2025 China (Shenzhen) International Semiconductor Exhibition

China (Shenzhen) International Semiconductor Exhibition 2025

Date: September 23-25, 2025 Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Development prospects:

The importance of the semiconductor industry is self-evident, as it serves as the foundation for various high-tech upgrades and permeates into various cutting-edge technological fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching up to 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries including semiconductors were included as key industries in its "Made in China 2025" plan for strong support. The National Outline for Promoting the Development of Integrated Circuit Industry stipulates that by 2030, the main links of the integrated circuit industry chain should reach the international advanced level, and a group of enterprises should enter the international first tier.

In addition, the government also invests heavily in supporting the development of the semiconductor industry. Shouldering the heavy responsibility of supporting China's domestic chip industry, the first phase of the National Integrated Circuit Industry Investment Fund, operated by the National Integrated Circuit Industry Investment Fund Co., Ltd., has a registered capital of 98.72 billion yuan and a total investment scale of 138.7 billion yuan. In investment projects, chip manufacturing accounts for 67%, chip design for 17%, packaging and testing for 10%, and equipment and materials for 6%. The registered capital of the second phase of the large fund has reached 204.15 billion yuan. In terms of investment, in addition to continuing to support the manufacturing process, it is expected to focus on the high-end equipment and new materials fields.

In the past few decades, the development of first and second generation semiconductors has enabled large enterprises in Europe, America, Japan, and South Korea. The efforts of the Chinese government and industry are expected to enhance China's position and voice in the latest generation semiconductor field. The huge demand and limited supply capacity have created great space for the development of the semiconductor industry in China. Despite the unpredictable external environment, the semiconductor industry still has long-term development potential, and this trend will continue to persist in the coming years.

In order to better promote the development of the semiconductor industry and with strong support from national regulatory authorities, the 2025 China (Shenzhen) International Semiconductor Exhibition will be held from September 23-25, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). This conference will adhere to the exhibition purpose of "highlighting brands, exploring innovation, and focusing on practical results". With unique creativity, scientific and reasonable integration and communication, and excellent services, it will provide a "high-level, high-grade, and high-quality" exhibition and communication stage for exhibitors with a new concept, and create the largest, most valuable, and authoritative top-level event in the semiconductor industry. We look forward to your participation in this exhibition.

Reason for participation:

Scale advantage, meeting new distributors and buyers: providing strong guarantee for exhibitors' actual exhibition effect. This exhibition is expected to attract over 50000 visitors and adopt a strong global investment promotion model. It will integrate databases from previous exhibitions and focus on inviting semiconductor industry users to visit and negotiate.

Seamless integration, inviting domestic and foreign merchants: There are advertising signs in the exhibition hall, subway stations, and hotels, and more than 500 foreign language professionals are arranged to directly introduce professional buyers involved in the field of this exhibition to our exhibition site for procurement negotiations.

※ Expand the market and consolidate existing market share: Enjoy comprehensive online and offline promotion throughout the year for one exhibition, covering new media such as websites, magazines, newspapers, mobile newspapers, Weibo, WeChat, etc. Multiple surprises for one exhibition. Keeping up with the latest market development trends, sharing and interacting, we have specially organized one-on-one trade matching meetings. We cordially invite purchasing managers from the semiconductor industry, both online and offline, with audiences from over 30 countries and regions around the world to arrange one-on-one meetings and negotiations, which is an excellent way to improve your product sales.

Hundreds of media outlets have been tracking and reporting on the entire process:

This exhibition places great emphasis on shaping and promoting the brand of exhibitors. By inviting central media, mainstream financial media, large portal websites, industry media, and overseas media to provide comprehensive, multi-dimensional, and three-dimensional coverage of exhibitors, it maximizes the promotion of the latest products and technologies to global buyers and creates unlimited business opportunities for exhibitors! This exhibition will invite hundreds of industry media outlets to report on site, including CCTV, Xinhua News Agency, China Business News, China Securities News, Securities Times, Phoenix Net, Sohu, NetEase, Sina, Tencent, etc.

Advantages of the Greater Bay Area:

As China's manufacturing industry has shifted from high-speed growth to high-quality development, since 2013, the Chinese government has successively announced and promoted the "the Belt and Road" initiative and the construction of the "the Belt and Road" Greater Bay Area. The goal is to establish a new economic and trade partnership with countries along the "Belt and Road". At home, through the "Guangdong, Hong Kong and Macao Greater Bay Area", the Chinese government has accelerated the construction of a modern industrial system and multilateral open markets to drive high-quality development through continuous innovation.

The construction of the "Guangdong Hong Kong Macao Greater Bay Area" refers to the development of nine cities in Guangdong Province (including Guangzhou, Shenzhen, Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen and Zhaoqing) and two special administrative regions of Hong Kong and Macao into world-class urban agglomerations and international scientific and technological innovation centers with global influence. By deepening the cooperation between Guangdong, Hong Kong and Macao and giving full play to their respective advantages, the Greater Bay Area will promote the coordinated development of regional economies and become an important support for the "the Belt and Road" to build a new platform for international economic cooperation. The GPD of the Greater Bay Area will reach 11.6 trillion yuan in 2019, and is expected to reach 28.9 trillion yuan by 2030, and squeeze into the world Among the top ten economies

The Guangdong Hong Kong Macao Greater Bay Area gathers high-quality resources from two regions, one province, and nine cities, and will be built into an international science and technology innovation center with global influence, a world-class advanced manufacturing industry, and a strategic emerging industry cluster area. It will become the fourth world-class bay area after New York, San Francisco, and Tokyo in the United States and Japan.

The city cluster with the strongest innovation capability and the most open development potential is a gathering place for traditional manufacturing industries such as automobile manufacturing, new energy vehicles, semiconductors, household appliances, consumer electronics, electronic information and equipment manufacturing, 5G materials, intelligent manufacturing, high-performance materials, energy conservation and environmental protection.

New technology launch conference, new product promotion meeting, and special seminar:

If enterprises need to arrange such activities, please contact the organizing committee of the conference in a timely manner to arrange a better time slot.

★ Each session costs 30000 RMB and lasts for 1 hour (including various supporting facilities and promotional expenses).

Sponsorship Plan:

In order to facilitate well-known enterprises to leverage the international influence of this exhibition, showcase their strength, and enhance their brand image, the organizing committee has specially set up a sponsorship plan for the exhibition. An efficient sponsorship plan will bring you more business opportunities and enhance your participation before, during, and after the exhibition.

Specially designed four levels: Diamond, Platinum, Gold, and Silver (detailed plan available upon request). Sponsors will receive the following benefits:

● Increase contact with target customers through effective market exposure; ● Achieve higher exposure than competitors

● Participate in industry events as a leader in the industry; ● Enhance brand image and awareness

Establish a sales network through a new platform to increase trade opportunities; ● Obtain more information on buyers and professional sellers

Exhibition Tips:

1. Please fill out the "Exhibition Application and Contract" form carefully and stamp it with the official seal before returning it to the organizing committee.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After the remittance, the remittance receipt should be returned to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

Exhibition scope:

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc;

• Telephone:131 5101 0309
• Truename:Mr. Song
• Mobile:131 5101 0309
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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