinlai Applied Materials, Micro Group Semiconductor Yujing Technology, Enton Semiconductor, Leibo Microelectronics, Shuocheng Group, Leica, DeKangweier, Yuhuan, Shenwu, Aotewei, Boranrun and other enterprises are fully committed to creating a high-quality industry event.
815+exhibitors showcased their "star" products and presented visitors with new technologies, products, highlights, trends, and innovative solutions for cutting-edge products and technologies in the semiconductor industry during the exhibition, expanding the semiconductor market with full "chip" strength. Facing the increasingly strong market demand, we will jointly explore the development trend of the semiconductor industry.
Scope
Exhibition scope:
Chip and Chip Design Exhibition Area
IC and related electronic product design EDA、 Communication chips, storage chips, CPU chips, sensor chips, analog chips, digital chips, digital signal processing chips, power management and power chips, digital multimedia chips, RF chips, driver chips, etc;
Semiconductor Equipment Exhibition Area
Manufacturing equipment such as annealing furnaces, etching machines, ion implantation equipment, thin film deposition equipment, lithography machines, coating and developing machines, wet processing equipment, wafer inspection, etc; Equipment such as cutting machines, wire bonding machines, baking ovens, wire bonding machines, surface mount machines, solidification machines, grinding machines, etc; Failure analysis instruments, functional testing systems, detection equipment, microscopes, test chambers, and other inspection and testing equipment; Assembly equipment, processing equipment, facilities, pollution control equipment, cleaning equipment, laser equipment, etc;
Semiconductor Materials Exhibition Area
Silicon wafers and silicon-based materials, compound semiconductors, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, specialty gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;
Advanced Packaging Exhibition Area
Design, materials, testing, and equipment for flip chip packaging, wafer level packaging, 2.5D packaging, 3D packaging, bump packaging, fanout wafer level packaging, etc;
Semiconductor Core Components Exhibition Area
Machine vision, sensors, seals, precision bearings, metal components, Valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;
Wide bandgap semiconductor and power device exhibition area
Third generation semiconductor materials including silicon carbide (SiC), gallium nitride (GaN), graphite and carbon materials, and cubic boron nitride (C-BN); Fourth generation semiconductor gallium oxide (Ga2O3), diamond, aluminum nitride (AlN); Wafer, substrate, packaging, testing, optoelectronic devices (light-emitting diode LED, laser LD, detector, UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc;
Costs & Precautions
Contact
- Telephone:130 4566 7762
- Truename:Mr. Hu
- Mobile:130 4566 7762
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870
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