The 14th Shenzhen International Thermal and Heat Dissipation Materials and Equipment Exhibition (CIME 2025)

2025 International Thermal and Heat Dissipation Development Summit Forum and Shenzhen International Thermal Management Conference

The annual Oscar event for global thermal management, adhesives, and new materials

The 14th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition in 2025

Date: June 25-27, 2025 Location: Shenzhen International Convention and Exhibition Center (Hall 7)

Exhibition area: 20000 square meters | Exhibitors: 500+| Academic presentations: 20 sessions | Professional visitors: 30000 people

Simultaneous exhibitions

The 6th Shenzhen Adhesive, Sealer and Glue Equipment Exhibition in 2025

2025 Shenzhen International Data Center Liquid Cooling Industry Exhibition

Exhibition Introduction

The CIME International Thermal Insulation and Heat Dissipation Exhibition, founded in Shenzhen in 2013, has undergone 11 years of development and resource accumulation, and has become a well-known and authoritative industry event in the field of thermal management thermal insulation and heat dissipation. It has now developed into the June Shenzhen Exhibition and the December Shanghai Exhibition, touring the two places to deeply explore the changes and development of thermal management thermal insulation and heat dissipation with local governments, industry associations, industrial parks, partners, and industry elites, and has received warm responses. As an industry event, CIME Exhibition looks forward to everyone joining hands with CIME Exhibition to continue moving forward together, creating brilliance and providing customers with higher quality, more professional, and more comprehensive one-stop solutions.

With the advancement of consumer electronics, 5G, and artificial intelligence XR、 Against the backdrop of continuous technological penetration and upgrading in fields such as data centers, the Internet of Things, power batteries, energy storage, and Industry 4.0, the miniaturization and continuous increase in power density of electronic devices have led to rapid accumulation of heat energy, weakened safety, and shortened service life. With the continuous advancement of technology, the demand for thermal management, heat conduction, and heat dissipation is also constantly increasing, and the market size is growing exponentially. This has brought enormous potential and commercial cooperation space to the thermal management, heat conduction, and heat dissipation industry.

In order to further promote communication and interaction in the thermal conductivity and heat dissipation industry, strengthen the awareness of communication and cooperation in China's thermal conductivity and heat dissipation industry, and achieve mutual promotion and common development, the 14th Shenzhen International Thermal Conductivity and Heat Dissipation Materials Exhibition and Development Summit Forum, hosted by Bohan Exhibition&Liyue Exhibition, will be held from June 25th to 27th, 2025 at Hall 7 of Shenzhen International Convention and Exhibition Center. The conference aims to establish a communication platform for technical exchange and information exchange in the field of thermal conductive materials, promoting breakthroughs in technology and industrial development in the thermal conductive materials industry. The conference warmly welcomes experts, scholars, researchers, and business representatives from relevant fields at home and abroad to actively participate. At the same time, companies, enterprises, and institutions are welcome to showcase their technological achievements and negotiate cooperation between industry, academia, and research.

Exhibition time:

June 25th, 2025 (Wednesday)/9:00-17:00

June 26, 2025 (Thursday)/9:00-17:00

June 27, 2025 (Friday)/9:00-15:30

Exhibition location:

Shenzhen International Convention and Exhibition Center Hall 7 (Bao'an New Hall) (No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen)

CIME2025 plans to invite purchasing companies

Terminal, operator/solution provider;

Apple | Samsung | Huawei | Nubia | OPPO | Xiaomi | VIVo | Transsion | Microsoft | ZTE | Meizu | Lenovo | TCL | LG | Amazon | Hisense | 360 Mobile | ASUS | China Mobile | China Unicom | China Telecom | Qualcomm, etc

Intelligent hardware;

IFlytek, 360, Wanxing Technology, TCL Technology, Huichuan Technology, Dahua Stock, Zhongke Chuangda, Helitai, Midea Group, Shaoyin Technology, NetEase Youdao, Jiahe Stock, Beisi Technology, Lanhe Technology, Lvmi Lianchuang, Fenda Intelligence, etc

New energy vehicles;

Tesla, BYD, Ideal Automobile, NIO, Xiaopeng Motors, BMW, Aion, Nezha Motors, Jike, AITO, Geely, SAIC, FAW, GAC, BMW, Audi, Dongfeng, Toyota, Honda, Great Wall Motors, etc

Power batteries and energy storage;

CATL 丨 BYD 丨 China Innovation Aviation 丨 Guoxuan High tech 丨 Xinwangda 丨 EVE Energy 丨 Honeycomb Energy 丨 Funeng Technology 丨 LG New Energy 丨 Ruipu Lanjun 丨 Zhongke Electric 丨 Xinwangda 丨 Panasonic 丨 Samsung 丨 Freddie Battery 丨 Bick Battery 丨 Pengwei Energy 丨 Tianneng Battery 丨 Chaowei

Material companies;

Feirongda, Hongfucheng, Bowen Industry, Huitian New Materials, Leizidun, Huijing New Materials, Liqun MediaTek, Zhonglan Chengguang, Zhongshi Technology, Carbon Element Technology, Anjie Technology, Xinlun Technology, Meiqing Technology, Huazheng New Materials, Lingzhi Zhizao, Stick, DSM, Zhongshi Technology, 3M Company, Laird, Dow, Nolante, Zhongshan Yongda, Anbus, Aochuan Technology, DuPont, etc

Processing enterprises;

Foxconn, BYD, Changying Precision, Samsung Electronics, Tongda Group, Bern Optics, Lansi Technology, OFILM, Chaozhou Sanhuan, Ruisheng Technology, Jinsheng Precision, Yian Technology, Xingke Electronics, Xinwangda, Bern Optics, etc

CIME2025 Audience Group

1. Consumer electronics, power supplies, automotive industry, electronics, household appliances, computers/computer components, etc;

2. Display, semiconductor, military supplies, optoelectronic/LED, frequency converter, mechanical industry, aerospace, etc;

3. Computers, information technology, telecommunications, 3C/digital, communication equipment, computer peripherals, etc;

4. Electronic devices, electronic components, instruments and meters, communication/communication networks, power electronic devices, etc;

5. PCB manufacturers, AI artificial intelligence, 5G terminals, intelligent automation, etc;

6. Government departments, research institutions, equipment manufacturers, traders, agents, distributors, end-users, etc;

◆ Scope of exhibits

Thermal conductive fillers: inorganic non-metallic materials such as aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal concentrate; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitride, aluminum oxide, zirconium oxide, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductive and heat dissipating materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal based composite materials

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, diamond materials, etc

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conduction and heat dissipation components:

Heat pipes/heat exchangers, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFETs, IGBTs) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat pipes, heat plates, cooling modules, touchpad, fan grille, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

Analysis and Testing:

Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment, etc;

Processing equipment:

Rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Roll cutting machine; Cutting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and thermal transfer laboratories, complete process and customized equipment, etc; etc.

Hot Design:

Thermal simulation/thermal design software

Exhibition area for liquid cooling and heat dissipation technology in data centers:

Practical case of operation and maintenance of liquid cooled data center; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, thermal simulation of data center liquid cooling systems, and compatibility of immersion liquid cooling materials;

Quick connector technology, refrigerant, leakage detection technology, intelligent fluid distribution technology, intelligent temperature monitoring technology;

Applications of data centers: modular data centers, data cloud boxes, data center solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for data centers, UPS uninterruptible power supplies, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

• Telephone:189 3049 1940
• Truename:Mr. Zhang Desong
• Mobile:189 3049 1940
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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