The 13th Shanghai International Exhibition of Thermal and Cooling Materials and Equipment in 2024

The 13th heat conduction materials exhibition 2024

Simultaneously held: The 3rd Shanghai International Data Center Liquid Cooling and Cooling Exhibition in 2024

Time: December 18-20, 2024 Location: Shanghai New International Expo Center

Exhibition area: 20000 square meters | Exhibitors: 500+| Professional visitors: 30000 people

Exhibition Introduction

The 13th Shanghai International Thermal Conductive and Cooling Materials and Equipment Exhibition (CIME204) in 2024 will be held from December 18th to 20th at the Shanghai New World Expo Center. It is the first exhibition in the global thermal management industry. The exhibition has been held since 2013 and has been successfully held for 11 times. Since 2023, the exhibition is scheduled to be held annually in Shenzhen in June and Shanghai in December. The exhibition is hosted by Bohan Exhibition and Liyue Exhibition, and co organized by Guangdong Adhesive Industry Association and Shenzhen Graphene Association. It has also received strong support from industry media chambers of commerce, associations, and other related industry institutions. The positioning goal of this exhibition is "new materials, new opportunities, and new journeys". Based in Shanghai, it radiates national and even global commerce, helping enterprises open up the overall market. The exhibition brings together brand enterprises in various categories such as thermal conductive fillers, thermal interface materials, carbon materials, graphene, ceramic substrates, high-performance heat dissipation materials, liquid cooling heat dissipation technology, production and processing equipment, providing a one-stop service platform for professionals in the thermal control industry to purchase and select products professionally and efficiently, and to exchange business. At that time, we warmly welcome domestic and foreign thermal conductivity and heat dissipation material enterprises and related industry professionals to visit and exchange ideas!

Previous Review: The CIME 2023 Shanghai International Thermal and Cooling Materials Exhibition was successfully concluded from December 13th to 15th at the Shanghai New International Expo Center. The exhibition covers an area of 15000 square meters with 306 exhibitors and lasted for three days, with a total of 18847 visitors. Invitations to the exhibition include: Baitu Co., Ltd., Zexi New Materials, Yake Technology&Huafei Electronics, Yishitong, Jingge New Materials, Weishi New Materials, Xiayang New Materials, Yunhui Electronics, Yuzhou New Materials, Ningxia Shixing, Tao Feilun, Zhongci New Materials, Softcarbon Electronics, Jin Haohui, Zhongke Flame retardant, Haosen Mining, Junci Electronics, Jinchuan Group, Licheng New Materials, Nordster, Chaowei New Materials, Polyhexene Carbon, Uni Chemical, Jinghe Electronics, Taotao Electronics, Pinshuo Electronics, Chu Yue Re Chuan, Cheng Yinghua, Pan Rui Yihui, Jinshan Electronics, Handan Electronics, Ningbo Jingdiamond Jintao Shimo, Beihua New Rubber, Indium Tai Company, Yizhao Electronics, Hongyi Thermal Management, Ruiquan Hardware, Zhenghe Aluminum, Yihao Intelligence, Tongchuang Electronics, Deco Alloy, Biliver, Hehe High tech, Entropy Flow Technology, Tianqian Technology, Space Liquid, Core Cooling Technology, Lanyang Technology, Yuandi Technology, Datu Thermal Control, Riyi Electric, Aiteli, Hewu Precision, Liquid Cooling Technology, Xianhua Technology, Senjie CNC, Tuochuan Technology, Bobai Machinery, Dongjun Intelligence, Punos, Haoxi Technology, Quete Electromechanical, Simada, Xili Grinding More than 300 outstanding exhibitors, including Taiyuan Industrial, had on-site exchanges, showcasing a complete range of products, covering thousands of new products in the entire thermal conduction and cooling industry chain, including thermal fillers, thermal interface materials, thermal management and cooling materials, various radiators, and production equipment.

Target audience: We will focus on inviting executives from national, provincial, municipal, and relevant scientific research institutions, consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computers and components, displays, semiconductors, military supplies, optoelectronics/LEDs, frequency converters, mechanical industry, electronic equipment, electronic components, instruments and meters, communication/communication networks, medical instruments, wind power, solar energy, chassis/cabinets, chokes, integrated circuits, transistors, electrical appliances, transformers, welding equipment, power electronic devices, and other enterprises to visit and negotiate.

◆ Scope of exhibits

Thermal conductive fillers: inorganic non-metals: aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal solution; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitride, aluminum oxide, zirconia, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductive and heat dissipation materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal matrix composite materials

Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductivity film, diamond materials, etc

Phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt water complexes, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conductivity and heat dissipation components:

Heat pipes/soaking plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, hardware stamping parts, chassis, cooling pads, fin tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, fan automatic assembly machines, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, thermal conduit, plug-in heat sink, plug-in heat sink, integrated heat sink for chassis, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, ribbed heat sink, variable frequency heat sink, heat pipe heat sink, cross finger heat sink, liquid cooling heat sink, combination heat sink Solid state relay heat sink, high-power transistor heat sink and related accessories, etc;

Analysis and Testing:

Analytical instruments, laser thermal conductivity meters, thermal conductivity analyzers, thermal conductivity meters, thermal expansion meters, electronic thermal testers, air flow and pressure testers, laser thermal conductivity meters, material strength testing machines, thermal property measurement equipment, etc;

Processing equipment:

Rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Cutting and rolling machine; Slitting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete sets of processes and customized equipment, etc; Waiting

Thermal design:

Thermal simulation/thermal design software

Data Center Liquid Cooling and Cooling Technology Exhibition Area:

Practical cases of operation and maintenance of liquid cooled data centers; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, data center liquid cooling system heat, and compatibility of immersion liquid cooling materials;

Quick connector technology, refrigerant and leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

CIME2024 Intended Procurement Enterprise

Terminals, operators/solution providers;

Apple, Samsung, Huawei, Nubia, OPPO, Xiaomi, VIVo, Chuanyin, Microsoft, ZTE, Meizu, Lenovo, TCL, LG, Amazon, Hisense, 360 phones, Asus, China Mobile, China Unicom, China Telecom, Qualcomm, etc

Intelligent hardware;

IFLYTEK | 360 | Wanxing Technology | TCL Technology | Huichuan Technology | Dahua Shares | Zhongke Chuangda | Helitai | Midea Group | Shaoyin Technology | NetEase Youdao | Jiahe Shares | Beisi Technology | Lanhe Technology | Lvmi Lianchuang | Fenda Intelligence, etc

New energy vehicles;

Tesla, BYD, Ideal Automobile, NIO, Xiaopeng Automobile, BMW, Ain, Nezha Automobile, Extreme Krypton, AITO, Geely Automobile, SAIC, FAW, GAC, BMW, Audi, Dongfeng, Toyota, Honda, Great Wall, etc

Power batteries and energy storage;

Ningde Times, BYD, Zhongchuanghang, Guoxuan High Tech, Xinwangda, Yiwei Lithium Energy, Honeycomb Energy, Funeng Technology, LG New Energy, Ruipu Lanjun, Zhongke Electric, Xinwangda, Panasonic, Samsung, Fodi Battery, Bike Battery, Pengwei Energy, Tianneng Battery, Chaowei Battery, etc

Material enterprises;

Feirongda, Hongfucheng, Boen Industry, Huitian New Materials, Leizdun, Comet Crystal New Materials, Liqun Lianfa, Zhonglan Chenguang, Zhongshi Technology, Carbon Yuan Technology, Anjie Technology, Xinlun Technology, Meiqing Technology, Huazheng New Materials, Leading Intelligence Manufacturing, Sidiq, DSM, Zhongshi Technology, 3M Company, Laird, Dow, Noland, Zhongshan Yongda, Ambers, Aochuan Technology, DuPont, etc

Processing enterprises;

Foxconn, BYD, Changying Precision, Samsung Electronics, Tongda Group, Bern Optics, Lansi Technology, OFI Optics, Chaozhou Third Ring, Ruisheng Technology, Jinsheng Precision, Yian Technology, Xingke Electronics, Xinwangda, Bern Optics, etc

CIME2024 Audience Group

1. Consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computers and components, etc;

2. Display screens, semiconductors, military products, optoelectronics/LEDs, frequency converters, mechanical industry, aerospace, etc;

3. Computers, information technology, telecommunications, 3C/digital, communication equipment, computer peripheral products, etc;

4. Electronic devices, electronic components, instruments and meters, communication/communication networks, power electronic devices, etc;

5. Circuit board manufacturers, AI artificial intelligence, 5G terminals, intelligent automation, etc;

6. Government departments, research institutions, equipment manufacturers, traders, agents, distributors, end users, etc;

Contact information for the Organizing Committee of the 13th Shanghai International Thermal Conductive and Cooling Materials and Equipment Exhibition in 2024

Bohan Exhibition (Shanghai) Co., Ltd

Address: Room 305, Building A, No. 1325 Hengnan Road, Minhang District, Shanghai

Phone: 021-54476198

Contact person: Mr. Lu Mingliang 176-2185-0289 (same as WeChat)

• Telephone:176-2185-0289
• Truename:Mr. Lu Mingliang
• Mobile:176-2185-0289
• Address:2345 Longyang Road, Pudong New Area, Shanghai

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