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2022 China (Shenzhen) International Electronic Thermal Conductive Materials and Equipment Exhibition

Time:

Time:2022November16-20Of5day

Venue: Shenzhen Convention and Exhibition CenterFukuda

Exhibition introduction

The future of 5G has come, so the world will be very different. At present, consumer electronics are becoming smaller, thinner and more intelligent. The investment in communication base station equipment brought by 5G commercial use and the vigorous development of power batteries will greatly boost the demand for thermal conductive and heat dissipation materials and equipment. There are many downstream applications of heat conduction and heat dissipation, including consumer electronics, automobiles, base stations, servers and data centers, with a market space of 100 billion. It is estimated that the compound annual growth rate of the heat conduction and heat dissipation industry will reach 8% from 2018 to 2023, and the market size is expected to grow from 149.7 billion yuan in 2018 to 219.9 billion yuan in 2023.

In order to further promote the development of the electronic heat conduction and heat dissipation industry, fully display the cutting-edge equipment and technology in the electronic heat conduction and heat dissipation industry, actively promote the exchange and interaction of the electronic heat conduction and heat dissipation industry, strengthen the exchange and cooperation awareness of the electronic heat conduction and heat dissipation industry, and achieve mutual promotion and common development, the "2022 China (Shenzhen) International Electronic Heat conduction and Heat Dissipation Materials and Equipment Exhibition" will be held on November 16-20, 2022Shenzhen Convention and Exhibition CenterFukudaIt was grandly held and divided into three parts: exhibition, summit forum and academic conference. It is the annual grand meeting of the electronic heat conduction and heat dissipation industry and a comprehensive professional exhibition platform for exchange and cooperation between the electronic heat conduction and heat dissipation industry and related industries.

1、 Thermal conductive graphite:

Graphene, thermal conductive graphite material, graphitized film, graphite heat dissipation film, thermal conductive graphite, graphite heat sink, graphite film, graphite insulation film, graphite film coiled materials and related equipment;

2、 Heat conduction and heat dissipation materials:

Liquid metal heat conduction sheet, silica gel sheet, plastic, insulating material, interface material, double-sided adhesive, heat conduction and heat dissipation substrate, heat conduction silicon tape, adhesive tape, heat dissipation oil, paint, phase change material, heat dissipation film, heat conduction mud, heat conduction film silica gel, paste, mica sheet, gasket, silicone grease, potting adhesive, etc;

3、 Cooling fan accessories:

Copper, aluminum, iron heat sink, sheet metal, metal stamping parts, chassis, heat sink, fin tube, heat conduction tube, heat conduction plate, heat dissipation module, touch panel, fan net cover, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

4、 Heat dissipation equipment:

Liquid metal radiator, profile radiator, cooling fan, plug-in radiator, pin type radiator, chassis integrated radiator, water-cooled radiator, resistance radiator, LED radiator, CPU radiator, IGBT radiator, electric welding machine radiator, fin type radiator, variable frequency radiator, heat pipe radiator, interdigital radiator, liquid cooling radiator, combined radiator, radiator for solid-state relay High power transistor radiator and related accessories;

5、 Analysis and detection:

Analytical instrument, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal dilatometer, electronic thermal tester, air volume and wind pressure tester, laser thermal conductivity meter, material strength tester, thermophysical property measuring equipment, etc;

• Company:Beijing Jiangheng Bowei International Exhibition Co., Ltd
• Telephone:18601626297
• Truename:Mr. Pu
• Mobile:18601626297
• E-mail:1159191983@qq.com
• Address:Miyun District, Beijing

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