2025 Shenzhen International Microsystem Integration Products and Packaging Technology Exhibition

Shenzhen Microsystem Integration Products and Packaging Technology Exhibition2025

Basic Information

Date: April 9-11, 2025

Location: Shenzhen Convention and Exhibition Center

Exhibition Introduction

The purpose of this exhibition and conference is to further understand the current status, development trends, and response strategies of microsystem integration products and packaging technology industries in various regions of the world and major developed countries; Better promote the exchange of microsystem integration products and packaging technologies worldwide, accelerate the development of microsystem integration products and packaging technologies in electronics, communication IT、 Applications in banking, transportation, new energy, and new fields; Better showcase new products, processes, and technologies in the field of microsystem integration and packaging technology at home and abroad in recent years. At that time, the exhibition will invite international microsystem integration product and packaging technology organizations, as well as well-known scholars, technical experts, and entrepreneurs at home and abroad, to introduce the forefront and dynamics of microsystem integration product and packaging technology application development, technological development and market trends, and challenges faced. We sincerely invite professionals from all aspects of the microsystem integration product and packaging technology industry chain at home and abroad to participate in the exhibition and conference, and make contributions to promoting the progress of the microsystem integration product and packaging technology industry. We look forward to meeting you on site!

Reason for participation

Brand building - expanding brand awareness and strengthening industry influence

Business opportunity exploration - professional buyers from China and abroad come in person, unlimited business opportunities

Situation insight - comprehensively understanding the market situation and clearly analyzing industry competitiveness

Promotion and publicity - a broad exhibition stage, comprehensive media exposure opportunities

Order acquisition - lower cost investment, ultra-high return on investment

New Product Launch - Showcase new products, test and estimate market response

Customer Cooperation - Consolidate and strengthen existing cooperation, develop and meet potential customers

Industry Exchange - Simultaneous Meetings Focus on Hotspots, Discuss and Exchange Industry Development

Exhibition Highlights

Collect new high-quality sales information, meet high-quality buyers, and reach sales deals.

Understand the global strategy for future production demand development.

Build a sales network with national agents and distributors.

Explore new business opportunities through collaboration with manufacturers and buyers from various regions.

Strengthen the company's brand building and enhance its industry visibility.

Obtain relevant industry information on new market trends, technological innovations, new developments in the industry, and more.

Schedule arrangement

Registration and Exhibition: April 07-08, 2025 AM8:30-PM19:30

Exhibition time: April 9, 2025 AM9:30-PM16:45

April 10, 2025 AM9:30-PM16:45

April 11, 2025 AM9:30-PM16:45

Scope of Exhibition

1. MEMS devices: optical MEMS, RF MEMS, MEMS sensors, accelerometers, gyroscopes, magnetometers, electronic compasses, silicon microphones, MEMS micromirrors, MEMS inertial measurement units, BAW filters and duplexers, microfluidics, microfluidics guidance, etc;

2. MEMS actuators: biochips, material chips, lamps, pumps, microfluidic chips, EMS batteries, micro generators, etc

3. Biological/chemical MEMS: DNA/RNA technology, chemical detection, MEMS crystal oscillator;

4. Highly composite MEMS: CMOS/MEMS, LSI/MEMS integration, MEMSIP, etc;

5. MEMS applications: MEMS sensor solutions, microphones, displays, ultra micro robotic devices, micro factories, sensor networks, energy harvesting, etc;

6. Biological MEMS: Application of MEMS technology in diagnosis DDS、 Nanocapsules; Cutting edge DNA&RNA technology, microreactors, microfluidic guidance, microfluidic chips, etc;

7. MEMS processing equipment: lithography equipment, coating equipment, deposition equipment, etching equipment, cleaning equipment, wafer bonding equipment;

8. MEMS foundry/packaging testing: MEMS Chinese platform; Design, prototype testing, product development, and mass production; Other OEM services: pattern formation, film formation, laser, ion pulse processing, spray coating; Packaging: MEMS packaging, assembly, analysis testing, and calibration, etc;

9. NEMS systems: mechanical, thermal, and magnetic sensors and actuators, as well as systems, optomechanical microdevices and microsystems, fluid microcomponents and microsystems, microdevices for data storage, microchemical analysis systems, wireless communication for microdevices and systems, high-speed vision systems, microdevices for power and energy harvesting, nanoelectromechanical devices, and system science instruments, etc;

10. Micro system packaging technologies such as IC chip packaging equipment, integrated circuit packaging equipment, microelectronic packaging equipment, electronic tags, microelectronic packaging materials and technologies, COF/MEMS packaging technology, micro assembly process, SMT process and equipment;

Contact Us

Contact: Mr. Zhang 150-0190-9485 (same as WeChat)

2025 Shenzhen International Microsystem Integration Products and Packaging Technology Exhibition

• Truename:Mr. Zhang
• Mobile:15001909485
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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