2024 Electronic Packaging Testing Exhibition | 2024 Shanghai Electronic Packaging Testing Exhibition

2024 China (Shanghai) International Electronic Packaging Testing Exhibition

Exhibition Introduction

Today, China has become one of the world's largest manufacturing countries for electronic information products. Many world-renowned electronic companies are transferring a large amount of primary and secondary packaging to China for production. Nowadays, packaging testing and sintering skills have evolved into a gem in the semiconductor, LED, and electronic fields. It is an indispensable process after the completion of integrated circuit chip production and a bridge from devices to systems. To provide a platform for information exchange, market development and business decision-making, product display, and technology development for the industry and upstream and downstream industries, and to build bridges for enterprises, institutions, research institutes, and higher education institutions. In order to better promote communication and interaction in the electronic packaging testing industry, and enhance the internationalization level of the electronic packaging testing industry, the 2024 China (Shanghai) International Electronic Packaging Testing Exhibition (CIEPET-2024) will be grandly held from November 18-20, 2024 at the Shanghai New International Expo Center. CIEPET-2024 is divided into three major sections: exhibitions, summit forums, and academic conferences. It is an annual event in the electronic packaging testing industry and a comprehensive professional exhibition platform for communication and cooperation between the electronic packaging testing industry and related industries.

Exhibition Information

Exhibition time: November 18-20, 2024 Exhibition location: Shanghai New International Expo Center

Exhibition highlights

High end authority

Government agencies and industry associations fully support the construction of a nationally influential and demonstrative electronic packaging testing production, demand, supply and marketing platform;

The upstream and downstream industries of the electronic packaging testing industry will fully participate in the exhibition, building an international, cutting-edge, and market-oriented high-end cooperation and exchange platform;

Create a butler style service, display 50000 square meters, connect with over 90000 high-quality buyers in the actual market, and participate in several professional purchasing tours with over a hundred people;

Capturing different types of professional audiences and high potential buyers, possessing strong data accumulation and market awareness;

National level media escorts and showcases comprehensive integration of technological achievements and brand building;

Focus on the forefront

Celebrity effect, showcasing on stage with leading manufacturers in the same industry both domestically and internationally, and exchanging skills;

Gathering industry elites, grasping market trends, and gathering global business opportunities;

Diversified promotion platform, efficiently targeting tens of thousands of professional buyers;

Focusing on industry hot trends and connecting global industry chains;

Global media coverage on site, providing comprehensive and detailed coverage

Audience group

The professional audience includes industrial electronics, consumer electronics, automobiles, communication systems, healthcare, household appliances, computers and peripheral equipment, engineering machinery, new energy, Internet of Things, aerospace, military industry, security, lighting engineering, rail transit, intelligent buildings, etc.

Full media coverage

CCTV, Sina, Sohu, NetEase, Tencent, Phoenix, industry websites and other nationally renowned online media are fully tracked, with a strong network cluster to build an never-ending online exhibition. One exhibition provides long-term service.

Display scope

1、 Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering related products and technologies, etc;

2、 Advanced packaging and system integration: ball grid array packaging, chip level packaging, flip chip, wafer level packaging, 3D integration, and various other advanced packaging and system integration technologies;

3、 Packaging materials and processes: Interconnecting materials such as keys and wires, solder balls, solder paste, conductive adhesives, etc; Chip fillers, adhesives, thin film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials, and other new materials that can achieve high packaging performance and reduce costs; And various packaging and assembly processes, etc;

4、 Packaging design and simulation: various new packaging/assembly designs; Modeling, simulation, and validation methods for electrical, thermal, optical, and mechanical characteristics of electronic packaging; Multi scale and multi physical quantity modeling, etc;

5、 Emerging field packaging: packaging technology for sensors, actuators, microelectromechanical systems, nano electromechanical systems, and micro optical electromechanical systems; Optoelectronic packaging, CMOS image sensor packaging; The application of packaging and integration technology in emerging fields such as LCD displays, passive components, RF, power and high-voltage devices, and nanodevices;

6、 High density substrate and assembly technology: embedded passive and active component substrate technology; High density interconnect substrates, printed circuit boards, high-density high-performance substrates; And various new substrate technologies that can improve substrate density and performance;

If you want to book a booth for "CIEPET-2024" and learn more information, please contact us through the following contact information:

Organizing Committee of 2024 Shanghai Electronic Packaging Testing Exhibition

Contact person: Zhang Long 186 0078 4418 (same as WeChat)

Fax:+86 21 33275210

• Telephone:186 0078 4418
• Truename:Zhang Long
• Mobile:186 0078 4418
• Address:2345 Longyang Road, Pudong New Area, Shanghai

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