2025 China International Semiconductor Exhibition Shenzhen Semiconductor Industry Exhibition

Date: June 25-27, 2025

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Development prospects

Semiconductors are the core of many industrial equipment, widely used in core fields such as computers, consumer electronics, network communication, and automotive electronics. Semiconductors are mainly composed of four components: integrated circuits (about 81%), optoelectronic devices (about 10%), discrete devices (about 6%), and sensors (about 3%), so semiconductors and integrated circuits are usually considered equivalent. Integrated circuits are mainly divided into four categories according to product types: microprocessors (about 18%), memory (about 23%), logic devices (about 27%), and analog devices (about 13%).

The semiconductor industry, as the foundation of modern information technology industry, has become a fundamental, strategic, and leading industry for social development and national economy. It is an essential component of modern daily life and future technological progress.

In order to better promote the development of the semiconductor industry and with strong support from national regulatory authorities, the 2025 China (Shenzhen) International Semiconductor Exhibition will be held from September 23-25, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). This conference will adhere to the exhibition purpose of "highlighting brands, exploring innovation, and focusing on practical results". With unique creativity, scientific and reasonable integration and communication, and excellent services, it will provide a "high-level, high-grade, and high-quality" exhibition and communication stage for exhibitors with a new concept, and create a top-level event that integrates the scale, value, and authority of the semiconductor industry. We look forward to your participation in this exhibition.

Advantages of the Greater Bay Area:

As China's manufacturing industry has shifted from high-speed growth to high-quality development, since 2013, the Chinese government has successively announced and promoted the "the Belt and Road" initiative and the construction of the "the Belt and Road" Greater Bay Area. The goal is to establish a new economic and trade partnership with countries along the "Belt and Road". At home, through the "Guangdong, Hong Kong and Macao Greater Bay Area", the Chinese government has accelerated the construction of a modern industrial system and multilateral open markets to drive high-quality development through continuous innovation.

The construction of the "Guangdong Hong Kong Macao Greater Bay Area" refers to the development of nine cities in Guangdong Province (including Guangzhou, Shenzhen, Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen and Zhaoqing) and two special administrative regions of Hong Kong and Macao into world-class urban agglomerations and international scientific and technological innovation centers with global influence. By deepening the cooperation between Guangdong, Hong Kong and Macao and giving full play to their respective advantages, the Greater Bay Area will promote the coordinated development of regional economies and become an important support for the "the Belt and Road" to build a new platform for international economic cooperation. The GPD of the Greater Bay Area will reach 11.6 trillion yuan in 2019, and is expected to reach 28.9 trillion yuan by 2030, and squeeze into the world Among the top ten economies

The Guangdong Hong Kong Macao Greater Bay Area gathers high-quality resources from two regions, one province, and nine cities, and will be built into an international science and technology innovation center with global influence, a world-class advanced manufacturing industry, and a strategic emerging industry cluster area. It will become the fourth world-class bay area after New York, San Francisco, and Tokyo in the United States and Japan.

A city cluster with open innovation capabilities and huge development potential is a gathering place for traditional manufacturing industries such as automobile manufacturing, new energy vehicles, semiconductors, household appliances, consumer electronics, electronic information and equipment manufacturing, 5G materials, intelligent manufacturing, high-performance materials, energy conservation and environmental protection.

Exhibition scope:

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc;

Sponsorship Plan:

In order to facilitate well-known enterprises to leverage the international influence of this exhibition, showcase their strength, and enhance their brand image, the organizing committee has specially set up a sponsorship plan for the exhibition. An efficient sponsorship plan will bring you more business opportunities and enhance your participation before, during, and after the exhibition.

Specially designed four levels: Diamond, Platinum, Gold, and Silver (detailed plan available upon request). Sponsors will receive the following benefits:

● Gain more exposure to target customers through effective market exposure ● Achieve higher exposure than competitors

● Participate in industry events with an industry perspective ● Enhance brand image and awareness

● Establish a sales network through a new platform to increase trade opportunities ● Obtain more information on buyers and professional sellers

Exhibition Tips:

1. Please fill out the "Exhibition Application and Contract" form carefully and stamp it with the official seal before returning it to the organizing committee.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After the remittance, the remittance receipt should be returned to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

Exhibition scope:

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc;

• Company:Duande Exhibition (Shanghai) Co., Ltd
• Telephone:13524988985
• Truename:13524988985
• Address:Shenzhen International Exhibition Center

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