2025 Shenzhen International Third Generation Semiconductor Technology and Packaging Testing Exhibition

Shenzhen Third Generation Semiconductor Technology and Testing Exhibition

essential information

Date: April 9-11, 2025

Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction

The 2025 Shenzhen Third Generation Semiconductor Technology and Packaging Testing Exhibition will be held from April 9-11 at the Shenzhen Convention and Exhibition Center, dedicated to the cooperation of advanced semiconductor devices, packaging testing, process flow, innovative applications, and industrial chains, and building a bridge for communication and collaboration between upstream and material equipment. With the increasing popularity and widespread application of third-generation semiconductor devices, it has brought innovation to the industry. Based on its development in high-speed, small size, low loss, high power, high heat dissipation, and high integration directions, it is increasingly widely used in the consumer electronics and power electronics industries. Advanced packaging materials and reliability technologies are constantly improving, and automotive silicon level devices are constantly being installed. Currently, a full industry chain from materials, devices, packaging, testing, to application has been initially formed. However, the overall technological level is still lagging behind the world's top level, and there is an urgent need to break through the core key technologies of materials, wafers, packaging and testing, processes, applications, and engineering application issues such as reliability and consistency. The content covers the latest developments in third-generation semiconductor devices and packaging technology, focusing on advanced packaging materials and reliability of SiC/GaN power devices, SiC/GaN power device technology, new packaging structure materials for devices, sintered silver interconnect technology, reliability testing of packaging materials, packaging thermal management, thermal and mechanical reliability simulation equipment, to understand the various challenges of high-power power electronic devices and packaging. Inviting leading forces in industry, academia, research and application, well-known experts in the industry, and representatives of enterprises to share special reports, explore the latest progress, and promote the development of third-generation semiconductor devices and packaging technology.

Why visit

Bulk procurement and seeking distribution agency cooperation - providing you with excellent third-generation semiconductor brands and high-quality products worldwide for one-stop procurement, and helping you intuitively understand the strength of the enterprise for smooth trade cooperation

Maintaining important customers, contacting suppliers and distributors - this is a third-generation semiconductor event where industry professionals gather, and it is also a good opportunity for you to meet upstream and downstream enterprises, maintain old customers, and receive new customers

Seeking innovative products and technologies, solutions - Major brands choose to release new products, and concurrent summit forums, new product launches, and promotion events have become the innovation engines of third-generation semiconductors. Here, you can find annual trendy new products that represent trends

Reason for participation

1. Brand attractiveness - showcasing image, enhancing industry status, brand value, visibility, and honor among peers and customers.

2. Market Strategy - Understand market information, expand sales channels, obtain market orders, and maintain sales networks.

3. Establish sales channels for import, wholesale, distribution, group buying, and retail.

4. Get loyal fans of your product and your brand will be followed and promoted by professional and mass media, becoming a star in the product.

Exhibition Highlights

Platform: Create an industry procurement exchange platform;

Understanding: Planning, designing, and constructing new technologies and services for domestic and international products;

Establish: Users can directly access the site and build new customer relationships;

Get to know: Upstream and downstream industry linkage, exciting forums and salons to facilitate close contact between industry experts, colleagues, and users;

Promotion: Through the strong industry accumulation of the main organizer, we provide you with broad market promotion;

Audience invitation

Integrated circuits and third-generation semiconductor materials, devices, packaging and testing, equipment, applications, investment institutions, consumer electronics, industrial control electronics, communication electronics, semiconductor lighting, packaging, testing, automation equipment, automotive electronics, EMS foundries/OEM production and manufacturing, procurement, technology, research and development, media, and more.

Schedule arrangement

Registration and Exhibition:

AM8:30-PM19:30, April 07-08, 2025

Exhibition time:

April 9, 2025 AM9:30-PM16:45

April 10, 2025 AM9:30-PM16:45

April 11, 2025 AM9:30-PM16:45

Exhibition scope

·Third generation semiconductor packaging and testing technology

·Advanced Packaging Materials for SiC Power Devices

·SiC power device process and technology

·Semiconductor materials, processes, innovation, and applications

·New packaging structure materials and sintered silver interconnect technology

·Reliability testing of packaging materials, thermal management of packaging, and reliability simulation equipment

contact us

Contact: Mr. Zhang 150-0190-9485 (same as WeChat)

2025 Shenzhen International Third Generation Semiconductor Technology and Packaging Testing Exhibition

• Truename:Mr. Zhang
• Mobile:15001909485
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870