2022 The 5th Shenzhen International Semiconductor Exhibition · Shenzhen Semiconductor Materials Exhibition

Exhibition time: December 7-9, 2022
Venue: Shenzhen International Convention and Exhibition Center (Bao'an New Museum)

Organizations: China New Materials Exhibition, China Communications Industry Association, Shenzhen Semiconductor Industry Association, Guangdong Integrated Circuit Industry Association, Guangzhou Semiconductor Industry Association, Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Chengdu Integrated Circuit Industry Association

Organizer: Shenzhen Zhongxincai Exhibition Co., Ltd

Exhibition introduction
With the theme of "core opportunity? Smart future", SEMI-e gathers a large number of industry experts and scholars to further strengthen exchanges and cooperation in the global integrated circuit industry. Centering on China's international integrated circuit industry and application, SEMI-e is based in Shenzhen and radiates across the country, aiming to focus on the display of the development achievements of integrated circuit industry, and accelerate the breakthrough in key links of the industrial chain such as high-end chip design, key devices, core equipment materials, EDA design tools, Strengthen the cooperation of the Pearl River Delta industry chain, gradually form a comprehensive integrated circuit industry cluster, build a platform for South China's integrated circuit industry exchange and trade, and promote the faster and better development of South China's integrated circuit industry cluster. This exhibition conforms to the industrial development trend and serves more than ten emerging industries.

With an exhibition area of 55000 square meters, more than 800 exhibitors will focus on the semiconductor industry chain integrating integrated circuits, electronic components, third-generation semiconductors and industrial chain materials and equipment. Several summit forums were held at the same time, with 80000 visitors covering integrated circuits, 5G applications, automotive electronics, industrial electronics, medical electronics, the Internet of Things, consumer electronics, smart appliances, new displays, industrial interconnection, intelligent manufacturing, artificial intelligence, wireless charging and other fields.

Highlights of the exhibition: with the full support of high-end authoritative government institutions and industry associations, build a semiconductor production and demand supply and marketing platform with national influence and demonstration effect; The upstream and downstream industries of semiconductor industry fully participated in the exhibition and built an international, cutting-edge and market-oriented high-end cooperation and exchange platform; Create a butler service, display 50000 square meters, connect 90000+high-quality buyers to the actual market, and several professional purchase tours with more than 100 people; Capture different types of professional audiences and high potential buyers, with strong data accumulation and market awareness;
National level media escort, scientific and technological achievements and brand building are comprehensively integrated and displayed;

Focus on the frontier: star effect, show on the same stage with leading manufacturers of the same industry at home and abroad, and learn technology; Gather industry elites, grasp market trends and capture global business opportunities; Diversified publicity and promotion platform, effectively targeting tens of thousands of professional buyers; Focus on the hot trend of the industry and connect the global industry chain; The global media directly hit the scene and reported in full detail

Audience
The professional audience group covers industrial electronics, consumer electronics, automobiles, communication systems, medical care, household appliances, computers and peripherals, engineering machinery, new energy, the Internet of Things, aerospace, military, security, lighting engineering, rail transit, intelligent buildings, etc.
Full media coverage
CCTV, Sina, Sohu, NetEase, Tencent, Phoenix, industry websites and other well-known national network media have tracked the whole process, built a strong network cluster, and built an online exhibition that will never end. The exhibition will be held once and the service will be long.

Scope of exhibition
1、 Electronic components exhibition area: passive components, semiconductor discrete components/IGBT 5G core components, special electronics, components, power management, sensors, memories, connector relays, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filter components, PCB boards, motor fan electroacoustic components, display devices, two * * tubes, three * * tubes filter components, switches and components materials and equipment, etc
2、 IC design and chip exhibition area: IC and related electronic product design, artificial intelligence chip, power management chip, Internet of Things chip, 5G communication chip and scheme, automobile electronic chip, security control chip, digital analog hybrid communication RF chip, memory chip, LED lighting and display drive chip, etc
3、 Semiconductor equipment exhibition area: thinner, single crystal furnace, grinder, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, crystal fixation machine, plasma cleaning equipment, cutting machine, chip loader, bonding machine, wire bonder, reflow soldering, wave soldering, testing machine, sorter, coupling machine, tape forming machine, detection equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision sliding table Stepping motor, valve, probe table, clean room equipment, water treatment, etc
4、 The third generation semiconductor zone: the third generation semiconductor silicon carbide SiC, gallium nitride GaN, wafers, substrates, packaging, testing, optoelectronic devices (LED LED, laser LD, detector UV), power electronic devices (LED, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC)
5、 Wafer manufacturing and packaging exhibition area: wafer manufacturing, SiP advanced packaging, OSATs, EMS, OEMs, IDM, silicon wafer and IC packaging carrier, printed circuit board, packaging substrate and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, EDA, MCU, printed circuit board, packaging substrate semiconductor materials and equipment
6、 Semiconductor materials exhibition area: silicon wafers, silicon wafers, photoresists, wafer tapes, photomask plates, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slices, grinding discs, polishing discs, films, etc

Booth specifications

• Telephone:178 1035 3883
• Truename:Hu Yilin
• Mobile:178 1035 3883
• E-mail:253476822@qq.com
• Address:No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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