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2024 South China Shenzhen Semiconductor Packaging Equipment Materials and Core Component Industry Application Exhibition
Industry: Communications / Electronics
Cycle: Once a year
Time: 2024/05/15 - 05/17 (Wed To Fri Total 3 Days)    Error Correction
Address: Guangdong Shenzhen International Convention and Exhibition Center (New Hall) ChinaGuangdong ProvinceShenzhen CityBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Sponsor:2024 South China Shenzhen Semiconductor Packaging Equipment Materials and Core Component Industry Application Exhibition
Organizer:2024 South China Shenzhen Semiconductor Packaging Equipment Materials and Core Component Industry Application Exhibition
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INTRODUCTION

2024华南深圳半导体封装设备材料与核心部件产业应用展会-大号会展 www.dahaoexpo.com

2024 South China Shenzhen Semiconductor Packaging Equipment Materials and Core Component Industry Application Exhibition

Time: May 15-17, 2024

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)

Conference theme: Xinlian World Huichuang Future

The importance of the semiconductor industry is self-evident. It is the foundation of various high-tech upgrades and permeates into various top technology fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching as high as 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries, including semiconductors, were included in its "Made in China 2025" plan for strong support. The Outline for Promoting the Development of the National Integrated Circuit Industry states that by 2030, the main links of the integrated circuit industry chain must reach the international advanced level, and a group of enterprises should enter the international first tier.

Among them, companies such as Ansei Semiconductor, BYD Semiconductor, Foxconn, Huawei, Jiade New Energy, Yake Electronics, ZTE Communication, and Changan New Technology visited the site, as well as Yangjie Technology, Dongwei Semiconductor, Star Semiconductor, SMIC, Infineon, CRRC Times, Tianke Heda, Changjiang Storage, China Resources Micro, GAC Group, Intel, Microsoft China, Tencent, BYD, Ansemy, and Donglong Automobile Xiaomi Automobile, FAW Toyota, Cambrian, Ziguang Zhanrui, Zhongxin Micro, Horizon, Zhongkexin (58th Research Institute of China Electronics Corporation), Zhaoyi Innovation, China Resources Microelectronics, Huahong, Shengbang Micro, New Jieneng, Jichuang North, TCL Huaxing, Sanan Optoelectronics, CRRC Times, Tianke Heda, Silan Micro, Riyuguang, Pingtouge, Yifa Semiconductor, FAW Volkswagen, Sony, OPPO, China Electric Construction Group Jiangxi Electric Construction, Tianyue Advanced Representatives of professional buyers from Time Electric and others attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.

As a center of technological innovation in China, Shenzhen is the hub, application center, and design center for semiconductor products. The semiconductor industry in Shenzhen has maintained a high-speed growth trend for many years, especially the IC design industry, which has always been at the forefront of the country. In recent years, the domestic attention to the semiconductor industry has been unprecedented. Shenzhen is serving as the main battlefield of Guangdong Province to build the third pole of the national semiconductor industry, continuously increasing policy and financial support for the semiconductor industry. In June 2022, Shenzhen issued the "20+8" industrial policy and released the "Shenzhen Action Plan for Cultivating and Developing Semiconductor and Integrated Circuit Industry Clusters (2022-2025)", proposing to accelerate the improvement of the integrated circuit design, manufacturing, packaging and testing industry chain, promote the development of key projects such as EDA tool software, semiconductor materials, high-end chips, and advanced manufacturing, and promote the construction of key projects such as 12 inch chip production lines and third-generation semiconductors, Build a group of semiconductor and integrated circuit industry bases and industrial parks at a high level. With the release and implementation of policies, and the rapid development of industries such as 5G communication, new energy vehicles, industrial internet, big data, and photovoltaics in China, as well as the continuous promotion of the "carbon peak and carbon neutrality" green and low-carbon strategy, the application of the third-generation semiconductor market has gradually opened up, and the industry scale is constantly growing.

Exhibition highlights

◆ Collaborative innovation in technology: leverage the urban agglomeration effect of the Guangdong Hong Kong Macao Greater Bay Area, create an innovative and upgrading environment for the industrial chain, achieve the transformation from "world factory" to "Guangdong creation", and build a new generation of semiconductor industry clusters; Realize the mutual promotion of technology, industrial economy, and regional economy.

◆ Explore industrial trends and jointly create market opportunities: grasp the characteristics of the semiconductor industry, such as high requirements for collaborative innovation, large output value, and wide coverage, actively implement the "gradually forming a new development pattern with domestic circulation as the main body and domestic and international double circulation promoting each other", and promote Chinese enterprises to carry out efficient product circulation and output and share advantageous production capacity with the "the Belt and Road" and developing countries, Collaborate for development.

Gathering consumer electronics technology products: Gathering high-tech enterprises and various high-tech products in the semiconductor industry at home and abroad for centralized display, creating opportunities for project cooperation, brand building, technology guidance, and investment and financing docking for all parties.

◆ Creating a technology application scenario experience and igniting new communication trends: breaking through the traditional exhibition loop, introducing a new market communication matrix, immersive exhibition experience, and creating hot topics during the same period to ignite traffic

Visitor Source

1. Senior leaders and technical leaders of upstream and downstream enterprises in the semiconductor industry, including integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment, etc;

Senior leaders and technical leaders of terminal application enterprises such as 2.5G applications, big data, Internet of Things, 3C laptops, consumer electronics, intelligent manufacturing, smart factories, healthcare, optical communication/optical modules, etc;

3. Representatives from relevant government departments, industry associations/societies, and research institutes;

4. Mainstream/professional media professionals and semiconductor investment institutions. Recommended brands

Simultaneous activities

2024 Guangdong Semiconductor Industry Development Trends Forum

2024 Pearl River Delta Chip Industry Innovation and Development Summit Forum

2024 China IC Design and Innovation Development Forum

2024 Shenzhen Embedded System Security Forum

2024 Shenzhen Integrated Circuit Packaging and Testing Industry Technical Exchange Conference

2024 Shenzhen Semiconductor Equipment and Core Component Manufacturers Exchange Conference

2024 Shenzhen Innovation Semiconductors and Power Supply Innovation Technology Seminar

Opportunities and Challenges for the Development of Semiconductor Industry in the Guangdong Hong Kong Bay Area under the 2024 Chip Tide

2024 IC New Product and Technology Launch Conference

2024 China Chip Design Achievement Award Ceremony

Opportunities and Challenges for the Development of Semiconductor Industry in the Guangdong Hong Kong Bay Area under the 2024 Chip Tide

Application of 2024 Laser Pattern Transfer Technology in Semiconductor Packaging

Advanced Packaging Analysis in the Era of Moore's Law after 2024

The Challenges of Emerging Advanced Semiconductor Packaging and Assembly Processes in 2024

2024 Third Generation Semiconductor Enterprise Awards

The specific forum speech theme and agenda shall be subject to on-site conditions

Contact information of the organizing committee:

Phone: 16601834228 Contact person: Gao Tian


Scope

2024 South China Shenzhen Semiconductor Packaging Equipment Materials and Core Component Industry Application Exhibition

Time: May 15-17, 2024

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)

Conference theme: Xinlian World Huichuang Future

The importance of the semiconductor industry is self-evident. It is the foundation of various high-tech upgrades and permeates into various top technology fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching as high as 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries, including semiconductors, were included in its "Made in China 2025" plan for strong support. The Outline for Promoting the Development of the National Integrated Circuit Industry states that by 2030, the main links of the integrated circuit industry chain must reach the international advanced level, and a group of enterprises should enter the international first tier.

Among them, companies such as Ansei Semiconductor, BYD Semiconductor, Foxconn, Huawei, Jiade New Energy, Yake Electronics, ZTE Communication, and Changan New Technology visited the site, as well as Yangjie Technology, Dongwei Semiconductor, Star Semiconductor, SMIC, Infineon, CRRC Times, Tianke Heda, Changjiang Storage, China Resources Micro, GAC Group, Intel, Microsoft China, Tencent, BYD, Ansemy, and Donglong Automobile Xiaomi Automobile, FAW Toyota, Cambrian, Ziguang Zhanrui, Zhongxin Micro, Horizon, Zhongkexin (58th Research Institute of China Electronics Corporation), Zhaoyi Innovation, China Resources Microelectronics, Huahong, Shengbang Micro, New Jieneng, Jichuang North, TCL Huaxing, Sanan Optoelectronics, CRRC Times, Tianke Heda, Silan Micro, Riyuguang, Pingtouge, Yifa Semiconductor, FAW Volkswagen, Sony, OPPO, China Electric Construction Group Jiangxi Electric Construction, Tianyue Advanced Representatives of professional buyers from Time Electric and others attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.


As a center of technological innovation in China, Shenzhen is the hub, application center, and design center for semiconductor products. The semiconductor industry in Shenzhen has maintained a high-speed growth trend for many years, especially the IC design industry, which has always been at the forefront of the country. In recent years, the domestic attention to the semiconductor industry has been unprecedented. Shenzhen is serving as the main battlefield of Guangdong Province to build the third pole of the national semiconductor industry, continuously increasing policy and financial support for the semiconductor industry. In June 2022, Shenzhen issued the "20+8" industrial policy and released the "Shenzhen Action Plan for Cultivating and Developing Semiconductor and Integrated Circuit Industry Clusters (2022-2025)", proposing to accelerate the improvement of the integrated circuit design, manufacturing, packaging and testing industry chain, promote the development of key projects such as EDA tool software, semiconductor materials, high-end chips, and advanced manufacturing, and promote the construction of key projects such as 12 inch chip production lines and third-generation semiconductors, Build a group of semiconductor and integrated circuit industry bases and industrial parks at a high level. With the release and implementation of policies, and the rapid development of industries such as 5G communication, new energy vehicles, industrial internet, big data, and photovoltaics in China, as well as the continuous promotion of the "carbon peak and carbon neutrality" green and low-carbon strategy, the application of the third-generation semiconductor market has gradually opened up, and the industry scale is constantly growing.

Exhibition highlights

◆ Collaborative innovation in technology: leverage the urban agglomeration effect of the Guangdong Hong Kong Macao Greater Bay Area, create an innovative and upgrading environment for the industrial chain, achieve the transformation from "world factory" to "Guangdong creation", and build a new generation of semiconductor industry clusters; Realize the mutual promotion of technology, industrial economy, and regional economy.

◆ Explore industrial trends and jointly create market opportunities: grasp the characteristics of the semiconductor industry, such as high requirements for collaborative innovation, large output value, and wide coverage, actively implement the "gradually forming a new development pattern with domestic circulation as the main body and domestic and international double circulation promoting each other", and promote Chinese enterprises to carry out efficient product circulation and output and share advantageous production capacity with the "the Belt and Road" and developing countries, Collaborate for development.

Gathering consumer electronics technology products: Gathering high-tech enterprises and various high-tech products in the semiconductor industry at home and abroad for centralized display, creating opportunities for project cooperation, brand building, technology guidance, and investment and financing docking for all parties.

◆ Creating a technology application scenario experience and igniting new communication trends: breaking through the traditional exhibition loop, introducing a new market communication matrix, immersive exhibition experience, and creating hot topics during the same period to ignite traffic

Visitor Source

1. Senior leaders and technical leaders of upstream and downstream enterprises in the semiconductor industry, including integrated circuit design, manufacturing, packaging and testing, semiconductor materials, equipment, etc;

Senior leaders and technical leaders of terminal application enterprises such as 2.5G applications, big data, Internet of Things, 3C laptops, consumer electronics, intelligent manufacturing, smart factories, healthcare, optical communication/optical modules, etc;

3. Representatives from relevant government departments, industry associations/societies, and research institutes;

4. Mainstream/professional media professionals and semiconductor investment institutions. Recommend brands

Simultaneous activities

2024 Guangdong Semiconductor Industry Development Trends Forum

2024 Pearl River Delta Chip Industry Innovation and Development Summit Forum

2024 China IC Design and Innovation Development Forum

2024 Shenzhen Embedded System Security Forum

2024 Shenzhen Integrated Circuit Packaging and Testing Industry Technical Exchange Conference

2024 Shenzhen Semiconductor Equipment and Core Component Manufacturers Exchange Conference

2024 Shenzhen Innovation Semiconductors and Power Supply Innovation Technology Seminar

Opportunities and Challenges for the Development of Semiconductor Industry in the Guangdong Hong Kong Bay Area under the 2024 Chip Tide

2024 IC New Product and Technology Launch Conference

2024 China Chip Design Achievement Award Ceremony

Opportunities and Challenges for the Development of Semiconductor Industry in the Guangdong Hong Kong Bay Area under the 2024 Chip Tide

Application of 2024 Laser Pattern Transfer Technology in Semiconductor Packaging

Advanced Packaging Analysis in the Era of Moore's Law after 2024

The Challenges of Emerging Advanced Semiconductor Packaging and Assembly Processes in 2024

2024 Third Generation Semiconductor Enterprise Awards

The specific forum speech theme and agenda shall be subject to on-site conditions

Contact information of the organizing committee:

Phone: 16601834228

Contact person: Gao Tian


Costs & Precautions

Please contact the exhibition organizer for implementation before participating in the exhibition.

Contact

  • Truename:16601834228
  • Mobile:16601834228
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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