International Heat Conduction and Cooling Summit Forum -2024 Shenzhen Heat Conduction and Cooling Exhibition

The 12th CIME 2024 Shenzhen International Heat Conduction and Cooling Exhibition and Summit Forum will be held from June 26th to 28th at the Bao'an International Convention Center in Shenzhen!

Oscar Annual Event for Global Thermal Management, Adhesives, and New Materials

The 12th Shenzhen International Thermal and Cooling Materials and Equipment Exhibition in 2024

Time: June 26-28, 2024 Location: Shenzhen International Convention and Exhibition Center (Hall 7)

Exhibition area: 20000 square meters | Exhibitors: 500+| Academic presentations: 20 sessions | Professional visitors: 30000 people

Simultaneous exhibitions

2024 Shenzhen International Data Center Liquid Cooling Industry Exhibition

The 5th Shenzhen Adhesive Sealants and Dispensing Equipment Exhibition in 2024

CIME 2024

With the requirements of 5G technology for big data and high-performance computing, high power consumption and high heat flux density pose challenges to the thermal management of electronic devices, and the requirements for thermal conductivity have also sharply increased. Heat dissipation has even become a major pain point in the development of the electronic information field. Developing high thermal conductivity thermal dissipation materials to provide more efficient thermal management products and solutions has become the key to current development.

This exhibition will gather high-quality supply chain resources in the industrial chain, providing a convenient door for upstream and downstream enterprises to explore new materials, new processes, new technologies, and search for new markets.

At present, the domestic thermal conductivity and heat dissipation material industry is developing rapidly, but due to the relatively late start of industry development, the concentration of the industry is still not high, and there is still a certain gap compared to the international level. The autonomy and localization of thermal conductivity and heat dissipation materials and technology are urgent. In order to promote mutual cooperation and exchange in the field of thermal conductivity and heat dissipation materials, the 12th Shenzhen International Thermal Conductivity and Heat Dissipation Materials and Equipment Exhibition (CIME2024), co hosted by Bohan Exhibition (Shanghai) Co., Ltd. and Shenzhen Liyue Exhibition Co., Ltd., will be held grandly at the Shenzhen International Convention and Exhibition Center (New Hall 7) from June 26 to 28, 2024. At that time, we warmly welcome renowned enterprises and research institutions in the field of thermal management, adhesives, and new materials from both domestic and international sources to visit and exchange ideas, jointly explore and promote the development and innovation of the entire industry!

CIME 2024

Exhibition time:

June 26, 2024 (Wednesday)/9:00-17:00

June 27, 2024 (Thursday)/9:00-17:00

June 28, 2024 (Friday)/9:00-15:30

Exhibition location:

Hall 7 of Shenzhen International Convention and Exhibition Center (Bao'an New Hall) (No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen)

◆ Scope of exhibits

Thermal conductive fillers: inorganic non-metals: aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal solution; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitride, aluminum oxide, zirconia, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductive and heat dissipation materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal matrix composite materials

Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductivity film, diamond materials, etc

Phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt water complexes, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal and heat dissipation components: heat pipes/soaking plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, hardware stamping parts, chassis, cooling pads, fin tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, fan automatic assembly machines, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, thermal conduit, plug-in heat sink, plug-in heat sink, integrated heat sink for chassis, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, ribbed heat sink, variable frequency heat sink, heat pipe heat sink, cross finger heat sink, liquid cooling heat sink, combination heat sink Solid state relay heat sink, high-power transistor heat sink and related accessories, etc;

Analysis and testing: analytical instruments, laser thermal conductivity meters, thermal conductivity analyzers, thermal conductivity meters, thermal expansion meters, electronic thermal testers, air flow and pressure testers, laser thermal conductivity meters, material strength testing machines, thermal property measurement equipment, etc;

Processing equipment: rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Cutting and rolling machine; Slitting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete sets of processes and customized equipment, etc; Waiting

Thermal design: thermal simulation/thermal design software

Data Center Liquid Cooling Technology Exhibition Area: Practical Cases of Liquid Cooling Data Center Operations and Maintenance; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, data center liquid cooling system heat, and compatibility of immersion liquid cooling materials; Quick connector technology, refrigerant and leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Previous Review

The CIME 2023 Shenzhen International Thermal and Cooling Exhibition was successfully concluded from August 29th to 31st at the Shenzhen International Convention and Exhibition Center. The exhibition covers an area of 20000 square meters, with 507 exhibitors, and lasted for three days. The total number of visitors reached 32324. This exhibition will focus on The theme of "New Materials, New Opportunities, and New Journey" brings together Saint Gobain, Lianrui New Materials, Baitu Co., Ltd., Zexi New Materials, Yixin Technology, Yake Technology/Huafei Electronics, Zhongteng Quartz, Yishitong, Jinge New Materials, Dongchao New Materials, Yufa Group, Hengjing New Materials, Zhongheng New Materials, Yunhui Electronics, Yuzhou New Materials, Fangzhou New Materials, Shixing Technology, Guangdong Shengpeng, Fujian Huaqing, Fujian Zhenjing, Shangde Ceramics, Kaifeng Times, Shenrui Moene, Daoming Superconductor, Gaoene Technology, Taixing Zhifu, Xiamen Kaina, Liwusheng, Xianfeng Nano, Shenzhen Kedao, Shenzhen Caiqi, Jinshan Electronics, Changfei Fiber Optics, Ningbo Jingzhuan, Pressman, Norco Carbon Materials, Huarong Technology, Hanyin Optoelectronics, Beijing Langqiao, Feirongda, Aochuan Technology, Huitian New Materials, Anpin Organic Silicon, Boen Industry, Comejing New Materials, Liqun Lianfa, Zhonglan Chengguang, Hongfucheng, Leizdun, Kuayue Electronics, Feihongda, Ambers, Zhongxuan Liquid, Shilaigao Electronics, Siquan New Materials, Meiqing Electronics, Ruiteng New Materials, Herun New Materials, Beihua New Rubber, Shengtang New Materials, Guangdong Evergrande, Guangdong Biaomi Guangzhou Laibao, Hot Sound Intelligence, Jian Yi Chemical, Huayi Resin, Jiangxi Guohua, Guangdong Xintao, Senjie CNC, Dongfulai Electromechanical, Shifeng Automation, Weide Automation, Shengdier, Jingweite, Fengyi Machinery, Tuochuan Technology, Nuohui Technology, Wuxi Lingding, Mianyang Shinuo, Zhongyi Technology, Simida, Ruijing Technology, Changyuan Group, New Technology Intelligence, Runzhixin, Longhui Technology, Boyi New Energy, Chuyue Heat Transmission, Wanwei Heat Transmission, Weibo Chi Heat, Shunentropy Technology, Feicheng Precision, Taiyuan Aviation, Dongguan Youwei, Zhengkang Electronics, Zhengkai Electronics, Lindsay, Yinge More than 500 outstanding exhibitors, including Hyde, Dianyang Technology, Aiteli, Jinghang Intelligence, CGTEC from South Korea, Nagase from Japan, and HPE from South Korea, conducted on-site exchanges. The exhibition features a complete range of exhibits, covering thousands of new products in the entire thermal conduction and cooling industry chain, including thermal fillers, thermal interface materials, thermal management and cooling materials, various radiators, and production equipment.

CIME2024 Intended Procurement Enterprise

Terminals, operators/solution providers;

Apple, Samsung, Huawei, Nubia, OPPO, Xiaomi, VIVo, Chuanyin, Microsoft, ZTE, Meizu, Lenovo, TCL, LG, Amazon, Hisense, 360 phones, Asus, China Mobile, China Unicom, China Telecom, Qualcomm, etc

Intelligent hardware;

IFLYTEK | 360 | Wanxing Technology | TCL Technology | Huichuan Technology | Dahua Shares | Zhongke Chuangda | Helitai | Midea Group | Shaoyin Technology | NetEase Youdao | Jiahe Shares | Beisi Technology | Lanhe Technology | Lvmi Lianchuang | Fenda Intelligence, etc

New energy vehicles;

Tesla, BYD, Ideal Automobile, NIO, Xiaopeng Automobile, BMW, Ain, Nezha Automobile, Extreme Krypton, AITO, Geely Automobile, SAIC, FAW, GAC, BMW, Audi, Dongfeng, Toyota, Honda, Great Wall, etc

Power batteries and energy storage;

Ningde Times, BYD, Zhongchuanghang, Guoxuan High Tech, Xinwangda, Yiwei Lithium Energy, Honeycomb Energy, Funeng Technology, LG New Energy, Ruipu Lanjun, Zhongke Electric, Xinwangda, Panasonic, Samsung, Fodi Battery, Bike Battery, Pengwei Energy, Tianneng Battery, Chaowei Battery, etc

Material enterprises;

Feirongda, Hongfucheng, Boen Industry, Huitian New Materials, Leizdun, Comet Crystal New Materials, Liqun Lianfa, Zhonglan Chenguang, Zhongshi Technology, Carbon Yuan Technology, Anjie Technology, Xinlun Technology, Meiqing Technology, Huazheng New Materials, Leading Intelligence Manufacturing, Sidiq, DSM, Zhongshi Technology, 3M Company, Laird, Dow, Noland, Zhongshan Yongda, Ambers, Aochuan Technology, DuPont, etc

Processing enterprises;

Foxconn, BYD, Changying Precision, Samsung Electronics, Tongda Group, Bern Optics, Lansi Technology, OFI Optics, Chaozhou Third Ring, Ruisheng Technology, Jinsheng Precision, Yian Technology, Xingke Electronics, Xinwangda, Bern Optics, etc

CIME2024 Audience Group

1. Consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computers and components, etc;

2. Display screens, semiconductors, military products, optoelectronics/LEDs, frequency converters, mechanical industry, aerospace, etc;

3. Computers, information technology, telecommunications, 3C/digital, communication equipment, computer peripheral products, etc;

4. Electronic devices, electronic components, instruments and meters, communication/communication networks, power electronic devices, etc;

5. Circuit board manufacturers, AI artificial intelligence, 5G terminals, intelligent automation, etc;

6. Government departments, research institutions, equipment manufacturers, traders, agents, distributors, end users, etc;

Contact information of the organizing committee

Address: Room 305, Building A, No. 1325 Hengnan Road, Minhang District, Shanghai

Contact person: Mr. Lu Haiwei 187-0171-7965 (same as WeChat)

Thermal conductive fillers: inorganic non-metals: aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal solution; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Electronic packaging materials: metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber; Ceramic materials: aluminum nitride, aluminum oxide, zirconia, carbides, borides, nitrides, silicides; Glass, etc

Thermal conductive and heat dissipation materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal matrix composite materials

Thermal conductive polymers: thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal insulation plastics, thermal rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductivity film, diamond materials, etc

Phase change materials (heat storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt water complexes, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal and heat dissipation components: heat pipes/soaking plates, copper clad plates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT) and modules, etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, hardware stamping parts, chassis, cooling pads, fin tubes, heat transfer tubes, heat transfer plates, cooling modules, touch panels, fan mesh covers, fans, motors, fan automatic assembly machines, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, thermal conduit, plug-in heat sink, plug-in heat sink, integrated heat sink for chassis, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, ribbed heat sink, variable frequency heat sink, heat pipe heat sink, cross finger heat sink, liquid cooling heat sink, combination heat sink Solid state relay heat sink, high-power transistor heat sink and related accessories, etc;

Analysis and testing: analytical instruments, laser thermal conductivity meters, thermal conductivity analyzers, thermal conductivity meters, thermal expansion meters, electronic thermal testers, air flow and pressure testers, laser thermal conductivity meters, material strength testing machines, thermal property measurement equipment, etc;

Processing equipment: rolling machine, coating machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Cutting and rolling machine; Slitting machines, precision cutting machines, automated slitting machines, thermal conductive material production equipment, CNC coil cutting equipment, CNC machine tools, automated production lines and heat transfer laboratories, complete sets of processes and customized equipment, etc; etc.

Thermal design: thermal simulation/thermal design software

Data Center Liquid Cooling Technology Exhibition Area: Practical Cases of Liquid Cooling Data Center Operations and Maintenance; Cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, two-phase flow (pumping) cooling technology, data center liquid cooling system heat, and compatibility of immersion liquid cooling materials; Quick connector technology, refrigerant and leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

• Company:Organizing Committee of 2024 Shenzhen Heat Conduction and Cooling Exhibition
• Truename:Lu Haiwei
• Mobile:18701717965
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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