The 14th Shenzhen Thermal and Heat Dissipation Materials and Equipment Exhibition in 2025 is a recommended exhibition

Time: June 25-27, 2025 Location: Shenzhen International Convention and Exhibition Center (New Building)

Simultaneous activities

2025 International Thermal and Heat Dissipation Development Summit Forum and Shenzhen International Thermal Management Conference

Exhibition Introduction:

The 14th Shenzhen International Thermal Insulation and Heat Dissipation Materials and Equipment Exhibition (CIME International Thermal Insulation and Heat Dissipation Exhibition) was founded in Shenzhen in 2013. After 11 years of development and resource accumulation, it has become a well-known and authoritative industry event in the field of thermal management and heat dissipation. It has now developed into the June Shenzhen Exhibition and the December Shanghai Exhibition, touring the two places and deeply discussing the changes and developments of thermal management and heat dissipation with local governments, industry associations, industrial parks, partners, and industry elites, and has received warm responses. As an industry event, CIME Exhibition looks forward to everyone joining hands with CIME Exhibition to continue moving forward together, creating brilliance and providing customers with higher quality, more professional, and more comprehensive one-stop solutions.

With the advancement of consumer electronics, 5G, and artificial intelligence XR、 Against the backdrop of continuous technological penetration and upgrading in fields such as data centers, the Internet of Things, power batteries, energy storage, and Industry 4.0, the miniaturization and continuous increase in power density of electronic devices have led to rapid accumulation of heat energy, weakened safety, and shortened service life. With the continuous advancement of technology, the demand for thermal management, heat conduction, and heat dissipation is also constantly increasing, and the market size is growing exponentially. This has brought enormous potential and commercial cooperation space to the thermal management, heat conduction, and heat dissipation industry.

In order to further promote communication and interaction in the thermal management and heat dissipation industry, strengthen the awareness of communication and cooperation in China's thermal management and heat dissipation industry, and achieve mutual promotion and common development, the 14th Shenzhen International Thermal Management and Heat Dissipation Materials Exhibition and Development Summit Forum, hosted by Bohan Exhibition&Liyue Exhibition, will be held from June 25-27, 2025 at Hall 7 of Shenzhen International Convention and Exhibition Center. The conference aims to establish a communication platform for technical exchange and information exchange in the field of thermal conductivity and heat dissipation, promoting breakthroughs in technology and industrial development in the thermal conductivity and heat dissipation industry. The conference warmly welcomes experts, scholars, researchers, and business representatives from relevant fields at home and abroad to actively participate. At the same time, companies, enterprises, and institutions are welcome to showcase their technological achievements and negotiate cooperation between industry, academia, and research.

Scope of exhibits:

Thermal conductive filler

Inorganic Non Metals: Aluminum Oxide, Silicon Oxide, Zinc Oxide, Boron Nitride, Aluminum Nitride, Silicon Nitride, Silicon Carbide, Magnesium Oxide, Beryllium Oxide, Graphite, Carbon Black, etc;

Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal concentrate;

Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

B electronic packaging materials

Metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber,

Ceramic materials: aluminum nitride, aluminum oxide, zirconium oxide, carbides, borides, nitrides, silicides; Glass, etc

C thermal conductivity and heat dissipation material

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: aluminum oxide (AL203), aluminum nitride (AIN), silicon nitride (Si3N4), beryllium oxide (Be0); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal based composite materials

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Carbon materials: graphene, graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, diamond materials, etc

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

D Thermal conduction and heat dissipation components

Heat pipes/heat exchangers, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFETs, IGBTs) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, motors, fan automatic assembly machines, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

E Analysis and Testing

Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment, etc

F processing equipment

Rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Roll cutting machine; Cutting machine, precision cutting machine, automated slitting machine, thermal conductive material production equipment CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete process and customized equipment, etc;

G thermal design

Thermal simulation/thermal design software

H Data Center Liquid Cooling and Heat Dissipation Technology Exhibition Area

Practical case of operation and maintenance of liquid cooled data center; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, thermal simulation of data center liquid cooling systems, and compatibility of immersion liquid cooling materials;

Quick connector technology, refrigerant, leakage detection technology, intelligent fluid distribution technology, intelligent temperature monitoring technology;

Applications of data centers: modular data centers, data cloud boxes, data center solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for data centers, UPS uninterruptible power supplies, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Precision Ceramics and IGBT Industry Chain Exhibition Area

Precision ceramics, ceramic substrates, ceramic devices and materials, metal materials, additives, consumables, production equipment, IGBT materials, IGBT equipment and accessories, etc;

• Telephone:187-2113-0652
• Truename:Wu Tong
• Mobile:187-2113-0652
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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