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ICSZChina2024 China Semiconductor Manufacturing Supply Chain Innovation and Development Conference and Exhibition
Industry: Communications / Electronics
Cycle: Once a year
Time: 2024/04/09 - 04/11 (Tues To Thur Total 3 Days)    Error Correction
Address: Shenzhen · Guangdong Shenzhen Convention and Exhibition Center (Futian District) ChinaGuangdong ProvinceShenzhen CityFutian District Intersection of Fuhua 3rd Road and Jintian Road in Futian District, Shenzhen City, Guangdong Province
Sponsor:Guangdong Zhongke Aviation International Exhibition Co., Ltd
Organizer:Guangdong Zhongke Aviation International Exhibition Co., Ltd
Co-organizer:Guangdong Zhongke Aviation International Exhibition Co., Ltd
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INTRODUCTION

ICSZChina2024中国半导体制造供应链创新发展大会暨展览会-大号会展 www.dahaoexpo.com

ICSZChina2024中国半导体制造供应链创新发展大会暨展览会-大号会展 www.dahaoexpo.com

The global semiconductor industry is in a new round of deep adjustment, and major economies around the world are fully deploying semiconductors and actively integrating into the international industrial chain. China is the world's largest consumer of semiconductors and also the world's largest importer of chips. As a national strategic industry, semiconductors have entered a critical period of development due to the influence of the international situation. It is necessary to effectively overcome the adverse effects of the external environment. "Innovation, openness, green, and integration" is not only the development direction of the semiconductor industry, but also an important opportunity and strategy for seeking new transformation and upgrading, Promoting high-level opening up to the outside world and building a new development pattern with domestic circulation as the main body and domestic and international dual circulation promoting each other is not only a strategy and call of the government, but also a practical action of Chinese semiconductor enterprises.

ICSZChina2024中国半导体制造供应链创新发展大会暨展览会-大号会展 www.dahaoexpo.com

ICSZChina2024中国半导体制造供应链创新发展大会暨展览会-大号会展 www.dahaoexpo.com

Localization is for better internationalization. In order to further strengthen exchanges and cooperation in the semiconductor and integrated circuit industry, promote collaborative innovation and development of the industrial chain, supply chain, and value chain, and lay out future technologies to seize the high ground of development, the organizing committee plans to hold a conference in Shenzhen in April 2024“Guoqixin EquipmentAdvancing chip journey”The 2024 China Semiconductor Manufacturing Supply Chain Innovation and Development Conference, with the theme of "2024," focuses on hot topics and invites industry leaders, experts and scholars, as well as outstanding executives from upstream and downstream enterprises in the industry chain to engage in dialogue with leading domestic and foreign industry leaders. Under the new business model, the conference aims to help industry colleagues understand the global semiconductor industry landscape, cutting-edge technologies, and market trends, share the wisdom and vision of industry leaders, and have face-to-face exchanges with them. Seize opportunities, unite and move forward, and work together to promote the high-quality development, strength, and growth of China's semiconductor industry,


Scope

The forum will solicit a keynote report on the supply chain direction of semiconductor and integrated circuit manufacturing. The proposed thematic forum direction is as follows:

Topic 1: Forum on the Current Status and Development Trends of Wafer Manufacturing Equipment;

Topic 2: Forum on Third Generation and Compound Semiconductors;

Topic 3: Forum on Promoting Innovation in New Equipment and Materials through New Devices and Processes;

Topic 4: Forum on Advanced Packaging Technology and System Integration;

Topic 5: Innovation Forum on Packaging and Testing Process Equipment and Materials;

Topic 6: Forum on Investment and Financing of Semiconductor Equipment and Core Components;

Topic 7: Forum on Advanced Semiconductor Materials;

Topic 8: Forum on Semiconductor Intelligent Manufacturing and Future Factory Design and Construction;

Topic 9: Special Meeting on Brand Recommendation of Advanced Technologies, Equipment, and Materials for Localization;

Display content:

EDA/IP, specialized equipment for wafer manufacturing, packaging, testing, cleaning, semiconductor materials, third-generation semiconductor technology and equipment, key and core components, semiconductor intelligent factories, automation and robotics, and related supporting service technologies.


Costs & Precautions

The booth arrangement follows the principle of "apply first, pay first, and arrange first". The organizing committee requests the "Exhibition Application Form". After receiving the full payment, the organizing committee will issue the "Booth Confirmation Form" and "Exhibitor Handbook" to the applying unit. The booth fee standards are as follows:

Booth price

Standard booth (3 * 3 meters): 15000 yuan/room/exhibition period

Light land (starting from 36 square meters): 1500 yuan/square meter/exhibition period


Contact

  • Company:Guangdong Zhongke Aviation International Exhibition Co., Ltd
  • Telephone:15622816111
  • Truename:Cao Pei
  • Mobile:15622816111
  • Address:Intersection of Fuhua 3rd Road and Jintian Road in Futian District, Shenzhen City, Guangdong Province

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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