The 6th Shenzhen International Semiconductor Technology and Application Exhibition SEMI-e in 2024

Time: June 26, 2024-28

Location: Hall 4/6/8, Shenzhen International Convention and Exhibition Center

Exhibition area: 60000 square meters

Exhibiting companies: 800+

Visiting audience: 60000+people

Theme activities: 40+sessions

◆ Organizer

China Communications Industry Association

Jiangsu Semiconductor Industry Association

Zhejiang Semiconductor Industry Association

Shenzhen Semiconductor Industry Association

Chengdu Integrated Circuit Industry Association

Undertaking unit

Shenzhen Zhongxin Materials Exhibition Co., Ltd

Recruiting units

Shanghai Xuanshen Exhibition Services Co., Ltd

SEMI-e Exhibition Introduction

The 6th Shenzhen International Semiconductor Technology and Application Exhibition (SEMI-e) in 2024 is jointly organized by China Communications Industry Association, Shenzhen Semiconductor Industry Association, Shenzhen Zhongxin Materials Exhibition Co., Ltd., Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Chengdu Integrated Circuit Industry Association, and other units. The 6th SEMI-el is dedicated to "computing" in "chips" and "enjoying the future with intelligence" As the theme, with an exhibition area of 60000 square meters and over 800 exhibitors, it is expected to have an audience of over 60000. This exhibition showcases various # # application solutions in addition to chip design and manufacturing, semiconductor manufacturing, packaging and testing, materials and equipment, components and testing, highlighting AI computing power, algorithms, storage, industrial control, automotive intelligence, Internet of Things, AI healthcare, education, smart energy control, and more.

The previous SEMI-e exhibition had an area of over 40000 meters and gathered 643 exhibitors, with exhibits covering electronic components and IC design; Seven major fields, including chips, wafer manufacturing and packaging, Mini/Micro LEDs, semiconductor equipment, semiconductor materials, and third-generation semiconductors, held over 40 themed events during the same period, attracting 40757 people from the semiconductor industry, automotive new energy, consumer electronics, healthcare, and industrial control to visit and exchange, with a total of 73646 visitors. Changdian Technology, Huatian Technology, Tongfu Microelectronics, Huajin Semiconductor, Jiejie Microelectronics, Jiangbolong, BYD, Sanhuan Group, Shi Creativity, Jintaike, Duntai Technology, Heketai, Peidun, Wuxi Xinxiang, InnoTech, Basic Semiconductor, Gallium Future, Tianyu Semiconductor, Shuo Ke Crystal, Hantiancheng, Hebei Puxing, Senguoke, Gallium Future, Jiangsu Nenghuawei, Juneng Chuangxin, Shengguang Silicon Research, Shanghai Microelectronics Equipment Huagong Laser, Kaige Precision Machinery, Xinyichang Kaijiu, Jintuo/Silikon, Yuhuan CNC, Liande Semiconductor, Keenshi, High Vision, Vision Technology, Hunting Intelligence, Zhengye Technology, Aisin, Hanhong Precision, Nashe Intelligence, Sitek, Ennaki, Meiji Sensors, THK, Huazhuo Jingke, Senmei Xier and other enterprises all comprehensively showcased the new technologies, products, highlights, and trends of the semiconductor industry at this exhibition, Build a new ecosystem of communication and integration in the semiconductor industry.

Among them, companies such as Ansei Semiconductor, BYD Semiconductor, Foxconn, Huawei, Jiade New Energy, Yake Electronics, ZTE Communication, and Changan New Technology visited the site, as well as Yangjie Technology, Dongwei Semiconductor, Star Semiconductor, SMIC, Infineon, CRRC Times, Tianke Heda, Changjiang Storage, China Resources Micro, GAC Group, Intel, Microsoft China, Tencent, BYD, Ansemy, Donglong Automobile, and Xiaomi Automobile FAW Toyota, Cambrian, Ziguang Zhanrui, Zhongxin Microelectronics, Horizon, Zhongkexin (the 58th Research Institute of China Electronics Corporation), Zhaoyi Innovation, CR Microelectronics, Huahong, Shengbang Microelectronics, New Jieneng, Jichuang North, TCL Huaxing, Sanan Optoelectronics, CRRC Times, Tianke Heda, Shilan Microelectronics, Riyuguang, Pingtouge, Yifa Semiconductor, Volkswagen, Sony, OPPO, China Electric Construction Group Jiangxi Electric Construction, and Tianyue Advanced Representatives of professional buyers from Time Electric and others attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.

SEMI-e Simultaneous Summit

The 5th 5G& Conference of 2023; Semiconductor Industry Technology Summit

Inviting industry experts and enterprise representatives from various links such as semiconductor manufacturing materials and raw materials to exchange and share ideas on the diversified development and technological innovation of the semiconductor materials industry chain.

The 4th Third Generation Semiconductor Industry Development Summit Forum

Gathering experts and enterprise representatives from the third-generation semiconductor industry, focusing on hot topics such as hot applications, technological research and development, key products, and opportunities and challenges, showcasing the current status, development path, future trends, and capital trends of the third-generation semiconductor industry.

◆ Conference on the Development of Artificial Intelligence Chips

Invite experts and scholars from academia, industry, and government agencies to explore the # # progress and future trends in the field of artificial intelligence chips, promote innovation and development of artificial intelligence chip technology, and enhance the competitiveness and innovation of the artificial intelligence chip industry.

2023 International Power Technology Industry Summit Forum

Focusing on the # # technology, high-end and key scientific research achievements, new technologies and products of China's power supply industry, to help exhibitors and professional visitors understand more information and # # trends related to power supply technology.

2023TWS Earphone Industry Summit Technology Forum

Focusing on the intelligent audio industry, showcasing the # # technology and industry dynamics of intelligent headphones and digital audio around headphone product solutions and development directions, promoting the healthy development of the audio industry chain.

Exhibition Area for Design, Chip, Wafer Manufacturing and Packaging

Integrated circuit design and chip, wafer manufacturing, advanced SiP packaging, power device packaging and testing, MEMS packaging and testing, silicon wafer and IC packaging carrier board, packaging substrate and application manufacturing and packaging testing, EDA, MCU, packaging substrate semiconductor materials and equipment and components, etc.

Semiconductor specific equipment; Parts exhibition area

Thinner, single product furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, loading machine, bonding machine, testing machine, sorting machine, probe table and components, etc.

◆ Advanced Materials Exhibition Area

Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresists and their supporting reagents, CMP polishing materials, targets, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc.

◆ Third generation semiconductor exhibition area

Gallium nitride (GaN) and silicon carbide (SiC), zinc oxide (ZnO), diamond, wafer, substrate and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc.

◆ IC carrier board/ceramic substrate exhibition area

Chiplet packaging technology, storage, MEMS and chip applications, materials and equipment for IC carrier boards and packaging processes (structural materials such as substrates and copper foil, as well as chemicals/consumables such as dry films and gold salts). Ceramic substrates, packaging materials, and equipment.

◆ Component exhibition area

Passive devices, semiconductor discrete devices/IGBT, 5G core components, special electronics, and components. Power management, sensors, storage devices, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches and component materials and equipment, etc.

◆ Semiconductor Display/Mini/MicrO LED Exhibition Area

OLED, AMOLED, Mini/Micro LED displays, flexible displays and materials and equipment, etc.

Machine vision and sensor exhibition area

Various sensing components, actuators, intelligent sensors, industrial sensors, sensor chips, sensor production and manufacturing equipment, accessories, etc

◆ Power supply; Energy storage technology exhibition area

Energy storage power supplies and sensors, battery management chips, power semiconductor devices and materials, and related equipment, instruments and components.

AI and computing power, algorithms, storage, and CPO co package exhibition area

Artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc.

◆ Millimeter wave radar/LiDAR/Autonomous driving exhibition area

Millimeter wave radar modules, RF chips, antennas and high-frequency PCBs, high-frequency materials, production and assembly equipment, and other products in the upstream and downstream supply chain of automotive radar sensors.

◆ Exhibition area for automotive semiconductor/automotive grade advanced packaging technology

Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc.

◆ Microelectronics Integrated Intelligent Manufacturing Zone

Electronic automation, machine automation, visual inspection, environmental protection, cleaning equipment, testing equipment, testing instruments, accessories, etc.

◆ International Brand Area

International semiconductor material suppliers, well-known equipment manufacturers, well-known packaging and testing, manufacturing, and OEM manufacturers.

• Company:Shanghai Xuanshen Exhibition Services Co., Ltd
• Telephone:021-59987827
• Truename:Zhang Ming
• Mobile:15201993739
• E-mail:2232166513@qq.com
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870