The global competition in the future semiconductor industry will become even more intense, and the restrictive clauses targeting China's semiconductor chip industry, as well as the risks of continued escalation in the future, further highlight the necessity of enhancing the independent supply capacity of various links in China's semiconductor chip industry chain, stimulating the further acceleration of domestic substitution and domestic independent control of semiconductor chips in China.

At present, the domestic semiconductor industry is accelerating its development, and the development logic of the semiconductor industry has undergone significant changes. Global division of labor and cooperation is gradually decreasing. In the context of increasing external environmental uncertainty, the independent and controllable nature of the entire industry chain is expected to surpass the industry cycle and become the main development line of the domestic semiconductor industry in the future. The next few years will be a golden period for the development of semiconductor equipment and materials enterprises in China.

In the long run, with the accelerated development of artificial intelligence, the Internet of Things, 5G, new energy and autonomous driving, and the metaverse, semiconductor chip products continue to innovate towards larger capacity, higher speed, and lower power consumption driven by electrification, intelligence, and networking. The global demand for semiconductor chips will grow rapidly in the medium to long term, and the demand for semiconductor chips in the market is very strong.

In China's 14th Five Year Plan, it is explicitly proposed to accelerate the development of integrated circuits, chips, and semiconductor industries, promote innovation in computing chips, storage chips, and other industries, accelerate the research and development of key materials such as integrated circuit design tools, key equipment, and high-purity target materials, and promote breakthroughs in characteristic processes such as insulated gate bipolar transistors (IGBTs) and microelectromechanical systems (MEMS). Layout strategic cutting-edge technologies.

IC products: IC products and technologies, IC testing methods and instruments, IC design and design tools, IC manufacturing and packaging;

Semiconductor equipment: semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, etc;

Semiconductor materials: monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, gallium oxide materials (Ga2O3), diamonds, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, etc;

Integrated circuits and applications: microprocessors, third-generation semiconductors FPGA. Power management, analog-to-digital converters, sensors, etc;

Intelligent manufacturing and high-end equipment: electronic production equipment, SMT assembly and systems, instruments and meters, 3D printing, etc;

Optoelectronics: application of infrared technology, laser intelligent manufacturing, optical communication and intelligent perception, optics, precision optical manufacturing, optoelectronic detection and testing measurement, etc;

Integrated circuit terminal products: intelligent applications such as artificial intelligence, Internet of Things, smart cities, smart homes, smart terminals, automotive electronics, LED, and healthcare;

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