The 7th Shenzhen International Semiconductor Exhibition 2025

The 7th Shenzhen International Semiconductor Exhibition 2025

Date: September 10-12, 2025 Location: Shenzhen International Convention and Exhibition Center (Bao'an Exhibition Hall)

Organizational unit

Host:

Jiangsu Semiconductor Industry Association

Zhejiang Semiconductor Industry Association

Shenzhen Semiconductor Industry Association

Chengdu Integrated Circuit Industry Association

Dongguan Integrated Circuit Industry Association

Shenzhen Zhongxin Materials Exhibition Co., Ltd

Undertaking Unit:

Shenzhen Zhongxin Materials Exhibition Co., Ltd

Exhibition Introduction

The 7th Shenzhen International Semiconductor Exhibition (SEMI-e) will be held from September 10-12, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall)! This exhibition will focus on various sub sectors of the semiconductor industry, comprehensively showcasing new technologies, products, highlights, and trends in the semiconductor industry. It will gather over 900 exhibitors to showcase third-generation semiconductors such as artificial intelligence, computing power storage, chip design, wafer manufacturing, advanced packaging, semiconductor specialized equipment and components, advanced materials and carbon materials, and silicon carbide/gallium nitride IGBT、 Focusing on power devices, power electronics, and automotive semiconductors, we comprehensively showcase the latest manufacturing and solutions for integrated circuits and semiconductors.

SEMI-e has been deeply involved in the field of semiconductor exhibitions for many years and has developed into one of the most influential professional exhibition platforms in the semiconductor industry. The 7th SEMI-e 2025 Shenzhen International Semiconductor Exhibition is jointly organized by multiple industry associations and will continue to cover an exhibition area of 60000m ². Together with more than 900 exhibitors, it will launch exciting 50+themed activities and is expected to attract over 70000 industry visitors.

Looking back at the previous SEMI-e 2024, the exhibition area was nearly 60000 square meters, gathering 815 exhibitors. The exhibits covered semiconductor equipment, chip design/wafer manufacturing/advanced packaging, third-generation semiconductors, semiconductor components, advanced materials, automotive semiconductors, and other fields, covering the entire semiconductor industry chain. At the same time, the "6th Shenzhen Semiconductor Industry Technology Summit", "5th Third Generation Semiconductor Industry Development Summit Technology Forum", "2024 China Automotive Semiconductor Conference", "2024 Today's Semiconductor Localization Trend Summit" and "Bao'an Business Environment Promotion and Semiconductor Enterprise Supply and Demand Matchmaking Conference" were held. The conferences focused on hot topics such as automotive chips, autonomous driving technology, automotive power devices, advanced packaging and testing technology, and new semiconductor (GaN/SiC) material preparation, attracting experts and experts from multiple fields such as the semiconductor industry, automotive new energy, and consumer electronics to visit and exchange ideas, promoting capacity expansion, and helping to deeply connect high-quality resources. SEMI-e Joining hands with Shanghai Huali, Huatian Technology, Tongfu Microelectronics, Shengmei Semiconductor, Tianke Heda, China Electronics Technology 45th Research Institute, Zhonghuan Leading, BYD Semiconductor, Huajin Semiconductor, Nansha Wafer, Northern Huachuang, Shanghai Microelectronics Equipment, Changchuan Technology, Pioneer, Genesis, Saimete, Fangzheng Micro, Taike Tianrun, Beiling Co., Ltd., Shichuang, Aisite, Rilian Technology, Xinqi Microelectronics, Hualin Jiaye, Shunluo Electronics, Zhongke Saifei, Zhicheng Semiconductor, Suzhou Qiqi, Maiwei Technology, Tongguang Co., Ltd., Tianyu, Liande Semiconductor, Yujing Machinery, Xichan Microchip, Xinxiang, Zhiying Intelligent, Medview, Global, Youjie, Kaidi Microelectronics, Xinpu, Leiming, Kawasaki Robotics, Neway Applied Materials, Microelectronics, Yujing Technology, Enton Semiconductor, Leibo Microelectronics, Shuocheng Group, Leica Companies such as DeKangweier, Yuhuan, Shenwu, Otwei, and Boranrun are working together to create a high-quality industry event and strive for development. SEMI-e is committed to providing exhibitors with a high-level, high-end, and high-quality platform for exhibition and communication!

In addition, from the perspective of the entire industry chain, Shenzhen is undoubtedly one of the best markets for innovation and application in the semiconductor industry in Asia, attracting the attention of many well-known enterprises and investors. SEMI-e relies on the solid foundation laid in the early stage to provide precise market docking services for participating enterprises. Representatives from over a thousand leading companies, including Huawei, Yuexin, Sunac Power, Changjiang Storage, SMIC, Huahong, Zengxin, Intel, CR Micro, Sanan, Yuexin, Fangzheng Micro, Huatian, Pengxinxu, Changdian Technology, Tongfu Microelectronics, Pengxin Micro, Hailis, Tianke Heda, Beifang Huachuang, Shengmei Semiconductor, ROHM, Infineon, BYD, NIO, FAW, Xiaopeng, gathered together, covering more than 50 industry leaders such as wafer fabs, packaging and testing plants, equipment manufacturers, silicon carbide, automotive manufacturers, inverter factories, consumer electronics, and power electronics. In addition, 352 institutions including Bao'an District Commerce Bureau, Bao'an District Enterprise Service Center, Guangzhou Academy of Sciences Semiconductor Research Institute, Shenzhen Semiconductor Industry Association, Semiconductor Display Association, etc. visited the Guangdong Integrated Circuit Park in groups. SEMI-e is not only a showcase for technology, but also an important platform for industry exchange, cooperation, and innovation. Through effective market exposure, precise business matching can be achieved!

From comprehensive promotion and advertising to meticulous on-site service, the 7th Shenzhen International Semiconductor Exhibition (SEMI-e 2025) is currently in full swing. We cordially invite familiar 'old friends' to make a comeback, and also welcome more' new faces' to continue joining us. We look forward to attending this influential and professional technology feast in the semiconductor industry with you!

Based on the forefront, consolidate the "core" and gather strength

Unprecedented scale

SEMI-e 2025 is committed to creating a multidimensional technology event covering the entire semiconductor industry chain, with an exhibition area covering 60000m ². It will gather over 900 high-quality exhibitors and is expected to attract more than 70000 industry professionals from home and abroad to visit and exchange ideas.

Accurate positioning

SEMI-e has been deeply involved in the field of semiconductor exhibitions for many years and has developed into a highly influential and professional semiconductor exhibition in the industry. SEMI-e always aligns with industry interests, belongs to the same industry as the enterprise, empowers and achieves each other.

Contemporary Forum

Based on the SEMI-e exhibition, the 2025 Power Semiconductor and New Energy Application Innovation Summit, the 6th Third Generation Semiconductor Industry Development Summit Forum, the Glass Through Hole (TGV) Technology Application and Development Forum, and the Chiplet and Advanced Packaging Technology Summit will be held simultaneously. This conference will closely focus on the latest development trends in the semiconductor field, inviting representatives of well-known enterprises, technical experts, and outstanding entrepreneurs to have in-depth discussions and provide new ideas for enterprises to explore new business models.

Dual exhibition linkage

SEMI-e 2025 and CIOE China Optoelectronics Expo will be held simultaneously at the Shenzhen International Convention and Exhibition Center (Bao'an) from September 10 to 12, 2025. The two exhibitions will work together to create a 320000 square meter industry feast, presenting an international event that integrates exhibition, exchange, and cooperation for the global semiconductor and optoelectronic industries, further stimulating the innovation vitality of the two industries and promoting industrial integration and development.

Supply and demand matching

From the perspective of the entire industry chain, Shenzhen is undoubtedly one of the best markets for innovation and application in the semiconductor industry in Asia, attracting the attention of many well-known enterprises and investors. SEMI-e has a powerful resource database and will conduct in-depth research to provide efficient business docking services for exhibitors and professional visitors, jointly unlocking the path to cost reduction, efficiency improvement, and high-quality development of the semiconductor industry chain.

Daily schedule

Registration and Exhibition: September 8-89, 2025 (09:00-17:00) Opening Time: September 10, 2025 (09:00)

Exhibition time: September 10-12, 2025 (09:00-16:30) Closing time: September 12, 2025 (16:00)

Exhibition scope

Chip Design/Wafer Manufacturing Exhibition Area: Integrated Circuit Design and Chips EDA、MCU、 Wafer manufacturing and equipment and components, etc

Chiplet and Advanced Packaging Exhibition Area: Chiplet, SiP Packaging, Wafer Level Packaging (WLP), 3D Packaging, Panel Level Packaging (PLP), TSV/TGV Packaging, Organic/Silicon/Glass Substrate, Packaging Substrate, Packaging Carrier, IC Carrier, Semiconductor Packaging Materials and Equipment, etc

Semiconductor specialized equipment/components exhibition area: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc

Advanced Materials/Carbon Materials/Diamond Semiconductor Exhibition Area: Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc

Third Generation Semiconductor Exhibition Area: Nitride (GaN) and Silicon Carbide (SiC), Zinc Oxide (ZnO) Diamond, Wafer, Substrate and Epitaxy, Power Devices, IGBT Packaging Materials, RF Devices and Processing Equipment, etc

Component Exhibition Area: Passive Devices, Semiconductor Discretes/1GBT, 5G Core Components, Special Electronics, Component Power Management, Sensors, Memories, Connector Relays, Cables, Plug in Devices, Crystals, Resistors, Display Devices, Diodes, Transistor Filter Components, Switches, and Component Materials and Equipment

Power Devices/Power Electronics/Automotive Semiconductors Exhibition Area: Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc

Computing power, storage, artificial intelligence, CPO co packaging exhibition area: artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc

Semiconductor Display/Mini/Micro LED Exhibition Area: OLED, AMOLED, Mini/Micro LED Display, Flexible Display and Materials and Equipment, etc

International Brand Zone: International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, OEM manufacturers, etc

• Telephone:18721020295
• Truename:Qian Cheng
• Mobile:18721020295
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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