The 3rd Shanghai International Data Center Liquid Cooling and Cooling Exhibition in 2024

The 3rdInternational Data Center Liquid Cooling and Cooling Expo 2024

Simultaneously held: The 13th Shanghai International Exhibition of Thermal and Heat Conducting Materials and Equipment

Time: December 18-20, 2024 Location: Shanghai New International Expo Center

CIME 2024 is a professional and authoritative international event that covers the entire data center's liquid cooling and heat dissipation.

Looking forward to meeting you on-site at CIME 2024!

Exhibition Information

In recent years, with the explosive growth of big data, the data throughput and computational load required to be carried by data centers have significantly increased, leading to an increasing demand for servers in the data center industry. However, due to the limited area of data center construction and environmental regulations, the server carrying capacity of existing data centers in China is relatively limited, and they need to continuously increase the power density of individual cabinets to meet the rapidly growing demand for computing power. With the rapid development of data centers, the rapid increase in energy consumption has become an issue that cannot be ignored in the development of the data center industry. Especially after the release of the dual carbon goals of peaking carbon emissions by 2030 and achieving carbon neutrality by 2060, the guidance of national policies and future regulation have become strong driving forces for energy conservation and consumption reduction in data centers. How to better reduce data center PUE has become a focus and challenge in the industry. Based on its own efficient technological advantages, liquid cooling has become a pioneer in further reducing PUE in data centers.

With the development of 5G technology, edge computing, AI and other applications, the power density of single cabinet will become higher and higher, and the proportion of liquid cooling in industrial applications will become larger and larger. Although the trend is good, we also clearly see that the entire industry ecosystem of liquid cooling is not yet perfect, and there is great room for improvement in both cost and technology for liquid cooling products and solutions. The "CIME 2024 Shanghai International Data Center Liquid Cooling and Cooling Exhibition" will focus on showcasing the latest products and technologies in the liquid cooling industry, establishing brand image for enterprises, promoting trade cooperation and market development, leading industry trends, strengthening production, research and development, and sales interaction, deeply understanding the new development trends of domestic and foreign liquid cooling industry markets, exploring new demands in the future liquid cooling industry market with a development perspective, and innovating the exhibition content, Professional visitors are organized in an all-round and multi-level way, providing an optimal platform for technical exchanges, Products Show and trade negotiations for exhibitors and visitors. The 2024 Shanghai International Data Center Liquid Cooling Exhibition will be held at the Shanghai New International Expo Center from December 18th to 20th, 2024. At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!

Target audience: We mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation, aerospace vehicles, aircraft, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.

Pioneer of Green Revolution Liquid Cooling

Organizational unit    

Organizer: Organizing Committee of the 13th Shanghai Heat Conduction and Cooling Exhibition

Bohan Exhibition (Shanghai) Co., Ltd

Thanks to: National Supercomputing Shenzhen Center

Organizer: Shenzhen Liyue Exhibition Co., Ltd

Bohan Exhibition (Shanghai) Co., Ltd

Top tier event

A professional and authoritative international event - CIME 2024 plans to invite 400 well-known enterprises, including National Supercomputing Shenzhen Center, Tencent, Baidu, NetEase Technology, Huawei, Institute of Physical and Chemical Technology of the Chinese Academy of Sciences, Guangzhou Energy Research Institute of the Chinese Academy of Sciences, Inspur Group, Guangdong Telecom Planning and Design Institute, Guangdong Heyi, 3M, Gaolan Energy Conservation, Ruisi Bochuang, Shenling, Ouke Air Conditioning, Alpha, Gree, Yishite, and Tongtaiyi, to participate, The expected exhibition area is 20000 square meters.

During the CIME 2024 exhibition, multiple comprehensive technical exchange activities and academic seminars will be held simultaneously, aiming to fully cooperate with exhibitors' diversified promotional strategies and discuss industry hot topics. The cost of each event is 20000 yuan for domestic enterprises and 4000 dollars for foreign enterprises (1 hour, less than 1 hour will be charged per event).

Booth Description:

1. Standard booth configuration: Chinese and English lintels, two fluorescent lamps, partition (height 250cm, usable height 246cm), one negotiation table, two chairs, one 400W/220V power socket, and carpet;

2. Exhibitors who have booked their own space will be responsible for the expenses required for booth layout. Please refer to the exhibitor manual for details.

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Bohan Exhibition (Shanghai) Co., Ltd

Address: Room 305, Building A, No. 1325 Hengnan Road, Shanghai

Postal Code: 201114

Contact person: Mr. Zhang 189-3049-1940 (same as WeChat)

Exhibition scope:

1. Practical cases of operation and maintenance of liquid cooled data centers, cold plate liquid cooling heat transfer enhancement technology, immersed liquid cooling heat transfer enhancement technology, spray liquid cooling technology, two-phase flow (pumping) cooling technology, thermal simulation of data center liquid cooling system, compatibility of immersed liquid cooling materials, quick connector technology, electronic fluorine liquid, electronic coolant, refrigerant, liquid cooling heat dissipation module, liquid cooling system design, liquid cooling materials, liquid cooling components Leakage detection technology, intelligent fluid distribution technology, and intelligent temperature monitoring technology;

2. Application of data centers: modular data centers, data cloud boxes, computer room solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for computer rooms, UPS uninterruptible power supply, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

• Company:Bohan Exhibition (Shanghai) Co., Ltd
• Truename:Mr. Zhang
• Mobile:189-3049-1940
• Address:2345 Longyang Road, Pudong New Area, Shanghai

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