The 2024 International Thermal Management Materials Technology Expo will be held from June 26th to 28th at the Bao'an International Convention Center in Shenzhen!

Oscar Annual Event for Global Thermal Management, Adhesives, and New Materials

The 12th Shenzhen International Thermal and Cooling Materials and Equipment Exhibition in 2024

Time: June 26-28, 2024

Location: Shenzhen International Convention and Exhibition Center (Hall 7)

Exhibition area: 20000 square meters | Exhibitors: 500+| Academic presentations: 20 sessions | Professional visitors: 30000 people

Simultaneous exhibitions

2024 Shenzhen International Data Center Liquid Cooling Industry Exhibition

The 5th Shenzhen Adaptive Sealants and Dispensing Equipment Exhibition in 2024

CIME 2024

With the requirements of 5G technology for big data and high performance computing, high power consumption and high heat flux density pose challenges to the thermal management of electronic devices, and the requirements for thermal conductivity have also increased sharply Heat differentiation has even become the big pay point in the development of the electronic information field Developing high thermal conductivity thermal dispersion materials to provide more effective thermal management products and solutions have become the key to current development

This exhibition will gather high quality supply chain resources in the industrial chain, advancing a conservative door for upstream and downstream enterprises to explore new materials, new processes, new technologies, and search for new markets

At present, the domestic thermal conductivity and heat dissipation material industry is developing rapidly, but due to the relatively late start of industry development, the concentration of the industry is still not high, and there is still a central gap compared to the international level The autonomy and localization of thermal conductivity and heat dissipation materials and technology are urgent In order to promote mutual cooperation and exchange in the field of thermal conductivity and heat dissipation materials, the 12th Shenzhen International Thermal Conductive and Heat Dissipating Materials and Equipment Exhibition (CIME2024), co hosted by Bohan Exhibition (Shanghai) Co., Ltd. and Shenzhen Life Exhibition Co., Ltd, Will be held grandly at the Shenzhen International Convention and Exhibition Center (New Hall 7) from June 26 to 28, 2024 At that time, we warmly welcome owned enterprises and research institutions in the field of thermal management, studies, and new materials from both domestic and international sources to visit and exchange ideas, jointly explore and promote the development and innovation of the entire industry!

CIME 2024

Exhibition time:

June 26, 2024 (Wednesday) from 9:00 to 17:00

June 27, 2024 (Thursday)/9:00-17:00

June 28, 2024 (Friday)/9:00-15:30

Exhibition location:

Hall 7 of Shenzhen International Convention and Exhibition Center (Bao'an New Hall) (No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen)

Previous Review

The CIME 2023 Shenzhen International Thermal and Cooling Exhibition was successfully concluded from August 29th to 31st at the Shenzhen International Convention and Exhibition Center The exhibition covers an area of 20000 square meters, with 507 exhibitors, and last for three days The total number of visitors reached 32324 This exhibition will focus on the theme of "New Materials, New Opportunities, and New Journey" bringing together Saint Gobain, Lianrui New Materials, Baitu Group, Zexi New Materials, Yixin Technology, Yake Technology/Huafei Electronics, Zhongteng Quartz, Yishitong, Jinge New Materials, Dongchao New Materials, Yufa Group, Hengjing New Materials, Zhongheng G New Materials, Yunhui Electronics, Yuzhou New Materials, Fangzhou New Materials, Shixing Technology, Guangdong Shengpeng, Fujian Huaqing, Fujian Zhenjing, Shangde Ceramics, Kaifeng Times, Shenzhen Ruimo Technology, Daoming Superconductor, Gaoren Technology, Taixing Zhifu, Xiamen Kaina, Liwusheng, Xianfeng Nano, Shenzhen Kedao, Shenzhen Caiqi, Jinshan Electronics, Changfei Fiber Optics, Ningbo Crystal Diamond, Pressman, Noko Carbon Materials, Huarong Technology, Hanyin Optoelectronics, Beijing Langqiao, Feirongda, Anhui Technology, Huitian New Materials, Anpin Organic Silicon, Boen Industry, Comejing New Materials, Liqun Lianfa, Zhonglan Chengguang, Hongfucheng, Rezdun Kuayue Electronics, Feihongda, Ambers, Zhongxuan Liquid, Shilaigao Electronics Electronics, Siquan New Materials, Meiqing Electronics, Ruiteng New Materials, Herun New Materials, Beihua New Rubber, Shengtang New Materials, Guangdong Evergrade, Guangdong Biaomei, Guangzhou Laibao, Thermosonic Intelligence, Jianyi Chemical, Huayi Resin, Jiangxi Guohua, Guangdong Xintao, Senjie CNC, Dongfulai Electrical, Shifeng Automation, Weide Automation, Shengdier, Jingwei ite, Fengyi Machinery Tuochuan Technology, Nuohui Technology, Wuxi Lingding, Mianyang Shinuo, Zhongyi Technology, Simida, Ruijing Technology, Changyuan Group, New Technology Intelligence, Runzhixin, Longhui Technology, Boyi New Energy, Chuyue Heat Transmission, Wanwei Heat Transmission, Weibo Chi Heat, Shunentropy Technology, Feicheng Precision, Taiyuan Aviation, Dongguan Youwei, Zhengkang Electronics, Zhen ngkai Electronics, Lindsay, Ingehead, Dianyang Technology, Aiteli, Jinghang Intelligence, Korean CGTEC More than 500 outstanding exhibitors from Japan's Nagase and South Korea's HPE conducted on site exchanges, showcasing a complete range of products, covering thoughts of new products in the entire thermal conductivity and cooling industry chain, including thermal fillers, thermal interface materials, Thermal management and cooling materials, variable radiators, and production equipment

CIME2024 Intended Procurement Enterprise

Terminals, operators/solution providers;

Apple, Samsung, Huawei, Nubia, OPPO, Xiaomi, VIVo, Chuanyin, Microsoft, ZTE, Meizu, Lenovo, TCL, LG, Amazon, Hisense, 360 phones, Asus, China Mobile, China Unicom, China Telecom, Qualcomm, etc

Intelligent hardware;

IFLYTEK | 360 | Wanxing Technology | TCL Technology | Huichuan Technology | Dahua Shares | Zhongke Chuangda | Helitai | Midea Group | Shaoyin Technology | NetEase Youdao | Jiahe Shares | Beisi Technology | Lanhe Technology | Lvmi Lianchuan | Fenda Intelligence, etc

New energy vehicles;

Tesla, BYD, Ideal Automobile, NIO, Xiaopeng Automobile, BMW, Ain, Nezha Automobile, Extreme Krypton, AITO, Geely Automobile, SAIC, FAW, GAC, BMW, Audi, Dongfeng, Toyota, Honda, Great Wall, etc

Power batteries and energy storage;

Ningde Times, BYD, Zhongchuanhang, Guoxuan High Tech, Xinwangda, Yiwei Lithium Energy, Honeycomb Energy, Funeng Technology, LG New Energy, Ruipu Lanjun, Zhongke Electric, Xinwangda, Panasonic, Samsung, Fodi Battery, Bike Battery, Pengwei Energy, Tianneng Battery, Chaowei Battery, etc

Material Enterprises;

Feirongda, Hongfucheng, Boen Industry, Huitian New Materials, Leizdun, Comet Crystal New Materials, Liqun Lianfa, Zhonglan Cheng, Zhongshi Technology, Carbon Yuan Technology, Anjie Technology, Xinlun Technology, Meiqing Technology, Huazheng New Materials, Leading Intelligence Manufacturing, Sidiq, DSM, Zhongshi Technology, 3M Company, La ird, Dow, Noland, Zhongshan Yongda, Ambers, Aochuan Technology, DuPont, etc

Processing enterprises;

Foxconn, BYD, Changying Precision, Samsung Electronics, Tongda Group, Bern Optics, Lansi Technology, OFI Optics, Chaozhou Third Ring, Ruisheng Technology, Jinsheng Precision, Yuan Technology, Xingke Electronics, Xinwangda, Bern Optics, etc

CIME2024 Audience Group

1. Consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computers and components, etc;

2. Display screens, semiconductors, military products, optoelectronics/LEDs, frequency converters, mechanical industry, aerospace, etc;

3. Computers, information technology, telecommunications, 3C/digital, communication equipment, computer peripheral products, etc;

4. Electronic devices, electronic components, instruments and meters, communication/communication networks, power electronic devices, etc;

5. Circuit board manufacturers, AI artificial intelligence, 5G terminals, intelligent automation, etc;

6. Government departments, research institutions, equipment manufacturers, traders, agents, distributors, end users, etc;

Thermal conductive fillers: inorganic non metals: aluminum oxide, silicon oxide, zinc oxide, boron nitrate, aluminum nitrate, silicon nitrate, silicon carbide, magnetic oxide, beryllium oxide, graphite, carbon black, etc; Metal powder: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal solution; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitrate, aluminum oxide, zirconia, carbides, boundaries, nitres, silicides; Glass, etc

Thermal conductive and heat dissipation materials

Thermal interface materials: thermal conductive silicone tape, film/tape, thermal conductive silicone gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: aluminum (Al2O3), aluminum nitrate (AlN), silicon nitrate (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi solid die casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphic/copper, graphic/aluminum and other composite materials, metal matrix composite materials

Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductivity film, diamond materials, etc

Phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkaline based alloys; Molten salts, salt water complexes, European mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite site materials, etc

Thermal and heat distribution components: heat pipes/soap plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, hardware stamping parts, chassis, cooling pads, fin tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, fan automatic assembly machines, radiator welding, etc;

Heat distribution equipment: liquid metal heat sink, profile heat sink, heat distribution fan, heat distribution module, thermal duty, plug in heat sink, plug in heat sink, integrated heat sink for chassis, water cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, ribbed heat sink, variable fre Frequency heat sink, heat pipe heat sink, Cross finger heat sink, liquid cooling heat sink, combination heat sink Solid state relay heat sink, high power transient heat sink and related accessories, etc;

Analysis and testing: analytical instruments, last thermal conductivity meters, thermal conductivity analysts, thermal conductivity meters, thermal expansion meters, electronic thermal tests, air flow and pressure tests, last thermal conductivity meters, material strength testing machines, thermal property measurement equipment, etc;

Processing equipment: rolling machine, coating machine, slitting machine, die cutting machine, rewinding machine, slitting machine; Cutting and rolling machine; Slitting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete sets of processes and customized equipment, etc; Etc

Thermal design: thermal simulation/thermal design software

Data Center Liquid Cooling and Cooling Technology Exhibition Area:

Practical cases of operation and maintenance of liquid cooled data centers; Cold plate liquid cooling heat transfer enhancement technology, investment liquid cooling heat transfer enhancement technology, two phase flow (pumping) cooling technology, thermal simulation of data center liquid cooling system, and compatibility of investment liquid cooling materials;

Quick connector technology, reflective and leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

• Telephone:189 3049 1940
• Truename:Mr. Zhang Desong
• Mobile:189 3049 1940
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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