Exhibition Introduction:

The Shenzhen International Semiconductor Technology and Application Exhibition (SEMI-e) is jointly organized by China Communications Industry Association, Shenzhen Semiconductor Industry Association, Shenzhen Zhongxin Materials Exhibition Co., Ltd., Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Chengdu Integrated Circuit Industry Association, and other units. The exhibition showcases the semiconductor industry chain, mainly focusing on chip design and manufacturing, integrated circuits, packaging and testing, materials and equipment, 5G new applications, and new displays. It has now become the largest, most comprehensive, and most influential semiconductor industry event in South China, with the most diverse activity content.
The 6th SEMI-e is themed "Computing in the Core and Enjoying the Future", with an exhibition area of 60000 square meters and over 800 exhibitors, with an expected audience of over 60000. This exhibition showcases various latest application solutions, including AI computing power, algorithms, storage, industrial control, automotive intelligence, Internet of Things, AI healthcare, education, and smart energy control, in addition to chip design and manufacturing, semiconductor manufacturing, packaging and testing, materials and equipment, components and testing.
The previous SEMI-e exhibition covered an area of over 40000 square meters and gathered 643 exhibitors. The exhibits covered seven major fields: electronic components, IC design&chips, wafer manufacturing and packaging, Mini/Micro LED, semiconductor equipment, semiconductor materials, and third-generation semiconductors. During the same period, more than 40 themed events were held, attracting 40757 people from the semiconductor industry, automotive new energy, consumer electronics, healthcare, and industrial control to visit and exchange, with a total of 73646 visitors. Changdian Technology, Huatian Technology, Tongfu Microelectronics, Huajin Semiconductor, Jiejie Microelectronics, Jiangbolong, BYD, Sanhuan Group, Shi Creativity, Jintaike, Duntai Technology, Heketai, Peidun, Wuxi Xinxiang, InnoTech, Basic Semiconductor, Gallium Future, Tianyu Semiconductor, Shuo Ke Crystal, Hantiancheng, Hebei Puxing, Senguoke, Gallium Future, Jiangsu Nenghuawei, Juneng Chuangxin, Shengguang Silicon Research, Shanghai Microelectronics Equipment Huagong Laser, Kaige Precision Machinery, Xinyichang Kaijiu, Jintuo/Silikon, Yuhuan CNC, Liande Semiconductor, Keenshi, High Vision, Vision Technology, Hunting Intelligence, Zhengye Technology, Aisin, Hanhong Precision, Nashe Intelligence, Sitek, Ennaki, Meiji Sensors, THK, Huazhuo Jingke, Senmei Xier and other enterprises all comprehensively showcased the new technologies, products, highlights, and trends of the semiconductor industry at this exhibition, Build a new ecosystem of communication and integration in the semiconductor industry.
Among them, companies such as Ansei Semiconductor, BYD Semiconductor, Foxconn, Huawei, Jiade New Energy, Yake Electronics, ZTE Communication, and Changan New Technology visited the site, as well as Yangjie Technology, Dongwei Semiconductor, Star Semiconductor, SMIC, Infineon, CRRC Times, Tianke Heda, Changjiang Storage, China Resources Micro, GAC Group, Intel, Microsoft China, Tencent, BYD, Ansemy, and Donglong Automobile Xiaomi Automobile, FAW Toyota, Cambrian, Ziguang Zhanrui, Zhongxin Micro, Horizon, Zhongkexin (58th Research Institute of China Electronics Corporation), Zhaoyi Innovation, China Resources Microelectronics, Huahong, Shengbang Micro, New Jieneng, Jichuang North, TCL Huaxing, Sanan Optoelectronics, CRRC Times, Tianke Heda, Silan Micro, Riyuguang, Pingtouge, Yifa Semiconductor, FAW Volkswagen, Sony, OPPO, China Electric Construction Group Jiangxi Electric Construction, Tianyue Advanced Representatives of professional buyers from Time Electric and others attended this exhibition to explore the charm of technology from zero distance and assist in the innovative development of the semiconductor industry.

Exhibition scope:

1. Design, chip, wafer manufacturing and packaging: Integrated circuit design and chip, wafer manufacturing, SiP advanced packaging, power device packaging and testing, MEMS packaging and testing, silicon wafer and IC packaging carrier board, packaging substrate and application manufacturing and testing, EDA, MCU, packaging substrate semiconductor materials and equipment and components, etc
2. Advanced materials: silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresists and their supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc
3. IC carrier board/ceramic substrate: IC carrier board and packaging process (substrate, copper and other structural materials, dry film, gold salt and other chemicals/consumables) Chiplet packaging technology, storage, MEMS and chip applications, materials and equipment. Ceramic substrates, packaging materials and equipment, etc
4. Semiconductor Display/Mini/Micro LED: OLED, AMOLED, Mini/Micro LED Display, Flexible Display and Materials and Equipment, etc
5. Semiconductor specific equipment and components: thinning machine, single product furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, loading machine, bonding machine, testing machine, sorting machine, probe table and components, etc
6. Third generation semiconductors: nitride (GaN) and silicon carbide (SiC), zinc oxide (Zn0), diamond, wafer, substrate and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc
7. Components: passive devices, semiconductor discrete devices/IGBT, 5G core components, special electronics, and components. Power management, sensors, storage devices, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches and component materials and equipment, etc
8. Machine vision and sensors: various sensing components, actuators, intelligent sensors, industrial sensors, sensor chips, sensor production and manufacturing equipment, accessories, etc
9: Power&Energy Storage Technology: Energy storage power supplies and sensors, battery management chips, power semiconductor devices and materials, related equipment, instruments and components, etc
10. Millimeter wave radar/LiDAR/Autonomous driving: Millimeter wave radar modules, RF chips, antennas and high-frequency PCBs, high-frequency materials, production and assembly equipment, and other products in the upstream and downstream supply chain of automotive radar sensors
11. Microelectronics Integrated Intelligent Manufacturing Zone: Electronic Automation, Machine Automation, Visual Inspection, Environmental Protection, Cleaning Equipment, Testing Equipment, Testing Instruments, Accessories, etc
12. AI and computing power, algorithms, storage, CPO co packaging: artificial intelligence chips, solutions, computing power chips and solutions, algorithm data storage, optoelectronic co packaging modules and technologies and equipment, etc
13. Automotive semiconductor/automotive grade advanced packaging technology: automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SIC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, international semiconductor material manufacturers, well-known equipment manufacturers, well-known packaging and testing, manufacturing, and OEM manufacturers, etc

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Truename:Mr. Lu
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shenzhen

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