The 7th Semiconductor Exhibition (Chongqing) Expo 2025
- Industry: Communications / Electronics
- Cycle: Once a year
- Time: 2025/05/08 - 05/10 (Thur To Sat Total 3 Days) Error Correction
- Address: Yubei District · Chongqing Chongqing International Expo Center ChinaChongqing CityYubei District No. 66 Yuelai Avenue, Yubei District, Chongqing
- Sponsor:Chongqing Electronic Society
- Organizer:Chongqing Fuxiang Exhibition Service Co., Ltd
INTRODUCTION
Chongqing, as a manufacturing hub with a complete range of industries in China, is one of the four municipalities directly under the central government. Chongqing, located in the upper reaches of the Yangtze River, is just at the geometric center of the territory, connecting the east and west, connecting the north and south, and is the connection point between the "the Belt and Road" and the Yangtze River Economic Belt. The first national level development and opening-up new area in central and western Chongqing, comprehensively promoting the Chengdu Chongqing region to undertake the transfer of industries from the eastern region. In the process of undertaking the transfer of industries from the eastern region, it will form a strong advantage in terms of location, industry, channel, comprehensive cost, resource endowment, institutional mechanism policies, and other latecomer advantages. As one of the earliest cities in China to develop large-scale integrated circuits, it has initially established a full process system for IC design, wafer manufacturing, packaging and testing, and raw material matching. Chongqing is actively building an electronic information industry chain mainly based on "chip screen and core network". In the future, it will focus on developing power semiconductor storage, automotive electronics, digital analog hybrid, artificial intelligence, and the Internet of Things, striving to build a hundred billion level integrated circuit cluster by 2022. With the improvement and upgrading of the two pillar industries of electronic information and automobile manufacturing in Chongqing, there will be a huge market demand and platform for the integrated circuit industry.
The Global Semiconductor Industry Expo (GSIE) is a global semiconductor industry event in the Midwest region. The exhibition covers various aspects of the semiconductor industry chain, including integrated circuit manufacturing zone, packaging and testing zone, semiconductor materials zone, production equipment zone (second-hand equipment), electronic components zone, AI+IOT+5G zone, talent plan training and exchange zone, and international zone, totaling eight zones. In addition, high-level representatives from universities such as the Chinese Academy of Sciences, Tsinghua University, and the University of Science and Technology of China, as well as industry experts, will gather together to focus on industry hotspots and interpret Southwest industrial policies for discussion and exchange. To build a platform for domestic and foreign manufacturers, enterprises and institutions to showcase new achievements and build product brands in the industry. At the same time, a summit forum and specialized seminar will be held covering topics such as integrated circuits, packaging testing, intelligent digital power supplies, AI+5G+IOT, semiconductor materials, automotive intelligent networking, and semiconductor innovation investment.
Scope
IC Design Zone: EDA, IP Design, Embedded Software, Digital Circuit Design, Analog and Mixed Signal Circuit Design, Integrated Circuit Layout Design, IDM, Fabless Factory, etc;
Integrated Circuit Manufacturing Zone: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuit manufacturing, etc;
Packaging testing area: testing probe station, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, etc;
Semiconductor Materials Zone: Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, etc;
Equipment manufacturing zone: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, etc;
Electronic Components Zone: Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrate substrates, electronic functional process materials, electronic adhesive (tape) products, electronic chemical materials and components, etc;
AI+5G zone: industrial Internet platform, intelligent robots, smart cars, smart phones, intelligent transportation, aerospace electronics, smart appliances, UAVs, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc;
Smart Power Zone: Microwave RF, Semiconductor LED, Ionic Power, Shared Smart Charging, Communication Power, Photovoltaic/Wind Power/Energy Storage Power Design, Power Converter Magnetic Technology, etc;
Comprehensive exhibition area: government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc.
Integrated Circuit Manufacturing Zone: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuit manufacturing, etc;
Packaging testing area: testing probe station, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, etc;
Semiconductor Materials Zone: Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, etc;
Equipment manufacturing zone: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, etc;
Electronic Components Zone: Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrate substrates, electronic functional process materials, electronic adhesive (tape) products, electronic chemical materials and components, etc;
AI+5G zone: industrial Internet platform, intelligent robots, smart cars, smart phones, intelligent transportation, aerospace electronics, smart appliances, UAVs, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc;
Smart Power Zone: Microwave RF, Semiconductor LED, Ionic Power, Shared Smart Charging, Communication Power, Photovoltaic/Wind Power/Energy Storage Power Design, Power Converter Magnetic Technology, etc;
Comprehensive exhibition area: government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc.
Costs & Precautions
Please contact the exhibition organizer before participating in the exhibition to confirm.
Contact
- Truename:Han Fei
- E-mail:298233172@qq.com
- Address:15-11, Building A, Meiyue Xingdu, No. 70 Shancha Road, Yubei District, Chongqing
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870
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