Shanghai Semiconductor Industry Exhibition -2025 Global Semiconductor Industry (Shanghai) Exhibition

2025Global Semiconductor Industry (Shanghai) Expo

Date: June 11-13, 2025 Location: Shanghai World Expo Exhibition&Convention Center

The 2025 Global Semiconductor Industry (Shanghai) Exhibition (referred to as SEMiSHG) will be held grandly at the Shanghai World Expo Exhibition and Convention Center in June 2025. SEMiSHG will fully leverage the advantages of China's super large market, take artificial intelligence, new energy vehicles, digital transformation and other application needs as the driving force, strengthen cooperation with the global integrated circuit industry, and promote innovative development in all links of the industry chain. Relying on the vast semiconductor application market in the Yangtze River Delta and high-quality resources such as major industrial project clusters led by Shenzhen Shentou, we focus on key areas such as global semiconductor equipment, chips, materials, wafer manufacturing, packaging and testing, design, and application. Join hands with outstanding enterprises, industry organizations, investment institutions, etc., build an industry exchange platform, share cutting-edge technologies, create an industrial ecosystem, and jointly help accelerate the quality development of the semiconductor industry. During the exhibition, domestic and foreign experts and senior professionals will be invited to participate in the 1+N technology activities of the entire industry chain at the Shanghai Semiconductor Industry Exhibition. The theme of this year's Shanghai Chip Expo is "Gathering" Chips, Connecting the World ", with a focus on" New Technologies, New Products, New Solutions, and New Equipment ". We strive to provide the best platform for participating companies to promote products, explore markets, find business opportunities, promote government enterprise cooperation, and understand industry development. Build a diversified communication and service bridge between government, industry, academia, research, application, and capital.

Host: Shanghai Municipal People's Government

Organizer: Donghao Lansheng (Group) Co., Ltd./Shanghai International Technology Import and Export Promotion Center/China Chamber of Commerce for Import and Export of Machinery and Electrical Products

Execution unit: Zhonghao Exhibition (Shanghai) Co., Ltd

Co organizers: Shanghai Science and Technology Exchange Center/Shanghai Science and Technology Entrepreneurship Center/Shanghai Intellectual Property Protection Center

Supporting units: UNESCO United Nations Industrial Development Organization/UNDP United Nations Development Programme/WIPO World Intellectual Property Organization

1. Specially recommended projects

This exhibition will have one exclusive naming unit and two sponsoring units. The organizing committee will provide detailed information upon request;

Main Forum of Shanghai Semiconductor Manufacturing Exhibition: 1.5G/6G and "Shanghai Semiconductor Manufacturing Exhibition" Industry Innovation Application Summit Forum;

2. Yangtze River Delta New Generation Semiconductor Industry Chain Exchange and Cooperation Conference;

3. Global Semiconductor Industry Chain Development Conference;

4. Global Integrated Circuit Industry Innovation Conference

2. Exhibition highlights

As a technology promotion platform in the field of expos, the Shanghai Semiconductor Manufacturing Exhibition Technology Forum will attend experts from multiple fields and give speeches to share cutting-edge technological trends, promote cooperation between government, industry, research, application, academia, and capital, and promote technological innovation and development. Top scientists and academicians, business leaders and executives, research institution leaders, interdisciplinary experts, government officials, industry association leaders, venture capitalists and financial institution executives, internationally renowned experts and scholars gather at the grand event to support the innovative development of the third-generation semiconductor industry. If you have any needs for conference speeches, business inspections, endorsement, technical cooperation, etc., please contact the Shanghai Semiconductor Manufacturing Exhibition Organizing Committee.

Focus on the whole industry chain and create a grand event for industry development at the Shanghai Semiconductor Industry Exhibition

Efficient transformation of various achievements promotes the integration and innovation of industry, academia, and research

Top enterprises concentrate on showcasing innovation and technological innovation across the entire industry

Academician Summit focuses on in-depth analysis and exchange of industry development policies

The layout of the entire industry chain promotes a new breakthrough in the collaborative development of industry applications

Integrating resources from all parties to promote integrated development and create a new situation in the industry

Seize policy opportunities, promote new exhibition plans, and assist enterprise development

Widely promote through media to enhance the visibility and influence of participating enterprises

V supply and procurement precise docking to build an interactive display platform for the development of the Shanghai chip exhibition industry

Building a multi-dimensional communication platform for "government, industry, academia, research, application, and capital" in all aspects

3. Exhibition Promotion

... by inviting domestic and foreign GSIE industry full industry chain merchants in writing

... Organize experts to give special technical lectures

... Organize a special introduction meeting for some well-known enterprises

... a comprehensive promotional campaign, gathering industry target audience groups to promote the plan

... promote participation in exhibitions through various relevant chambers of commerce groups

... promote relevant information of the exhibition through the international Internet, and promote it on professional websites

... conducted through various professional media and institutions at home and abroad

Promote through renowned professional exhibitions both domestically and internationally

... promote and publicize through various government economic and trade related systems

... spread the information of this exhibition to foreign countries through the business embassies in Beijing and Shanghai, and invite foreign industry insiders to exchange and negotiate on-site;

Exhibition scope

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition systems, solidification machines, plasma cleaning equipment, cutting machines, mounting machines, bonding machines, wire bonding machines, plastic packaging machines, reflow soldering, wave soldering, testing machines, bending equipment, sorting machines, robot automation, machine vision, other materials and electronic specialized equipment, coupling machines, carrier forming machines, testing equipment, constant temperature and humidity test chambers, sensors, packaging molds, testing fixtures, precision slide tables, stepper motors, valves, probe stations, clean room equipment, water treatment, etc;

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic devices, display devices, diodes, transistor filtering components, etc.

• Telephone:15317998272
• Truename:organizing committee
• Mobile:15317998272
• Address:No. 1099 Guozhan Road, Pudong New Area, Shanghai

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